1ST250EU3F50I3XG

The 1ST250EU3F50I3XG is an Intel Stratix® 10 TX Field Programmable Gate Array supplied in a 2397-BBGA FCBGA package. It pairs a high-density monolithic FPGA fabric with advanced Stratix 10 TX series innovations — including the Intel Hyperflex core architecture and heterogeneous 3D transceiver tiles — to address demanding bandwidth and compute requirements.

Designed for industrial-grade systems, this device targets high-performance networking, telecom, and data-center applications that require large logic capacity, extensive on-chip memory, and high-speed serial connectivity while supporting an operating range from −40 °C to 100 °C.

Key Features

• Core Architecture Intel Hyperflex™ core architecture for improved core performance as described for the Stratix 10 TX family.
• Logic Density 2,500,000 logic elements to implement large, complex designs.
• On‑Chip Memory 204,472,320 total RAM bits of internal memory for buffering, packet processing, and large-state machines.
• I/O and Packaging 440 I/Os in a surface-mount 2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50×50).
• High‑Speed Transceivers (Series Capability) Stratix 10 TX series transceivers support dual‑mode operation (PAM4 and NRZ) with series-level data rates and up to 144 full-duplex transceiver channels for chip-to-chip, chip-to-module, and backplane links.
• Hard IP and DSP Series-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC with Reed‑Solomon FEC, plus hardened floating-point and variable-precision DSP resources.
• Operating Conditions and Power Specified operating temperature −40 °C to 100 °C and core voltage supply in the range 820 mV to 880 mV.
• Mounting Type Surface mount device suitable for standard PCB assembly processes.
• RoHS Compliance RoHS-compliant material status.

Typical Applications

• High‑Performance Networking Use the device’s high logic density, large on-chip RAM, and Stratix 10 TX transceiver capabilities for packet processing, switch/backplane interfaces, and line-card implementations.
• Data Center Interconnects Combine large FPGA fabric and hardened Ethernet/PCIe IP for data-path acceleration, protocol bridging, and aggregation tasks in server and switch equipment.
• Telecom and Optical Systems Leverage dual‑mode transceiver support (PAM4/NRZ) and high-speed channels for optical-module interfaces, fronthaul/backhaul, and OTN processing.
• Compute Acceleration Deploy the device for algorithm acceleration, DSP-heavy workloads, and custom compute offload where abundant logic resources and on-chip memory are required.

Unique Advantages

• High Logic Capacity: 2.5 million logic elements provide the headroom to integrate complex multi‑function systems on a single device.
• Large On‑Chip Memory: Over 204 million bits of RAM enable deep buffering and stateful processing without immediate reliance on external memory.
• Industrial Temperature Range: Specified −40 °C to 100 °C operation supports deployment in industrial and rugged environments.
• Advanced I/O and Packaging: 440 I/Os in a high‑pin‑count FCBGA package simplify board-level routing for dense system designs.
• Series-Level High‑Speed Connectivity: Stratix 10 TX transceiver technology and hardened Ethernet/PCIe IP reduce integration time for high-bandwidth links.
• Standards‑Oriented Integration: Hardened protocol IP (PCIe Gen3, Ethernet MACs with FEC) and DSP resources shorten development cycles for targeted applications.

Why Choose 1ST250EU3F50I3XG?

The 1ST250EU3F50I3XG brings together very high logic density, substantial internal RAM, and the Stratix 10 TX family’s high-speed transceiver and hardened-IP capabilities in a single industrial-grade FCBGA package. This combination is well suited to engineers building bandwidth‑intensive systems that need deep FPGA resources, robust connectivity, and operation across a wide temperature range.

Selecting this device supports scalable, long‑lifecycle designs where integration of compute, memory, and high‑speed interfaces reduces system complexity and BOM count while aligning with established Intel Stratix 10 TX series technologies.

Request a quote or submit an inquiry to evaluate 1ST250EU3F50I3XG for your next high-performance FPGA design.