1ST250EY2F55I2LG

The 1ST250EY2F55I2LG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC in a 2912-BBGA, FCBGA package. It combines high logic density with a broad set of system-level capabilities for high-bandwidth, compute‑intensive applications.

Built for industrial operating ranges and high-speed system integration, this device targets designs that require large programmable fabric, extensive on-chip RAM, and high I/O count to support networking, data center, and communications infrastructure.

Key Features

• Core and Logic 2,500,000 logic elements provide substantial programmable resources for complex FPGA designs; the device implements Intel Hyperflex core architecture as described for Stratix 10 TX devices.
• Memory Total on-chip RAM of 204,472,320 bits for large buffering, packet processing, and data staging.
• High-speed I/O 296 I/O pins to support broad external connectivity and high-bandwidth interfaces.
• Transceiver and Bandwidth Technology Stratix 10 TX family devices feature dual‑mode transceiver technology (PAM4 and NRZ) and multi-channel transceiver tiles as described in the Stratix 10 TX overview.
• Embedded Processing and IP Family features include hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks; select family members include an embedded quad-core 64-bit Arm Cortex‑A53 HPS.
• Clocking and PLLs Fractional synthesis and low-jitter transmit PLLs are part of the device architecture described for Stratix 10 TX devices.
• Package and Mounting Supplier device package 2912-FBGA, FC (55×55); surface-mount mounting type in a 2912-BBGA, FCBGA package case.
• Power and Temperature Core voltage supply range 820 mV to 880 mV; industrial operating temperature range −40 °C to 100 °C.
• Regulatory RoHS compliant.

Typical Applications

• High‑performance Networking Programmable switching, line-rate packet processing, and Ethernet/IP offload using the device’s high logic capacity and on-chip RAM.
• Data Center and Compute Acceleration FPGA-based accelerators and PCIe-attached compute modules leveraging hardened PCIe IP and large programmable fabric.
• Telecommunications and Optical Transport Backplane and board-level designs requiring high-speed transceivers and advanced FEC/IP blocks for reliable data transport.
• Test & Measurement High-throughput data capture, protocol analysis, and custom signal processing where large RAM and dense logic are required.

Unique Advantages

• High Logic Density: 2.5 million logic elements enable integration of complex algorithms and multiple functions in a single device, reducing board-level BOM.
• Extensive On-chip Memory: Over 204 million bits of RAM support large buffers, packet queues, and on-device data processing without immediate external memory dependence.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation to meet industrial deployment requirements.
• Robust Packaging: 2912-FBGA (55×55) flip‑chip BGA package supports dense I/O and reliable board integration in surface-mount assemblies.
• Family-level High-bandwidth Features: Stratix 10 TX architecture provides dual‑mode transceivers and hardened networking and PCIe IP, enabling integration of high-bandwidth system functions.
• Low-voltage Core: Narrow core supply window (820–880 mV) supports controlled power delivery and system-level power planning.

Why Choose 1ST250EY2F55I2LG?

This Stratix 10 TX device is positioned for designs that demand a combination of very high programmable logic capacity, significant on‑chip RAM, and broad I/O capability within an industrial operating range. Its integration of Stratix 10 TX family innovations—such as Hyperflex core architecture, high-speed transceiver technology, and hardened system IP—makes it suitable for high-bandwidth networking, data center acceleration, and telecom equipment.

Choosing 1ST250EY2F55I2LG provides a scalable, high-density FPGA platform that supports complex signal processing and system integration while meeting industrial temperature and RoHS requirements.

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