1ST210EU3F50I3XG

The 1ST210EU3F50I3XG is an Intel Stratix® 10 TX field-programmable gate array (FPGA) offered in a 2397-ball FCBGA package. It combines a high-density logic fabric with large embedded RAM and industry-grade operating range to support demanding, high-bandwidth system designs.

Built on the Stratix 10 TX architecture, this device emphasizes high transceiver bandwidth, advanced core architecture, and integration suited for communications, networking, compute acceleration, and other data‑intensive applications.

Key Features

• Core and Logic  Up to 2,100,000 logic elements provide a very large programmable fabric for complex custom logic and massive parallelism.
• Embedded Memory  133,169,152 total RAM bits enable extensive on-chip buffering and state storage for packet processing, buffering, and dataflow engines.
• High-speed Transceivers  Family-level support for dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip-to-chip, chip-to-module, and backplane links; series devices support large aggregate transceiver bandwidth.
• Connectivity IP  Stratix 10 TX devices include hardened IP blocks such as PCI Express Gen3 and multi-rate Ethernet MACs (10/25/100 Gbps) to simplify high-performance I/O integration.
• I/O and Package  440 user I/O pins and a 2397-ball FCBGA supplier package (2397-FBGA, FC (50×50)) provide dense board-level connectivity in a surface-mount package.
• Power and Voltage  Core voltage range specified at 820 mV to 880 mV to match system power-rail requirements and core performance points.
• Operating Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in harsh or controlled industrial environments.
• Performance Architecture  Stratix 10 TX series innovations such as the Intel Hyperflex core architecture and hardened DSP and memory controllers are part of the device family to deliver higher core performance and efficient signal processing.
• Configuration and Reliability  Family documentation includes features for device configuration, secure device management, and single event upset (SEU) detection and correction mechanisms at the series level.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑speed Networking and Telecom  Implement switch fabrics, packet processing, and line cards where multi‑hundred‑Gbps transceiver bandwidth and hardened Ethernet/IP cores accelerate system throughput.
• Data Center and Cloud Infrastructure  Use for network interface cards, smart NICs, and acceleration engines that require large logic capacity, substantial on‑chip RAM, and high I/O density.
• Compute Acceleration and Signal Processing  Deploy variable‑precision DSP blocks and large logic resources for real‑time signal processing, hardware accelerators, and algorithm offload.
• Backplane and Optical Transport  Leverage dual‑mode high‑speed transceivers for chip‑to‑module and backplane connectivity in optical transport and line‑side equipment.

Unique Advantages

• Massive Logic Capacity: 2,100,000 logic elements enable highly parallel implementations and complex system-on-FPGA architectures without partitioning across multiple devices.
• Large On‑chip Memory: 133,169,152 bits of RAM reduce dependence on external memory for buffering and accelerate data‑intensive workflows.
• High‑bandwidth I/O: Dual‑mode transceiver capabilities and 440 I/O pins provide flexible, high-speed connectivity for a wide range of interfaces and topologies.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in industrial and ruggedized environments.
• Integrated Hardened IP (Series Level): Inclusion of hardened PCIe Gen3 and multi‑rate Ethernet MACs in the Stratix 10 TX family shortens development time and reduces system risk.
• Compact, High‑density Package: The 2397-ball FCBGA supplier package (2397-FBGA, FC (50×50)) delivers high pin count and signal density for compact board designs.

Why Choose 1ST210EU3F50I3XG?

The 1ST210EU3F50I3XG combines the Stratix 10 TX family architecture with very large logic and memory resources, substantial I/O, and industrial-grade operating range to address demanding, high-bandwidth system designs. Its feature set supports integrated connectivity and signal processing requirements while enabling dense board-level integration in a FCBGA package.

This device is well suited for engineers building high-performance networking, compute acceleration, and transport systems who need scalable logic capacity, extensive on‑chip memory, and high-speed transceiver capability backed by the Stratix 10 TX family architecture.

Request a quote or submit a sales inquiry to discuss availability, lead times, and pricing for the 1ST210EU3F50I3XG.