1ST250EU1F50I1VG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2500000 2397-BBGA, FCBGA

Quantity 1,312 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1ST250EU1F50I1VG – Stratix® 10 TX FPGA, 2,500,000 logic elements, 440 I/O, 2397-BBGA

The 1ST250EU1F50I1VG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) supplied in a 2397-BBGA (FCBGA) package. It pairs a high-density FPGA fabric with advanced transceiver and system-level capabilities to address high-bandwidth, compute- and I/O-intensive designs.

Engineered for applications that require large logic capacity and substantial on-chip memory, this device combines Intel HyperFlex core architecture and heterogeneous transceiver technology to deliver strong performance, integration, and flexible I/O in an industrial-grade FPGA.

Key Features

  • Core & Logic  Monolithic FPGA fabric with 2,500,000 logic elements, leveraging Intel HyperFlex core architecture for increased core performance.
  • On-chip Memory  Large internal RAM capacity with 204,472,320 total RAM bits to support buffering, packet processing, and large-data datapaths.
  • I/O Density  440 user I/O pins to support extensive external interfacing and high pin-count designs.
  • High-speed Transceivers  Dual-mode transceiver architecture in the Stratix 10 TX family supports both PAM4 and NRZ modes for high-bandwidth chip-to-chip, chip-to-module, and backplane links.
  • Hard IP & Processing  Family-level features include hardened PCI Express Gen3 and Ethernet MAC IP blocks, and select devices can include an embedded quad-core Arm Cortex-A53 Hard Processor System (HPS).
  • Power & Voltage  Core voltage supply range of 770 mV to 970 mV, enabling precise power provisioning for core logic.
  • Package & Mounting  Surface-mount 2397-BBGA (supplier package listed as 2397-FBGA, FC 50×50) for high-density board integration.
  • Operating Range & Compliance  Industrial operating temperature from −40 °C to 100 °C and RoHS-compliant manufacturing.

Typical Applications

  • High‑Speed Networking & Telecom  Use for line cards, switches, and routers requiring multi-gigabit transceiver support and large on‑chip memory for packet buffering and forward error correction.
  • Data Center & Storage  Supports applications that demand PCI Express and Ethernet connectivity alongside large logic capacity for accelerators and protocol offload.
  • Compute Acceleration  Ideal for FPGA-based acceleration functions that require extensive logic elements and RAM to implement custom datapaths and DSP pipelines.
  • Backplane & Chip‑to‑Chip Interconnects  High-speed dual-mode transceivers enable reliable chip-to-chip and backplane links using PAM4 or NRZ signaling modes.

Unique Advantages

  • High Logic Capacity:  2,500,000 logic elements provide the headroom to implement complex custom logic, large state machines, and multiple concurrent functions on a single device.
  • Substantial On‑Chip Memory:  Over 204 million bits of RAM reduce dependence on external memory for buffering and intermediate storage, simplifying system memory architecture.
  • Advanced Transceiver Flexibility:  Dual‑mode transceiver capability supports PAM4 and NRZ signaling, enabling a range of high-speed link topologies and data-rate choices.
  • Industrial Temperature Range:  Rated for −40 °C to 100 °C operation, suitable for demanding environments where extended temperature tolerance is required.
  • Package and Board Integration:  2397-BBGA surface-mount package (50×50 supplier footprint) supports high-density PCB designs and robust thermal/mechanical integration.

Why Choose 1ST250EU1F50I1VG?

The 1ST250EU1F50I1VG positions itself as a high-capacity, high-bandwidth FPGA solution for designs that demand significant logic resources, large on‑chip memory, and flexible, high-speed external interfaces. With Stratix 10 TX family innovations such as HyperFlex architecture and heterogeneous transceiver tiles, this device is suited to systems where integration and performance must be balanced with industrial operating requirements.

For engineering teams targeting networking, data center acceleration, or complex embedded processing tasks, this FPGA offers scalable logic and I/O resources along with hardened IP building blocks found across the Stratix 10 TX family, enabling streamlined implementation of advanced system functions.

Request a quote or submit your specifications to receive pricing and availability for the 1ST250EU1F50I1VG.

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