1ST280EU1F50E2VG

The 1ST280EU1F50E2VG is a Stratix® 10 TX FPGA implementing Intel's HyperFlex® core architecture for high-performance, power-efficient programmable logic. This device combines a monolithic 14 nm FPGA fabric with advanced, dual-mode high-speed transceivers and hardened protocol IP to address demanding next‑generation designs that require massive logic capacity and multi-terabit bandwidth.

Targeted market segments include high-speed networking, data center and telecom infrastructure, and compute- or I/O‑intensive systems where large on‑chip memory and dense I/O are required. The device is offered in a 2397‑BBGA FCBGA surface‑mount package and is rated extended‑grade for operation from 0 °C to 100 °C.

Key Features

• Core & architecture  Intel HyperFlex® core architecture with a monolithic 14 nm fabric and up to 2,800,000 logic elements for complex, high-performance designs.
• Memory  Total on-chip RAM of 240,123,904 bits; family includes M20K internal SRAM blocks and embedded eSRAM in select devices for large buffering and state storage.
• High‑speed transceivers  Dual‑mode transceivers supporting 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation, with up to 144 full‑duplex transceiver channels and aggregate bandwidth capabilities described in the device family overview.
• Hardened protocol IP  Includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP with Reed‑Solomon FEC options as documented for the Stratix® 10 TX family.
• I/O and package  440 user I/O and a 2397‑BBGA FCBGA package (supplier device package 2397‑FBGA, 50×50); surface mounting for high‑density board integration.
• Power and operating range  Core voltage supply range 770 mV to 970 mV; operating temperature range 0 °C to 100 °C; device grade: Extended. RoHS compliant.
• System features  Family overview documents architecture elements such as fractional synthesis PLLs, internal clocking, configuration and Secure Device Manager (SDM), and partial/dynamic reconfiguration capabilities.

Typical Applications

• High‑speed networking and switching  Leverage multi‑terabit transceiver bandwidth and hardened Ethernet MACs for line cards, switches and high‑density packet processing.
• Data center acceleration  Use large logic capacity and on‑chip memory to implement custom accelerators, packet brokers, and high‑capacity buffering for cloud infrastructure.
• Telecom and transport  Drive backplane and chip‑to‑chip links using PAM4/NRZ capable transceivers and error‑correcting Ethernet MACs for carrier and transport equipment.
• High‑performance signal processing  Combine dense logic and embedded memory blocks with hardened DSP elements (as described for the family) for demanding signal‑processing pipelines.

Unique Advantages

• Massive logic capacity:  2,800,000 logic elements enable large, highly parallel designs without partitioning across multiple FPGAs.
• High aggregate bandwidth:  Dual‑mode transceivers and up to 144 full‑duplex channels support multi‑terabit data paths for system‑level throughput.
• Integrated protocol IP:  Hardened PCIe Gen3 and 10/25/100 GbE MAC implementations reduce development time for common high‑speed interfaces.
• Dense I/O and packaging:  440 I/O pins in a 2397‑BBGA FCBGA package provide high signal density for complex board‑level connectivity.
• Power and thermal predictability:  Documented core voltage range (770 mV–970 mV) and extended‑grade temperature rating (0 °C–100 °C) support controlled power/thermal designs.
• Family‑level innovations:  HyperFlex® core, 14 nm FinFET technology and heterogeneous packaging approaches (as described in the device overview) provide architectural advantages for performance and integration.

Why Choose 1ST280EU1F50E2VG?

The 1ST280EU1F50E2VG brings the Stratix® 10 TX family’s high‑performance HyperFlex® architecture and advanced transceiver capabilities into a single, extended‑grade FCBGA package. Its combination of 2.8 million logic elements, large on‑chip RAM, hardened protocol IP and multi‑mode high‑speed transceivers makes it well suited for applications that demand both massive logic density and multi‑terabit I/O performance.

Design teams building next‑generation networking, telecom, data center or compute‑intensive systems can use this device to consolidate functions, reduce board‑level complexity, and accelerate time‑to‑market while leveraging the documented family features such as secure configuration, fractional PLLs and high‑speed interface IP.

Request a quote or submit a pricing and availability inquiry to get started with the 1ST280EU1F50E2VG for your next high‑performance FPGA design.