1ST250EY1F55E2VG

IC FPGA 296 I/O 2912BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2500000 2912-BBGA, FCBGA

Quantity 1,474 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA, FC (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O296Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1ST250EY1F55E2VG – Stratix® 10 TX FPGA, 2912-BBGA

The 1ST250EY1F55E2VG is a Stratix® 10 TX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package, offering very high logic density and on-chip memory for complex system designs. It combines a large fabric of logic elements and extensive embedded RAM with a high count of I/O to address demanding applications that require substantial compute, memory and I/O bandwidth.

Built for designs that need scalable logic, wide external connectivity and power-efficient core operation, this device is specified for an operating range of 0 °C to 100 °C with a supply voltage window of 770 mV to 970 mV and is RoHS compliant.

Key Features

  • High-density logic — 2,500,000 logic elements to support large-scale logic integration and complex programmable architectures.
  • Large embedded RAM — 204,472,320 total RAM bits for on-chip storage of buffers, packet memory, and intermediate data structures.
  • Extensive I/O — 296 I/O pins for broad external connectivity, peripheral interfacing, and multi-channel I/O subsystems.
  • Advanced transceiver family features (device family) — Stratix 10 TX family devices support dual-mode transceivers capable of PAM4 and NRZ operation to enable high-bandwidth chip-to-chip and backplane links.
  • System and IP integration (device family) — Family-level integration includes hardened interfaces such as PCI Express Gen3 and high-speed Ethernet MACs for common high-speed protocol support.
  • Package and mounting — 2912-BBGA (55×55) FCBGA supplier device package, surface mount for standard board-level assembly.
  • Power and thermal — Specified supply voltage range 770 mV–970 mV and operating temperature 0 °C–100 °C; Grade: Extended.
  • Compliance — RoHS compliant to meet environmental regulatory requirements.

Typical Applications

  • Data center networking — High logic count and large embedded RAM make this device suitable for packet processing, switching fabric, and network acceleration functions that demand on-chip buffering and programmability.
  • Telecommunications and backplane systems — Family-level high-speed transceiver capabilities enable implementation of multi-gigabit links for backplane and optical interface designs.
  • High-performance compute acceleration — Large logic fabric and memory enable implementation of custom accelerators and algorithm offloads for compute-intensive workloads.
  • High-speed storage and I/O subsystems — Abundant I/O and on-chip memory support controller logic and protocol handling in storage front-end and aggregation systems.

Unique Advantages

  • Very large programmable fabric: 2.5 million logic elements support highly parallel implementations and large custom logic blocks.
  • Massive on-chip memory: Over 204 million bits of RAM reduce reliance on external memory for latency-sensitive buffers and state storage.
  • High I/O count: 296 I/O pins provide design flexibility for multi-channel interfaces and complex board-level routing.
  • Family-level high-speed connectivity: Stratix 10 TX transceiver and hardened IP capabilities enable high-bandwidth links and protocol offload options.
  • Extended operating range: Specified 0 °C to 100 °C operation and RoHS compliance support deployment in a wide set of commercial and enterprise systems.
  • Standard surface-mount package: 2912-BBGA FCBGA supports conventional assembly and integration into multi-board systems.

Why Choose 1ST250EY1F55E2VG?

This Stratix® 10 TX FPGA part offers designers a high-density, high-memory programmable platform shaped for complex, bandwidth- and logic-intensive applications. With 2.5 million logic elements, more than 204 million bits of embedded RAM, and 296 I/Os in a 2912-BBGA package, the device is positioned for use in systems that require significant on-chip compute, buffering and connectivity while operating within an extended 0 °C to 100 °C range.

Engineers targeting scalable network, storage, or compute acceleration designs will find this device well suited for consolidating functionality into a single FPGA-based implementation while remaining compliant with RoHS and standard supply/packaging conventions.

Request a quote or submit a quotation request to obtain pricing, availability and lead-time information for 1ST250EY1F55E2VG.

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