1ST280EU1F50I2LG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 1,198 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1ST280EU1F50I2LG – Stratix® 10 TX FPGA, 2,800,000 logic elements, 440 I/Os, 2397-BBGA
The 1ST280EU1F50I2LG is an Intel Stratix® 10 TX field programmable gate array (FPGA) implemented in a 2397-BBGA (FCBGA) package for surface-mount assembly. It integrates a high-performance HyperFlex® core architecture and the Stratix 10 TX device family innovations to address high-bandwidth, compute- and I/O-intensive designs.
Designed for industrial-grade applications, this device provides large programmable capacity, extensive on-chip memory, and a wide operating temperature range, enabling deployment in systems that require significant logic density, throughput and reliability.
Key Features
- Core Performance — HyperFlex® core architecture delivering a monolithic 14 nm FPGA fabric with up to 2,800,000 logic elements for large-scale logic implementations.
- On-Chip Memory — Total RAM of 240,123,904 bits to support large buffering, packet processing, and dataflow designs within the FPGA fabric.
- High-Speed I/O — 440 user I/Os for flexible system interfacing and dense board-level connectivity.
- Dual-Mode Transceivers — Stratix 10 TX devices feature power-efficient, dual-mode transceivers capable of PAM4 and NRZ operation as described in the Stratix 10 TX overview.
- Hard IP and DSP — Family-level features include hardened PCI Express Gen3 and high-rate Ethernet MAC and Reed-Solomon FEC IP blocks, plus hardened floating-point and variable precision DSP blocks for compute-intensive signal processing (series-level capability documented in the device overview).
- Embedded Processing (select devices) — The Stratix 10 TX family includes options with an embedded quad-core 64-bit Arm Cortex-A53 Hard Processor System (HPS) in select devices (series-level feature).
- Package and Mounting — 2397-BBGA (FCBGA) package (supplier package listed as 2397-FBGA, FC 50×50) with surface-mount mounting type for standard PCB assembly.
- Power and Temperature — Core supply range listed at 820 mV to 880 mV and qualified for industrial operating temperatures from −40 °C to 100 °C.
- Regulatory Compliance — RoHS compliant.
Typical Applications
- High-speed Networking and Telecom — Implement packet-processing engines, line cards and backplane interfaces leveraging the device family’s high-bandwidth transceivers and hardened Ethernet/forward-error-correction IP.
- Data Center and Acceleration — Large logic capacity and abundant on-chip memory support custom acceleration pipelines, protocol bridging and data-path offload functions.
- Test, Measurement and Instrumentation — Dense I/O and high-performance DSP resources enable complex real-time signal processing and data capture tasks.
- Embedded Compute Platforms — Devices in the Stratix 10 TX family with an HPS option provide integrated application-class processing for control and system orchestration alongside FPGA fabric acceleration.
Unique Advantages
- High Logic Density: 2,800,000 logic elements enable consolidation of multiple functions onto a single FPGA, reducing system BOM and board complexity.
- Large On-Chip Memory: 240,123,904 bits of RAM support deep buffering and high-throughput data flows without immediate reliance on external memory.
- Robust Industrial Operation: Industrial-grade temperature range (−40 °C to 100 °C) and surface-mount packaging make the device suitable for demanding environments.
- Integrated High-Speed I/O: 440 I/Os and series-level dual-mode transceiver capability allow implementation of dense, high-bandwidth interfaces for modern communication systems.
- Family-Level Hardened IP: Availability of hardened PCI Express, Ethernet MACs with FEC, and DSP blocks at the family level shortens development cycles for common high-performance subsystems.
Why Choose 1ST280EU1F50I2LG?
The 1ST280EU1F50I2LG brings the Stratix 10 TX series’ high-density FPGA fabric and family-level high-speed connectivity into an industrial-grade, surface-mount 2397-BBGA package. Its combination of 2.8 million logic elements, substantial on-chip RAM, extensive I/O and series-documented transceiver and hardened-IP capabilities makes it a strong choice for applications that require scalable logic capacity and high data throughput.
This device is suited for engineering teams building next-generation networking, compute acceleration, and instrument-grade systems that demand both programmable performance and rugged operating range. The Stratix 10 TX family-level features allow designers to leverage hardened IP and architecture innovations when targeting complex, bandwidth-driven designs.
Request a quote or submit a procurement inquiry to receive pricing and availability information for the 1ST280EU1F50I2LG.

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