1ST250EY1F55I2VGAS

IC FPGA 296 I/O 2912BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2500000 2912-BBGA, FCBGA

Quantity 733 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA, FC (55x55)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O296Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1ST250EY1F55I2VGAS – Stratix® 10 TX FPGA, 2912-BBGA (FCBGA)

The 1ST250EY1F55I2VGAS is an Intel Stratix® 10 TX field programmable gate array supplied in a 2912-BBGA FCBGA package. It combines a high-density FPGA fabric with advanced, dual-mode high-speed transceivers and hardened IP blocks, targeting high-bandwidth communications, data center, and network infrastructure designs.

Built on the Stratix 10 TX family architecture, this device offers large on-chip memory, 2,500,000 logic elements, and a range of system-level features that emphasize integration, transceiver performance, and industrial temperature operation.

Key Features

  • Logic Capacity  2,500,000 logic elements for dense, complex FPGA implementations.
  • On-chip Memory  204,472,320 total RAM bits to support large buffering and state storage.
  • I/O and Packaging  296 I/O pins in a surface-mount 2912-BBGA (FCBGA) package; supplier device package specified as 2912-FBGA, FC (55×55).
  • High-speed Transceivers  Stratix 10 TX series transceivers support dual-mode operation (57.8 Gbps PAM4 and 28.9 Gbps NRZ) with up to 144 full-duplex channels and aggregate bandwidth exceeding 8 Tbps.
  • Hardened System IP  Devices in the Stratix 10 TX family include hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks with Reed-Solomon FEC for NRZ and PAM4 signals.
  • Core Architecture  Intel HyperFlex® core architecture and 14 nm tri-gate (FinFET) process technology, delivering the series' stated core-performance improvements.
  • Power and Operating Range  Core supply range 770 mV to 970 mV; industrial operating temperature range −40 °C to 100 °C.
  • Standards and Compliance  RoHS compliant and provided as a surface-mount FCBGA package for system-level assembly.

Typical Applications

  • High-Speed Networking  Use in switch, router, and line-card designs that require multi-terabit aggregate bandwidth and PAM4/NRZ transceiver support.
  • Data Center Interconnect  Implements high-density packet processing, traffic management, and protocol offload with large on-chip memory and hardened Ethernet/IP blocks.
  • Telecommunications Infrastructure  Deployment in backplane and chip-to-module applications leveraging up to 144 full-duplex transceiver channels and hardened FEC-capable MACs.
  • Compute and Acceleration  FPGA fabric and abundant RAM make this device suitable for custom acceleration, DSP pipelines, and large logic implementations.

Unique Advantages

  • High Logic Density: 2.5 million logic elements provide headroom for complex algorithms and large-scale designs without partitioning across multiple devices.
  • Massive On-Chip Memory: Over 204 million bits of RAM enable deep buffering, large state machines, and high-throughput data paths.
  • Advanced Transceiver Capability: Dual-mode PAM4/NRZ transceivers and high aggregate bandwidth simplify high-speed link design and support evolving serial standards.
  • Hardened Interface IP: Integrated PCIe Gen3 and multi-rate Ethernet MACs reduce system-level external IP burden and lower integration risk.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-sensitive industrial environments.
  • Compact FCBGA Packaging: 2912-ball FCBGA with surface-mount assembly supports high-density board layouts and standard manufacturing flows.

Why Choose 1ST250EY1F55I2VGAS?

This Stratix 10 TX device positions itself for demanding, high-bandwidth applications where large logic capacity, substantial on-chip memory, and robust transceiver performance are required. Its combination of HyperFlex architecture attributes, hardened system IP, and industrial temperature rating makes it a strong choice for communications, data center, and compute-acceleration designs that need integrated performance and system-level features.

Designed as part of the Intel Stratix 10 TX family, the 1ST250EY1F55I2VGAS delivers a scalable platform for engineers who require dense FPGA fabric, advanced serial links, and the packaging options necessary for high-density board integration.

Request a quote or submit an inquiry to obtain pricing, availability, and integration support for the 1ST250EY1F55I2VGAS.

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