1ST250EU2F50I2VG

The 1ST250EU2F50I2VG is an Intel Stratix® 10 TX FPGA supplied in a 2397-BBGA FCBGA surface-mount package. It combines a high-density FPGA fabric with series-level Stratix 10 TX innovations such as the Intel HyperFlex core architecture and advanced high-speed transceiver technology.

Designed for high-bandwidth, compute- and I/O-intensive systems, this device provides 2,500,000 logic elements, 204,472,320 bits of on-chip RAM, and 440 general-purpose I/O pins. The device is rated for industrial operation from −40 °C to 100 °C and supports a core voltage supply range of 770 mV to 970 mV.

Key Features

• Core & Architecture  2,500,000 logic elements implementing the Stratix 10 TX family architecture and Intel HyperFlex innovations noted in the device overview.
• On‑chip Memory  204,472,320 total RAM bits for large buffering, packet processing, and memory‑intensive logic functions.
• I/O Density  440 I/O pins to support wide external connectivity and complex board-level interfacing.
• High‑speed Transceiver Technology (family level)  Stratix 10 TX devices feature dual-mode transceivers capable of high data rates for chip-to-chip, module and backplane links as described in the device overview.
• Hardened IP (family level)  The Stratix 10 TX overview documents hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks available on family devices.
• Package & Mounting  2397-BBGA, FCBGA (2397-FBGA, FC 50×50) surface-mount package suitable for high-density system assemblies.
• Power & Operating Range  Core supply range of 770 mV to 970 mV and industrial operating temperature from −40 °C to 100 °C for demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• High‑speed networking and telecommunications  Leverage the family’s high-bandwidth transceiver capabilities and large logic capacity for line cards, switches and routers.
• Data center and accelerator platforms  Large logic and memory resources support hardware acceleration, packet processing, and custom data‑path implementations.
• Backplane and module interfaces  High I/O count and Stratix 10 TX transceiver technology enable board-to-board and backplane connectivity.
• High-performance signal processing  Large on-chip RAM and dense logic elements accommodate complex DSP, filtering and real‑time processing pipelines.

Unique Advantages

• High logic capacity: 2,500,000 logic elements provide headroom for large, complex designs and multi-function integration.
• Substantial on‑chip memory: 204,472,320 bits of RAM reduce external memory dependence for buffering and intermediate storage.
• Extensive I/O reach: 440 I/O pins support broad external connectivity and high pin-count interfaces without additional bridge logic.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in harsh and temperature-variable environments.
• Low-voltage core operation: 770 mV to 970 mV core supply range enables power-optimized system designs.
• High-density package: 2397-BBGA (50×50) surface-mount package enables dense board layouts and reliable assembly.

Why Choose 1ST250EU2F50I2VG?

The 1ST250EU2F50I2VG positions itself as a high-capacity, industrial-grade FPGA option within the Intel Stratix 10 TX family. With 2.5 million logic elements, over 204 million bits of on-chip RAM and 440 I/Os, it targets designs that require substantial programmable logic, large internal memory, and broad external connectivity.

Series-level Stratix 10 TX innovations—such as the HyperFlex core architecture, high-speed dual-mode transceivers, and hardened PCIe/Ethernet IP described in the device overview—enable this device to address demanding networking, data-center, and high-performance embedded system requirements while maintaining industrial temperature and voltage specifications.

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