1ST280EU1F50E2LG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 878 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1ST280EU1F50E2LG – Stratix® 10 TX FPGA, 2,800,000 logic elements, 2397-BBGA
The 1ST280EU1F50E2LG is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 2397-BBGA FCBGA package. It combines a high-performance HyperFlex® core architecture and a large programmable fabric—2,800,000 logic elements—with extensive I/O and on-chip memory to address high-bandwidth datacenter, networking and compute-acceleration applications.
Designed for systems-level integration, the device pairs high logic density and 440 device I/Os with advanced transceiver and hardened IP capabilities from the Stratix 10 TX family, providing the bandwidth and integration needed for demanding communication and processing designs.
Key Features
- Core Architecture Intel HyperFlex® core architecture with a monolithic fabric offering 2,800,000 logic elements for large-scale logic implementation and complex system designs.
- Memory Total on-chip RAM of 240,123,904 bits to support deep buffering, large lookup tables and memory-intensive DSP/dataflow operations.
- I/O and Transceivers 440 device I/Os and Stratix 10 TX family dual-mode transceiver capabilities (PAM4 and NRZ modes reported for the family) to support high-speed serial protocols and multi-gigabit interconnects.
- Hardened IP and Bandwidth Stratix 10 TX family features hardened PCIe Gen3 and multi-rate Ethernet MAC IP blocks and family-level aggregate bandwidth capabilities—suitable where hardened protocol engines are required.
- Power and Supply Core voltage supply range listed at 820 mV to 880 mV for the device core power domain.
- Package and Mounting Surface-mount BGA package: 2397-BBGA, FCBGA. Supplier device package listed as 2397-FBGA, FC (50x50), enabling compact, high-density PCB integration.
- Operating Conditions Extended-grade device with an operating temperature range of 0 °C to 100 °C for deployment in temperature-controlled systems.
- Reliability and Security (Family Capabilities) Stratix 10 TX family documentation includes device configuration, secure device manager features and single-event upset (SEU) mitigation techniques to support robust system designs.
Typical Applications
- High-Speed Networking Use in data center switch and router line cards where large programmable logic, hardened Ethernet MACs and high I/O density enable flexible packet processing and protocol offload.
- Telecommunications & Optical Transport Suitable for multi-protocol aggregation and transport systems leveraging the family’s dual-mode transceiver capabilities and high aggregate bandwidth.
- Compute Acceleration Deployment as an FPGA accelerator for compute and packet-processing workloads that require large on-chip memory and extensive logic resources.
- Test & Measurement High-density logic and deterministic I/O make the device useful for instrumentation, protocol analyzers and high-speed data-capture systems.
Unique Advantages
- Massive Logic Capacity: 2,800,000 logic elements provide the scale to implement complex SoC-level designs and large custom accelerators in a single device.
- Large On‑Chip Memory: 240,123,904 total RAM bits reduce external memory dependency and accelerate data-path buffering and stateful processing.
- High I/O Count: 440 device I/Os support dense system interfaces and flexible board-level connectivity without excessive external multiplexing.
- System Integration-Ready Package: 2397-BBGA FCBGA packaging and surface-mount mounting enable compact, production-friendly integration on high-density PCBs.
- Designed for High-Bandwidth Systems: Family-level hardened IP and transceiver technology support multi-protocol high-speed links for networking and communication systems.
- Extended-Grade Qualification: Rated for 0 °C to 100 °C operation to match deployment in controlled-environment telecom and datacenter equipment.
Why Choose 1ST280EU1F50E2LG?
The 1ST280EU1F50E2LG delivers a combination of very high logic density, large on-chip memory and extensive I/O in a production-ready BGA package. Its placement in the Stratix 10 TX family means access to hyper-efficient core architecture and family-level hardened transceiver and protocol IP that accelerate time-to-market for networking, telecom and compute-acceleration systems.
This device is suited for engineering teams building high-bandwidth, tightly integrated systems that require scalable programmable logic, robust on-chip memory resources and a compact package for dense PCBs. The extended-grade operating range and supplier package information support confident system-level planning and PCB integration.
If you would like pricing, availability or to request a quote for 1ST280EU1F50E2LG, submit an inquiry to our sales team and include your quantity, target application and any special packaging or delivery requirements.

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