1ST250EU2F50E2LG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2500000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 342 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1ST250EU2F50E2LG – Stratix® 10 TX FPGA, 2,500,000 logic elements, 440 I/Os
The 1ST250EU2F50E2LG is a Field Programmable Gate Array (FPGA) IC from the Intel Stratix® 10 TX family. It delivers a high-capacity programmable fabric with 2,500,000 logic elements and extensive on-chip memory, designed for demanding, bandwidth‑focused system designs.
As a Stratix 10 TX device, this part is built on the series' core architectural innovations, including the HyperFlex core architecture and high-speed transceiver capabilities, targeting applications that require large logic arrays, significant RAM resources, and dense I/O in a 2397-BBGA FCBGA surface-mount package.
Key Features
- Logic Capacity 2,500,000 logic elements providing large programmable fabric for complex logic, compute, and control functions.
- On-chip Memory 204,472,320 total RAM bits to support large buffering, packet processing, and data-path storage requirements.
- I/O Density 440 user I/Os to enable high-density external connectivity and interface integration.
- Stratix 10 TX Series Innovations Series-level features include the Intel HyperFlex core architecture and heterogeneous 3D SiP transceiver tiles that support high aggregate bandwidth and advanced signal integrity techniques.
- High-speed Transceiver Capability (Series) Stratix 10 TX devices feature dual-mode transceivers supporting PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps, suitable for backplane, chip-to-chip, and module links (series-level capability).
- Hard IP Blocks (Series) Series-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC with Reed-Solomon FEC support for NRZ and PAM4 signals.
- Package and Mounting 2397-BBGA FCBGA package (supplier device package: 2397-FBGA, FC 50×50) with surface-mount mounting for compact system integration.
- Power Supply Range Core supply voltage range 820 mV to 880 mV to support the device's operating requirements.
- Operating Temperature and Grade Extended grade with an operating range of 0 °C to 100 °C for thermal environments aligned to extended‑temperature applications.
- Environmental Compliance RoHS compliant.
Typical Applications
- High‑performance networking Use in networking equipment that requires large logic capacity, heavy buffering, and high I/O density for packet processing and protocol acceleration.
- Data center and aggregation Applicable for aggregation and switching fabrics where large on‑chip RAM and many I/Os support traffic management and staging.
- Backplane and high‑speed interconnects Series transceiver capabilities support backplane and chip-to-module interfaces for high-bandwidth system interconnects.
- Compute acceleration Suitable for FPGA-based acceleration tasks that need a large programmable fabric and substantial internal memory.
Unique Advantages
- High logic density: 2,500,000 logic elements enable complex designs and large-scale integration on a single device.
- Substantial on-chip memory: Over 204 million RAM bits provide capacity for deep buffering and high-throughput data paths, reducing external memory dependence.
- Dense external connectivity: 440 I/Os allow broad peripheral and interface integration without additional I/O expanders.
- Series-level high-speed serial capability: Stratix 10 TX transceiver technology and hardened Ethernet/PCIe IP (series) support high aggregate bandwidth designs.
- Compact, manufacturable package: 2397-BBGA FCBGA surface-mount package (50×50) balances I/O density and board-level integration.
- Extended operating range: 0 °C to 100 °C grade and RoHS compliance support reliable deployment in extended-temperature commercial environments.
Why Choose 1ST250EU2F50E2LG?
1ST250EU2F50E2LG pairs a very large programmable fabric with extensive on-chip memory and high I/O count in a compact FCBGA package. It leverages Stratix 10 TX series architectural advances to address designs that demand substantial logic capacity and high-bandwidth data handling.
This device is suited for engineering teams building complex networking, data center, and high‑performance compute systems that require scalable logic, abundant RAM, and dense external connectivity while maintaining a well-defined operating voltage and extended temperature grade.
Request a quote or submit a sales inquiry to evaluate 1ST250EU2F50E2LG for your next high-capacity FPGA design.

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