1ST280EU1F50E2LG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA

Quantity 878 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1ST280EU1F50E2LG – Stratix® 10 TX FPGA, 2,800,000 logic elements, 2397-BBGA

The 1ST280EU1F50E2LG is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 2397-BBGA FCBGA package. It combines a high-performance HyperFlex® core architecture and a large programmable fabric—2,800,000 logic elements—with extensive I/O and on-chip memory to address high-bandwidth datacenter, networking and compute-acceleration applications.

Designed for systems-level integration, the device pairs high logic density and 440 device I/Os with advanced transceiver and hardened IP capabilities from the Stratix 10 TX family, providing the bandwidth and integration needed for demanding communication and processing designs.

Key Features

  • Core Architecture  Intel HyperFlex® core architecture with a monolithic fabric offering 2,800,000 logic elements for large-scale logic implementation and complex system designs.
  • Memory  Total on-chip RAM of 240,123,904 bits to support deep buffering, large lookup tables and memory-intensive DSP/dataflow operations.
  • I/O and Transceivers  440 device I/Os and Stratix 10 TX family dual-mode transceiver capabilities (PAM4 and NRZ modes reported for the family) to support high-speed serial protocols and multi-gigabit interconnects.
  • Hardened IP and Bandwidth  Stratix 10 TX family features hardened PCIe Gen3 and multi-rate Ethernet MAC IP blocks and family-level aggregate bandwidth capabilities—suitable where hardened protocol engines are required.
  • Power and Supply  Core voltage supply range listed at 820 mV to 880 mV for the device core power domain.
  • Package and Mounting  Surface-mount BGA package: 2397-BBGA, FCBGA. Supplier device package listed as 2397-FBGA, FC (50x50), enabling compact, high-density PCB integration.
  • Operating Conditions  Extended-grade device with an operating temperature range of 0 °C to 100 °C for deployment in temperature-controlled systems.
  • Reliability and Security (Family Capabilities)  Stratix 10 TX family documentation includes device configuration, secure device manager features and single-event upset (SEU) mitigation techniques to support robust system designs.

Typical Applications

  • High-Speed Networking  Use in data center switch and router line cards where large programmable logic, hardened Ethernet MACs and high I/O density enable flexible packet processing and protocol offload.
  • Telecommunications & Optical Transport  Suitable for multi-protocol aggregation and transport systems leveraging the family’s dual-mode transceiver capabilities and high aggregate bandwidth.
  • Compute Acceleration  Deployment as an FPGA accelerator for compute and packet-processing workloads that require large on-chip memory and extensive logic resources.
  • Test & Measurement  High-density logic and deterministic I/O make the device useful for instrumentation, protocol analyzers and high-speed data-capture systems.

Unique Advantages

  • Massive Logic Capacity:  2,800,000 logic elements provide the scale to implement complex SoC-level designs and large custom accelerators in a single device.
  • Large On‑Chip Memory:  240,123,904 total RAM bits reduce external memory dependency and accelerate data-path buffering and stateful processing.
  • High I/O Count:  440 device I/Os support dense system interfaces and flexible board-level connectivity without excessive external multiplexing.
  • System Integration-Ready Package:  2397-BBGA FCBGA packaging and surface-mount mounting enable compact, production-friendly integration on high-density PCBs.
  • Designed for High-Bandwidth Systems:  Family-level hardened IP and transceiver technology support multi-protocol high-speed links for networking and communication systems.
  • Extended-Grade Qualification:  Rated for 0 °C to 100 °C operation to match deployment in controlled-environment telecom and datacenter equipment.

Why Choose 1ST280EU1F50E2LG?

The 1ST280EU1F50E2LG delivers a combination of very high logic density, large on-chip memory and extensive I/O in a production-ready BGA package. Its placement in the Stratix 10 TX family means access to hyper-efficient core architecture and family-level hardened transceiver and protocol IP that accelerate time-to-market for networking, telecom and compute-acceleration systems.

This device is suited for engineering teams building high-bandwidth, tightly integrated systems that require scalable programmable logic, robust on-chip memory resources and a compact package for dense PCBs. The extended-grade operating range and supplier package information support confident system-level planning and PCB integration.

If you would like pricing, availability or to request a quote for 1ST280EU1F50E2LG, submit an inquiry to our sales team and include your quantity, target application and any special packaging or delivery requirements.

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