1ST210EU2F50I2VGAS

The 1ST210EU2F50I2VGAS is an Intel Stratix® 10 TX field-programmable gate array (FPGA) in a 2397-ball FCBGA package, designed for high-density, high-throughput system designs. It combines the Stratix 10 TX series architecture with a monolithic 14 nm core fabric and advanced packaging to address demanding communications and compute use cases.

With 2,100,000 logic elements, 133,169,152 bits of on-chip RAM and support for high-performance transceiver capabilities described for the Stratix 10 TX family, this device targets next-generation networking, data center, and high-bandwidth processing applications while offering industrial-grade temperature range and surface-mount packaging for robust board-level integration.

Key Features

• Core and Architecture  HyperFlex® core architecture (Stratix 10 TX family) delivering significantly increased core performance, implemented in Intel 14 nm FinFET technology.
• Logic Density  2,100,000 logic elements to implement large-scale, complex logic and custom accelerators on a single device.
• On-chip Memory  133,169,152 total RAM bits of internal memory for buffering, lookup tables, and on-chip data storage; Stratix 10 TX family also documents embedded M20K memory blocks and select devices with embedded eSRAM.
• High-speed Transceivers  Stratix 10 TX family supports dual-mode transceivers (PAM4 and NRZ) and high aggregate bandwidth suitable for chip-to-chip, chip-to-module, and backplane applications.
• I/O and Package  440 user I/Os and a 2397-ball BGA (FCBGA) package in a 50 × 50 supplier device footprint for dense I/O routing and compact board designs; surface-mount mount type.
• Operating Range and Power  Voltage supply range 770 mV to 970 mV and industrial operating temperature range −40 °C to 100 °C for reliable operation across extended-temperature environments.
• Hard IP and System Integration  Stratix 10 TX family includes hardened PCI Express and Ethernet MAC IP options and advanced clocking and PLL features suitable for high-bandwidth system integration.
• Compliance  RoHS compliant.

Typical Applications

• High-bandwidth Networking  Ideal for line cards, switches and routers where large logic capacity and high-speed transceivers support packet processing and forwarding at multi-terabit aggregate bandwidth.
• Data Center Acceleration  Suited for FPGA-based accelerators and offload engines that need dense logic, substantial on-chip RAM, and high I/O counts for server and storage acceleration tasks.
• Telecom and Optical Transport  Useful in backplane and chip-to-module interfaces for transport equipment leveraging the Stratix 10 TX transceiver capabilities and hardened Ethernet/PHY options.
• High-performance Compute  Supports custom DSP and compute fabrics where large numbers of logic elements and internal RAM enable complex algorithm implementation and parallel processing.

Unique Advantages

• High logic capacity: 2.1 million logic elements enable large, integrated systems on a single FPGA, reducing board-level partitioning.
• Substantial on-chip memory: 133 Mb of RAM bits provide ample on-device storage for buffering, lookup tables and intermediate data without relying solely on external memory.
• Advanced transceiver support: Stratix 10 TX series transceiver capability supports both PAM4 and NRZ modes for flexible deployment across chip-to-chip and backplane interconnects.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in extended-temperature environments.
• Dense I/O and package: 440 I/Os in a 2397-BBGA (FCBGA) surface-mount package enable compact, high-density board designs.
• Integrated system IP: Family-level hardened IP (PCIe, Ethernet MAC, advanced PLLs) simplifies integration of high-speed interfaces and reduces development time.

Why Choose 1ST210EU2F50I2VGAS?

The 1ST210EU2F50I2VGAS delivers the compute capacity and integration expected from the Stratix 10 TX family—combining a high logic-element count, large on-chip memory, extensive I/O and family-level high-speed transceiver capabilities in a compact 2397-ball FCBGA package. Its industrial temperature rating and surface-mount packaging make it suitable for demanding, board-level deployments where reliability and density matter.

This device is well suited for engineering teams building high-throughput networking, data center acceleration, telecom transport and other performance-sensitive systems that require scalable FPGA resources, advanced interface IP and a proven vendor ecosystem for long-term design support.

Request a quote or submit an inquiry for availability and pricing to begin integrating the 1ST210EU2F50I2VGAS into your design.