1ST250EY2F55I2VG

The 1ST250EY2F55I2VG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) in a 2912‑BBGA FCBGA package designed for industrial-grade, high-performance designs. It combines a high-density fabric with Intel HyperFlex® core architecture and family-level support for dual-mode high-speed transceivers, delivering a platform optimized for bandwidth‑intensive communications, compute acceleration, and advanced networking applications.

With 2,500,000 logic elements, more than 204 million bits of on-chip RAM, and 296 I/Os, this device targets systems that require large programmable logic capacity, substantial on-chip memory, and high I/O and transceiver bandwidth within a surface-mount BGA package.

Key Features

• High-density logic — 2,500,000 logic elements provide large programmable fabric capacity for complex logic and algorithm implementations.
• Intel HyperFlex® core architecture — Family documentation highlights the HyperFlex architecture designed to increase core performance compared to previous generations.
• Dual‑mode high-speed transceivers — Family-level transceiver capability supports both 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip-to-chip, chip-to-module, and backplane applications.
• Large on-chip memory — 204,472,320 total RAM bits available for buffering, packet processing, and algorithm storage.
• Rich I/O and package — 296 I/Os in a 2912‑BBGA (FCBGA) package; supplier package specified as 2912‑FBGA, FC (55×55). Surface-mount mounting type.
• Industrial temperature range — Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Low-voltage core supply — Core voltage specified between 770 mV and 970 mV.
• Compliance and manufacturability — RoHS compliant and available in a high‑pin‑count BGA suitable for production assembly.
• Family-level hardened IP — Documentation for the Stratix 10 TX family references hardened PCIe Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks and other hardened functions (family-level capability).

Typical Applications

• Data center networking — High logic density, large on-chip RAM, and high-speed dual‑mode transceivers enable packet processing, switching, and aggregation functions for top-of-rack and spine designs.
• Telecom and transport equipment — Support for PAM4 and NRZ transceiver modes and family-level Ethernet/PCIe hard IP make the device suitable for line cards, fronthaul/backhaul, and transport systems.
• High-performance compute acceleration — Large FPGA fabric and memory complement hardware acceleration of compute kernels, packet inspection, and real‑time processing tasks.
• Chip‑to‑chip and module interfaces — Dual-mode transceivers and high I/O count support high-bandwidth chip-to-chip and chip-to-module interconnects in advanced systems.

Unique Advantages

• Substantial programmable capacity: 2,500,000 logic elements let designers map large, complex designs without immediate partitioning across devices.
• High aggregate bandwidth potential: Family transceiver capabilities (PAM4 and NRZ) and hardened networking IP enable deployment in bandwidth‑intensive systems.
• Significant on‑chip RAM: 204,472,320 bits of RAM reduce external memory dependence for many buffering and processing tasks.
• Industrial readiness: −40 °C to 100 °C operating range and RoHS compliance address demanding environmental and regulatory requirements.
• Compact, production-ready package: 2912‑BBGA (55×55) surface-mount package supports high-pin-count routing in space-constrained board designs.
• Optimized power domain: Core supply specified at 770–970 mV supports designs targeting modern low-voltage FPGA power architectures.

Why Choose 1ST250EY2F55I2VG?

The 1ST250EY2F55I2VG combines a very large logic element count with extensive on-chip memory and high I/O density in an industrial‑grade Stratix 10 TX device. It is positioned for systems that need high programmable capacity, advanced transceiver flexibility, and robust thermal performance in a single, surface‑mount BGA package.

This device is suitable for engineering teams building high-bandwidth networking, telecom infrastructure, and compute‑acceleration solutions that require scalable FPGA resources, significant on-chip memory, and family-level hardened IP capabilities. Its combination of logic density, memory, I/O count, and industrial operating range supports long-term deployment and integration into complex systems.

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