1ST250EY1F55I2VGAS
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2500000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 733 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA, FC (55x55) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 296 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1ST250EY1F55I2VGAS – Stratix® 10 TX FPGA, 2912-BBGA (FCBGA)
The 1ST250EY1F55I2VGAS is an Intel Stratix® 10 TX field programmable gate array supplied in a 2912-BBGA FCBGA package. It combines a high-density FPGA fabric with advanced, dual-mode high-speed transceivers and hardened IP blocks, targeting high-bandwidth communications, data center, and network infrastructure designs.
Built on the Stratix 10 TX family architecture, this device offers large on-chip memory, 2,500,000 logic elements, and a range of system-level features that emphasize integration, transceiver performance, and industrial temperature operation.
Key Features
- Logic Capacity 2,500,000 logic elements for dense, complex FPGA implementations.
- On-chip Memory 204,472,320 total RAM bits to support large buffering and state storage.
- I/O and Packaging 296 I/O pins in a surface-mount 2912-BBGA (FCBGA) package; supplier device package specified as 2912-FBGA, FC (55×55).
- High-speed Transceivers Stratix 10 TX series transceivers support dual-mode operation (57.8 Gbps PAM4 and 28.9 Gbps NRZ) with up to 144 full-duplex channels and aggregate bandwidth exceeding 8 Tbps.
- Hardened System IP Devices in the Stratix 10 TX family include hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks with Reed-Solomon FEC for NRZ and PAM4 signals.
- Core Architecture Intel HyperFlex® core architecture and 14 nm tri-gate (FinFET) process technology, delivering the series' stated core-performance improvements.
- Power and Operating Range Core supply range 770 mV to 970 mV; industrial operating temperature range −40 °C to 100 °C.
- Standards and Compliance RoHS compliant and provided as a surface-mount FCBGA package for system-level assembly.
Typical Applications
- High-Speed Networking Use in switch, router, and line-card designs that require multi-terabit aggregate bandwidth and PAM4/NRZ transceiver support.
- Data Center Interconnect Implements high-density packet processing, traffic management, and protocol offload with large on-chip memory and hardened Ethernet/IP blocks.
- Telecommunications Infrastructure Deployment in backplane and chip-to-module applications leveraging up to 144 full-duplex transceiver channels and hardened FEC-capable MACs.
- Compute and Acceleration FPGA fabric and abundant RAM make this device suitable for custom acceleration, DSP pipelines, and large logic implementations.
Unique Advantages
- High Logic Density: 2.5 million logic elements provide headroom for complex algorithms and large-scale designs without partitioning across multiple devices.
- Massive On-Chip Memory: Over 204 million bits of RAM enable deep buffering, large state machines, and high-throughput data paths.
- Advanced Transceiver Capability: Dual-mode PAM4/NRZ transceivers and high aggregate bandwidth simplify high-speed link design and support evolving serial standards.
- Hardened Interface IP: Integrated PCIe Gen3 and multi-rate Ethernet MACs reduce system-level external IP burden and lower integration risk.
- Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-sensitive industrial environments.
- Compact FCBGA Packaging: 2912-ball FCBGA with surface-mount assembly supports high-density board layouts and standard manufacturing flows.
Why Choose 1ST250EY1F55I2VGAS?
This Stratix 10 TX device positions itself for demanding, high-bandwidth applications where large logic capacity, substantial on-chip memory, and robust transceiver performance are required. Its combination of HyperFlex architecture attributes, hardened system IP, and industrial temperature rating makes it a strong choice for communications, data center, and compute-acceleration designs that need integrated performance and system-level features.
Designed as part of the Intel Stratix 10 TX family, the 1ST250EY1F55I2VGAS delivers a scalable platform for engineers who require dense FPGA fabric, advanced serial links, and the packaging options necessary for high-density board integration.
Request a quote or submit an inquiry to obtain pricing, availability, and integration support for the 1ST250EY1F55I2VGAS.

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