1ST280EU1F50I2LG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA

Quantity 1,198 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1ST280EU1F50I2LG – Stratix® 10 TX FPGA, 2,800,000 logic elements, 440 I/Os, 2397-BBGA

The 1ST280EU1F50I2LG is an Intel Stratix® 10 TX field programmable gate array (FPGA) implemented in a 2397-BBGA (FCBGA) package for surface-mount assembly. It integrates a high-performance HyperFlex® core architecture and the Stratix 10 TX device family innovations to address high-bandwidth, compute- and I/O-intensive designs.

Designed for industrial-grade applications, this device provides large programmable capacity, extensive on-chip memory, and a wide operating temperature range, enabling deployment in systems that require significant logic density, throughput and reliability.

Key Features

  • Core Performance — HyperFlex® core architecture delivering a monolithic 14 nm FPGA fabric with up to 2,800,000 logic elements for large-scale logic implementations.
  • On-Chip Memory — Total RAM of 240,123,904 bits to support large buffering, packet processing, and dataflow designs within the FPGA fabric.
  • High-Speed I/O — 440 user I/Os for flexible system interfacing and dense board-level connectivity.
  • Dual-Mode Transceivers — Stratix 10 TX devices feature power-efficient, dual-mode transceivers capable of PAM4 and NRZ operation as described in the Stratix 10 TX overview.
  • Hard IP and DSP — Family-level features include hardened PCI Express Gen3 and high-rate Ethernet MAC and Reed-Solomon FEC IP blocks, plus hardened floating-point and variable precision DSP blocks for compute-intensive signal processing (series-level capability documented in the device overview).
  • Embedded Processing (select devices) — The Stratix 10 TX family includes options with an embedded quad-core 64-bit Arm Cortex-A53 Hard Processor System (HPS) in select devices (series-level feature).
  • Package and Mounting — 2397-BBGA (FCBGA) package (supplier package listed as 2397-FBGA, FC 50×50) with surface-mount mounting type for standard PCB assembly.
  • Power and Temperature — Core supply range listed at 820 mV to 880 mV and qualified for industrial operating temperatures from −40 °C to 100 °C.
  • Regulatory Compliance — RoHS compliant.

Typical Applications

  • High-speed Networking and Telecom — Implement packet-processing engines, line cards and backplane interfaces leveraging the device family’s high-bandwidth transceivers and hardened Ethernet/forward-error-correction IP.
  • Data Center and Acceleration — Large logic capacity and abundant on-chip memory support custom acceleration pipelines, protocol bridging and data-path offload functions.
  • Test, Measurement and Instrumentation — Dense I/O and high-performance DSP resources enable complex real-time signal processing and data capture tasks.
  • Embedded Compute Platforms — Devices in the Stratix 10 TX family with an HPS option provide integrated application-class processing for control and system orchestration alongside FPGA fabric acceleration.

Unique Advantages

  • High Logic Density: 2,800,000 logic elements enable consolidation of multiple functions onto a single FPGA, reducing system BOM and board complexity.
  • Large On-Chip Memory: 240,123,904 bits of RAM support deep buffering and high-throughput data flows without immediate reliance on external memory.
  • Robust Industrial Operation: Industrial-grade temperature range (−40 °C to 100 °C) and surface-mount packaging make the device suitable for demanding environments.
  • Integrated High-Speed I/O: 440 I/Os and series-level dual-mode transceiver capability allow implementation of dense, high-bandwidth interfaces for modern communication systems.
  • Family-Level Hardened IP: Availability of hardened PCI Express, Ethernet MACs with FEC, and DSP blocks at the family level shortens development cycles for common high-performance subsystems.

Why Choose 1ST280EU1F50I2LG?

The 1ST280EU1F50I2LG brings the Stratix 10 TX series’ high-density FPGA fabric and family-level high-speed connectivity into an industrial-grade, surface-mount 2397-BBGA package. Its combination of 2.8 million logic elements, substantial on-chip RAM, extensive I/O and series-documented transceiver and hardened-IP capabilities makes it a strong choice for applications that require scalable logic capacity and high data throughput.

This device is suited for engineering teams building next-generation networking, compute acceleration, and instrument-grade systems that demand both programmable performance and rugged operating range. The Stratix 10 TX family-level features allow designers to leverage hardened IP and architecture innovations when targeting complex, bandwidth-driven designs.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the 1ST280EU1F50I2LG.

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