1ST250EY3F55I3XG

The 1ST250EY3F55I3XG is an Intel Stratix® 10 TX series field programmable gate array (FPGA) supplied in a 2912-ball FCBGA package. It delivers high on-chip capacity with 2,500,000 logic elements and 204,472,320 total RAM bits, targeting dense, high-bandwidth designs in industrial environments.

Built on the Stratix 10 TX device platform, the family incorporates the HyperFlex core architecture and advanced packaging innovations to address next-generation transceiver bandwidth and power requirements, while offering robust I/O capability and industrial temperature operation.

Key Features

• Core capacity – 2,500,000 logic elements provide extensive programmable fabric for complex logic, state machines, and custom accelerators.
• On-chip memory – 204,472,320 total RAM bits support large on-chip datasets, buffering, and memory-intensive functions.
• I/O and packaging – 296 I/O pins in a 2912-BBGA (2912-FBGA, FC 55×55) surface-mount package support wide external connectivity and dense board integration.
• Transceiver and interface capabilities (family) – Stratix 10 TX devices feature dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ, and hardened IP such as PCI Express Gen3 and 10/25/100 Gbps Ethernet MACs, addressing high-bandwidth link requirements.
• Power envelope – Core voltage supply range of 820 mV to 880 mV enabling low-voltage operation for the programmable fabric.
• Thermal and grade – Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in extended-temperature applications.
• Standards and compliance – RoHS compliant, meeting common environmental substance requirements for electronics manufacturing.

Typical Applications

• High-speed networking and backplane systems – Dual-mode transceiver support and high logic/memory capacity enable packet processing, line-rate switching, and backplane connectivity.
• PCI Express host and adapter cards – Hardened PCIe Gen3 IP in the Stratix 10 TX family paired with large FPGA capacity supports high-throughput I/O and protocol offload tasks.
• Communication line cards and transceiver modules – High-data-rate PAM4/NRZ transceiver capability and extensive on-chip RAM make the device suitable for FEC, framing, and serialization functions in telecom modules.
• Compute accelerators and data-path engines – Large logic and memory resources provide room for custom datapaths, buffering, and hardware acceleration in industrial compute subsystems.

Unique Advantages

• High integration density: 2,500,000 logic elements plus 204,472,320 RAM bits reduce the need for external logic and memory, simplifying system BOM and board routing.
• Broad, high-speed I/O: 296 I/O pins and Stratix 10 TX transceiver technology support a wide range of high-bandwidth external interfaces and board-level connectivity.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C enables reliable use in extended-temperature industrial environments.
• Low-voltage core operation: 820–880 mV supply range helps contain core power consumption while supporting large FPGA fabric performance.
• Advanced packaging platform (family): The Stratix 10 TX platform uses heterogeneous 3D SiP and EMIB-style packaging innovations to deliver high-density transceiver and fabric integration.

Why Choose 1ST250EY3F55I3XG?

The 1ST250EY3F55I3XG combines very large programmable fabric capacity with substantial on-chip memory and extensive I/O in a compact 2912-ball FCBGA package, making it suited for engineers designing high-bandwidth, logic-dense industrial systems. Its Stratix 10 TX family foundation provides access to high-speed transceiver operation modes and hardened interface IP to accelerate time-to-market for demanding communication and compute applications.

For teams requiring scalability, industrial temperature operation, and a low-voltage core envelope, this device provides a platform-level balance of capacity, connectivity, and environmental robustness backed by Intel’s Stratix 10 TX device family specifications.

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