1ST210EU3F50E3VG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2100000 2397-BBGA, FCBGA

Quantity 676 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262500Number of Logic Elements/Cells2100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits133169152

Overview of 1ST210EU3F50E3VG – Stratix® 10 TX FPGA, 440 I/O, 2,100,000 logic elements

The 1ST210EU3F50E3VG is an Intel Stratix® 10 TX field programmable gate array supplied in a 2397-BBGA FCBGA package. It combines a high-density logic fabric with extensive on-chip memory and high-performance I/O to target bandwidth- and compute-intensive system designs.

As part of the Stratix 10 TX family, this device leverages the HyperFlex core architecture and heterogeneous transceiver technology to support next‑generation chip‑to‑chip, chip‑to‑module, and backplane applications that require large logic capacity, abundant RAM, and high aggregate throughput.

Key Features

  • Logic Capacity  2,100,000 logic elements provide significant programmable fabric for complex algorithms, custom datapaths, and large-scale logic integration.
  • On‑chip Memory  133,169,152 total RAM bits enable large buffering, look‑up tables, and state storage for data‑intensive applications.
  • High‑speed I/O  440 I/O pins support extensive external connectivity for parallel interfaces and system integration.
  • Dual‑mode Transceiver Technology  Stratix 10 TX devices include dual‑mode transceivers (PAM4 and NRZ) capable of high aggregate bandwidth suitable for demanding interconnects and high‑speed links.
  • Hardened System IP  Family-level features include hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks for efficient implementation of common system interfaces.
  • Advanced Process and Architecture  Built on Intel’s Stratix 10 TX innovations, including the HyperFlex core architecture and 14 nm process technology, delivering improved core performance across the family.
  • Power Supply  Core voltage requirement in the range of 770 mV to 970 mV, allowing integration into modern low‑voltage power architectures.
  • Package and Mounting  Supplied in a 2397‑BBGA (2397‑FBGA, FC 50×50) package for surface‑mount assembly, suitable for high‑density board designs.
  • Operating Range and Grade  Extended grade device specified for 0 °C to 100 °C ambient operation and RoHS compliant for environmental conformity.

Typical Applications

  • High‑performance networking  Use in 10/25/100 Gbps Ethernet systems and backplane switches where high aggregate bandwidth and hardened MAC/forward‑error‑correction IP accelerate design.
  • Telecommunications and optical transport  Dual‑mode transceivers and large on‑chip RAM support PAM4/NRZ links and packet buffering for transport systems and line cards.
  • PCIe‑based systems and storage controllers  Hardened PCI Express Gen3 IP and abundant logic enable custom host interfaces, protocol offload, and storage appliance designs.
  • Compute acceleration and DSP  High logic density and large memory resource support custom acceleration engines and dataflow implementations.

Unique Advantages

  • Large, integrated FPGA fabric: 2.1 million logic elements combined with 133 Mb of on‑chip RAM reduces the need for external logic and memory, simplifying BOM and board complexity.
  • High I/O count: 440 I/O pins enable broad peripheral interfacing and high‑bandwidth parallel connections to support complex system topologies.
  • Advanced transceiver capability: Dual‑mode transceivers in the Stratix 10 TX family support PAM4 and NRZ signaling, providing flexibility for emerging high‑speed link standards.
  • Optimized power envelope: Core voltage specified between 770 mV and 970 mV aligns with modern low‑voltage power domains for energy‑aware system design.
  • Extended temperature grade: Rated for 0 °C to 100 °C operation to meet a wide range of commercial and extended‑environment applications.
  • RoHS compliant: Environmentally compliant materials reduce regulatory risk and support global product deployment.

Why Choose 1ST210EU3F50E3VG?

The 1ST210EU3F50E3VG brings together very large logic capacity, substantial on‑chip RAM, and a high I/O count in a single Stratix 10 TX package. It is positioned for designers who need significant programmable resources coupled with high‑speed I/O and hardened system IP to accelerate time to market for bandwidth‑intensive systems.

This device suits teams implementing switch‑grade networking, telecom line cards, PCIe‑attached subsystems, and compute accelerators that require scalable logic, deterministic on‑chip memory, and advanced transceiver capabilities provided by the Stratix 10 TX family.

Request a quote or submit an inquiry to obtain pricing and availability for 1ST210EU3F50E3VG and to discuss volume options and lead times.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up