1ST280EU1F50I1VGAS

The 1ST280EU1F50I1VGAS is a Stratix® 10 TX field programmable gate array (FPGA) IC designed for high‑performance, transceiver‑centric systems. It combines Intel HyperFlex® core architecture and 14 nm FinFET silicon with high‑speed, dual‑mode transceivers to address applications that require large logic capacity and multi‑terabit aggregate bandwidth.

With 2,800,000 logic elements, extensive internal RAM, hardened IP blocks and a 2397‑ball FCBGA package, this device targets demanding designs in data center networking, telecommunications infrastructure, and other systems that need high throughput, advanced signal processing and flexible I/O integration.

Key Features

• Core Architecture Intel HyperFlex® core architecture delivering a step‑change in core performance compared to previous generation devices.
• Logic Capacity 2,800,000 logic elements for large, complex FPGA designs.
• On‑chip Memory 240,123,904 total RAM bits and support for internal M20K memory blocks and embedded SRAM options in select devices.
• High‑speed Transceivers Dual‑mode transceivers supporting up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip‑to‑chip, module and backplane links; series devices support up to 144 full‑duplex transceiver channels and multi‑terabit aggregate bandwidth (over 8 Tbps referenced for the family).
• Hardened Interfaces and IP Integrated hard IP including PCI Express Gen3 support and 10/25/100 Gbps Ethernet MAC with dedicated Reed‑Solomon FEC for NRZ and PAM4 signals.
• DSP and Processing Variable precision and hardened floating‑point DSP blocks for signal processing, with an embedded quad‑core 64‑bit Arm Cortex‑A53 hard processor system (HPS) available in select devices.
• Clocking and PLLs Fractional synthesis PLLs and ultra‑low jitter LC tank based transmit PLLs designed for demanding high‑speed serial links.
• Package, I/O and Thermal 2397‑BBGA FCBGA (supplier package 2397‑FBGA, FC 50×50), 440 I/O pins, surface‑mount mounting, industrial operating range −40 °C to 100 °C, and RoHS compliance.
• Power Core voltage supply range specified at 770 mV to 970 mV to support optimized power/performance scaling.

Typical Applications

• Data center networking — High aggregate bandwidth and multi‑rate transceivers enable switching, routing and packet processing functions in hyperscale and enterprise networking equipment.
• Telecommunications infrastructure — Support for PAM4 and NRZ serial links and hardened Ethernet MACs makes the device suitable for line cards, aggregation and backplane applications.
• High‑performance compute and acceleration — Large logic capacity, extensive on‑chip memory and DSP resources support custom accelerators and compute offload engines.
• Storage and I/O adapters — Integrated PCI Express hard IP and high‑speed serial interfaces enable implementation of storage controllers and host adaptor cards.

Unique Advantages

• Highly integrated fabric: Monolithic 14 nm FPGA fabric with millions of logic elements and abundant on‑chip RAM reduces need for external logic and memory.
• Designed for multi‑Tbps systems: Dual‑mode transceivers and family‑level aggregate bandwidth figures provide the headroom required by next‑generation networking and telecom designs.
• Built‑in hardened IP: PCIe Gen3 and 10/25/100 GbE MACs with FEC lower development risk and shorten time to market for I/O‑intensive products.
• Flexible performance scaling: Low‑voltage core range and advanced PLLs enable designers to tune power versus performance for system requirements.
• Industrial temperature range: Specified operation from −40 °C to 100 °C supports deployment in a wide set of environmental conditions.
• Extensive I/O and packaging: 440 I/O pins in a 2397‑ball FCBGA package simplify high‑density board designs and system integration.

Why Choose 1ST280EU1F50I1VGAS?

The 1ST280EU1F50I1VGAS combines a high‑capacity Stratix® 10 TX fabric with advanced transceiver technology and hardened system IP to address designs that require significant logic density, high‑speed serial links and integrated system functionality. Its HyperFlex core architecture and 14 nm implementation support demanding compute and signal processing tasks while providing options for embedded processing in select configurations.

This device is suited for engineers and system architects developing networking, telecom, compute acceleration and storage solutions who need a scalable, high‑bandwidth FPGA platform with comprehensive documentation and device‑level specifications for integration into production systems.

Request a quote or contact sales to discuss availability, pricing, lead times and how the 1ST280EU1F50I1VGAS can fit your next high‑performance design.