1ST250EY2F55I1VG

The 1ST250EY2F55I1VG is a Stratix® 10 TX field programmable gate array (FPGA) in a 2912-BBGA (55×55 mm) surface-mount package, offered in an industrial grade. It provides 2,500,000 logic elements, 296 I/Os, and 204,472,320 total RAM bits, suited for designs that require high logic density and large on-chip memory.

As a member of the Stratix 10 TX family, this device leverages the HyperFlex core architecture and high-speed dual-mode transceivers capable of PAM4 and NRZ operation. Family-level features include hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP, enabling high-bandwidth, power-conscious implementations for next-generation communication and compute applications.

Key Features

• Core Architecture  HyperFlex core architecture (Stratix 10 TX family) for improved core performance as described in the device overview.
• Logic Capacity  2,500,000 logic elements provide substantial programmable resources for large-scale logic and control implementations.
• On‑Chip Memory  204,472,320 total RAM bits to support large buffering, state storage, and memory-intensive functions.
• High‑Speed Transceivers  Dual-mode transceivers supporting PAM4 and NRZ operation as documented for Stratix 10 TX devices, suitable for chip-to-chip, chip-to-module, and backplane interfaces.
• Hardened IP Blocks  Family-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC with Reed‑Solomon FEC options.
• I/O and Package  296 I/O pins in a 2912-BBGA (2912-FBGA, FC 55×55) package; surface-mount design for compact board-level integration.
• Power and Voltage  Supported core supply range of 770 mV to 970 mV for the device as specified.
• Operating Environment  Industrial-grade device with an operating temperature range of −40°C to 100°C.

Typical Applications

• Backplane and Module Interconnects  Dual-mode transceivers and high I/O count support chip-to-chip, chip-to-module, and backplane signal architectures.
• High-Bandwidth Networking  Hardened 10/25/100 Gbps Ethernet MAC IP and high transceiver bandwidth address demanding network aggregation and switching tasks.
• High-Performance Compute Acceleration  Large logic element count and extensive on-chip RAM enable complex custom accelerators and dataplane processing.
• Telecom and Carrier Systems  Designed to meet transceiver bandwidth and power budget requirements of next-generation telecom equipment.

Unique Advantages

• High Logic Density: 2,500,000 logic elements allow consolidation of large designs onto a single FPGA, reducing board-level complexity.
• Substantial On‑Chip Memory: Over 204 million bits of RAM provide deep buffering and local storage for data‑intensive functions.
• Flexible High‑Speed I/O: Dual-mode PAM4/NRZ transceivers and 296 I/Os support diverse high-speed interfaces and system topologies.
• Industrial Reliability: Specified for −40°C to 100°C operation to meet industrial environmental ranges.
• Compact, Surface‑Mount Package: 2912-BBGA (55×55 mm) package delivers high integration density for space-constrained board designs.
• Power-Targeted Operation: Core supply range of 770 mV to 970 mV supports integration into power-optimized systems.

Why Choose 1ST250EY2F55I1VG?

The 1ST250EY2F55I1VG positions itself as a high-capacity Stratix 10 TX FPGA option for systems requiring extensive programmable logic, large on-chip memory, and high-speed transceiver capability in a compact surface-mount package. Its combination of 2.5 million logic elements, significant RAM resources, and family-level hardened IP makes it suitable for demanding communications, networking, and compute acceleration designs.

For engineering teams building next-generation high-bandwidth systems, this device offers scalable programmable capacity and integration options aligned with Stratix 10 TX family innovations, helping reduce system complexity while addressing stringent performance and environmental requirements.

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