1ST250EY2F55E2VG

The 1ST250EY2F55E2VG is an Intel Stratix® 10 TX field-programmable gate array in a 2912-BBGA surface-mount package. It integrates a high-density monolithic core fabric with 2,500,000 logic elements and large on-chip RAM, targeting high-bandwidth compute, networking and communications designs.

Built on the Stratix 10 TX architecture, the device includes HyperFlex core innovations and high-speed dual-mode transceivers, providing a combination of performance, integration and transceiver bandwidth for demanding system-level applications.

Key Features

• Core Performance  2,500,000 logic elements implemented in the Stratix 10 TX HyperFlex architecture to support complex programmable logic and compute tasks.
• On-chip Memory  Total RAM capacity of 204,472,320 bits to support large buffers, on-chip data storage and high-throughput processing.
• High-speed Transceivers & Bandwidth  Stratix 10 TX dual-mode transceivers support 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation; family devices can deliver over 8 Tbps of aggregate transceiver bandwidth.
• Hard IP and Protocols  Family-level support includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC with Reed-Solomon FEC, easing implementation of common high-speed interfaces.
• DSP & Processing  Variable-precision and hardened floating-point DSP capabilities and, in select devices, an embedded quad-core 64-bit Arm Cortex-A53 hard processor system (HPS) for application-class processing.
• Clocking and PLLs  Fractional synthesis and ultra-low jitter LC tank based transmit PLLs for precise timing and low-jitter high-speed links.
• I/O and Package  296 I/O pins in a 2912-BBGA (2912-FBGA, FC 55×55) package; surface-mount mounting for board-level integration.
• Power and Thermal  Core voltage supply range 770 mV to 970 mV; operating temperature range 0 °C to 100 °C; device grade: Extended.
• Compliance  RoHS compliant.

Typical Applications

• Data Center Networking  High aggregate transceiver bandwidth and hardened Ethernet/PCIe IP make this device suitable for switches, routers and NIC offload functions.
• Telecom & Backplane Systems  Dual-mode high-speed transceivers and large on-chip RAM support chip-to-chip, module and backplane links in telecom infrastructure.
• High-performance Acceleration  Dense logic resources, DSP blocks and optional HPS enable hardware acceleration for compute-heavy workloads and packet processing.
• Test & Measurement  High-speed I/O, precise PLLs and large memory allow implementation of high-bandwidth signal capture and real-time analysis systems.

Unique Advantages

• High logic density: 2,500,000 logic elements support large, complex designs without splitting logic across multiple devices.
• Exceptional on-chip RAM: 204,472,320 total RAM bits reduce reliance on external memory for many buffering and processing tasks.
• Multi-rate transceivers: Dual-mode transceivers (PAM4/NRZ) and family-level aggregate bandwidth targets simplify design of scalable high-speed links.
• Integrated protocol IP: Hardened PCIe Gen3 and Ethernet MAC blocks accelerate system integration and reduce IP development effort.
• Robust packaging and I/O: 2912-BBGA footprint with 296 I/Os and surface-mount mounting supports dense board-level integration in space-constrained systems.
• Extended operating range: 0 °C to 100 °C operating range and RoHS compliance provide predictable behavior for a wide range of deployments.

Why Choose 1ST250EY2F55E2VG?

The 1ST250EY2F55E2VG combines a high-density Stratix 10 TX fabric with substantial on-chip memory and advanced transceiver technology to address designs that require both massive logic capacity and high I/O bandwidth. Its combination of HyperFlex architecture features, hardened protocol IP (family-level), and support for high-speed serial links makes it well suited for networking, telecom, acceleration and high-performance systems.

For engineers who need a scalable, high-performance FPGA with extensive on-chip resources and advanced transceiver capability, this device provides a compact package option (2912-BBGA) and operational specifications that support integration into next-generation systems while remaining RoHS compliant.

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