1ST250EU3F50I3VG

The 1ST250EU3F50I3VG is an Intel Stratix® 10 TX Field Programmable Gate Array supplied in a 2397‑BBGA FCBGA package. It pairs a high-density monolithic FPGA fabric (2,500,000 logic elements) with the Stratix 10 TX family’s advanced HyperFlex core architecture and high-speed transceiver capabilities.

Designed for industrial applications requiring high I/O density and large on-chip memory, this device targets next-generation communications, compute acceleration, and high‑bandwidth interfaces by combining configurable logic, large RAM (204,472,320 bits), and family-level hardened IP such as PCI Express and Ethernet MACs.

Key Features

• Core & Architecture  Intel HyperFlex™ core architecture implemented in 14 nm tri‑gate (FinFET) technology; this device provides 2,500,000 logic elements for complex programmable logic implementation.
• On‑chip Memory  204,472,320 total RAM bits to support large buffering, packet processing, and on‑chip data structures.
• High‑speed Transceivers & Interfaces  Stratix 10 TX family dual‑mode transceivers support up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation; family-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MACs with Reed‑Solomon FEC options.
• I/O Density & Package  440 user I/O pins in a 2397‑BBGA (2397‑FBGA, FC 50×50) surface‑mount package to accommodate dense board routing and high‑bandwidth external interfaces.
• Power & Voltage  Core supply range 770 mV to 970 mV, enabling designs that target low‑voltage, high‑performance FPGA operation.
• Industrial Temperature Range  Specified operating temperature from −40 °C to 100 °C for industrial applications.
• Embedded Processing & DSP  Stratix 10 TX family includes hardened floating‑point DSP blocks and embedded quad‑core 64‑bit Arm Cortex‑A53 HPS in select devices to accelerate signal processing and system control tasks.
• Security & Configuration  Family features include secure device manager and configuration options to support controlled configuration and device security.
• Standards Compliance  RoHS compliant.

Typical Applications

• High‑speed Networking & Switches  Implement packet processing, traffic management, and high‑bandwidth line cards using the device’s large logic capacity, on‑chip memory, and high‑rate transceivers.
• Data Center Interconnect & Telecom  Support 10/25/100 Gbps Ethernet and PAM4/NRZ links for chip‑to‑chip, chip‑to‑module, and backplane applications.
• Compute Acceleration & Signal Processing  Use the dense logic fabric and hardened DSP blocks for hardware acceleration, analytics, and real‑time signal compute workloads.
• High‑performance PCIe Systems  Integrate with PCI Express Gen3 endpoints using the family’s hardened PCIe IP to implement add‑in cards, NICs, and storage adapters.
• Industrial & Ruggedized Systems  Leverage the industrial temperature range and high I/O count for control, monitoring, and communications in industrial environments.

Unique Advantages

• Highly integrated, high‑density fabric: 2,500,000 logic elements and large on‑chip RAM enable complex system functions to be implemented within a single device, reducing overall BOM and board area.
• Industry‑grade temperature range: −40 °C to 100 °C specification supports deployment in industrial and temperature‑critical environments.
• High I/O and package density: 440 I/O in a 2397‑BBGA package supports dense external interfaces and high‑bandwidth routing on modern PCBs.
• Advanced transceiver capability: Dual‑mode transceivers capable of PAM4 and NRZ data rates provide flexible options for backplane, module, and chip‑to‑chip links.
• Low‑voltage core operation: 770 mV–970 mV supply range supports power‑optimized designs where core voltage tuning is required.
• Family‑level hardened IP and features: Includes hardened PCIe and Ethernet MAC options, HyperFlex core performance enhancements, and architecture features that simplify high‑speed system design.

Why Choose 1ST250EU3F50I3VG?

The 1ST250EU3F50I3VG delivers a combination of high logic density, large on‑chip memory, substantial I/O count, and Stratix 10 TX family transceiver and IP capabilities. It is positioned for engineers building high‑bandwidth communications, compute‑acceleration, and industrial networking systems where integration, performance, and temperature resilience are important.

Choosing this device helps consolidate complex functions on a single FPGA platform while leveraging family features such as HyperFlex core architecture, hardened interface IP, and advanced transceiver modes—providing a scalable foundation for demanding system designs with long‑term support and ecosystem resources.

Request a quote or submit an inquiry for pricing, availability, and technical support details to evaluate the 1ST250EU3F50I3VG for your next design.