1ST210EU3F50E3XG

The 1ST210EU3F50E3XG is an Intel Stratix® 10 TX family FPGA in a 2397-BBGA (FCBGA) package designed for high-bandwidth, high-density programmable logic applications. As a Stratix 10 TX device, it benefits from the family’s HyperFlex® core architecture and advanced transceiver technology to address demanding communications, networking, and high-performance compute use cases.

This device integrates 2,100,000 logic elements, substantial embedded RAM, and 440 I/O pins, delivering the scalability and I/O density required for systems that combine heavy logic, large memory buffering, and extensive external interfacing. The part is specified for extended-grade operation and supports a low-voltage core supply range for power-sensitive designs.

Key Features

• Core Architecture  Stratix 10 TX family HyperFlex core architecture is part of the device family as described in the product overview, providing the architectural foundation for high-performance FPGA implementations.
• Logic Capacity  2,100,000 logic elements to implement complex custom logic, packet processing, and protocol acceleration functions.
• Embedded Memory  133,169,152 total RAM bits for on-chip buffering, state storage, and large lookup table implementations.
• I/O Density  440 I/O pins to support wide parallel interfaces, board-level connectivity, and multiple high-speed links.
• High-speed Transceiver Technology (family feature)  Stratix 10 TX family devices include dual-mode transceivers capable of PAM4 and NRZ operation (up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ), enabling high-bandwidth chip-to-chip, module, and backplane links.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV to match system power-rail planning for low-voltage FPGA cores.
• Package & Mounting  2397-BBGA (FCBGA) package, surface-mount, supplied in a 2397-FBGA, FC (50×50) device package format for compact, high-pin-count board designs.
• Operating Range  Extended-grade operating temperature from 0 °C to 100 °C for a broad range of commercial and network equipment environments.
• Platform Innovations (family-level)  Family-level features include Intel 14 nm tri-gate process, heterogeneous 3D SiP transceiver tiles, hardened Ethernet and PCI Express IP blocks, and scalable on-package integration.
• Compliance  RoHS compliant to support regulatory and manufacturing environmental requirements.

Typical Applications

• High-Speed Networking & Telecom  Implement packet processing, MAC offload, and line-rate protocol acceleration using the device’s large logic capacity, embedded memory, and family transceiver capabilities.
• Data Center & Cloud Infrastructure  Use for switch fabric, NIC offload, and FPGA-accelerated services where high I/O density and large on-chip memory improve throughput and latency.
• Backplane & Chip-to-Chip Interfaces  Deploy in systems requiring many parallel I/Os and high-bandwidth serialized links for board-to-board and module interconnect.
• High-Performance Computing Prototyping  Leverage the large logic and memory resources to prototype custom accelerators and algorithmic workloads.

Unique Advantages

• Large Programmable Fabric: 2,100,000 logic elements enable substantial on-chip compute and custom logic without immediate need for external ASICs.
• Significant On-Chip Memory: 133,169,152 total RAM bits reduce dependence on external memory for buffering and stateful processing.
• High I/O Count: 440 I/O pins provide flexibility to interface with numerous peripherals and high-density board connections.
• Advanced Packaging: 2397-BBGA FCBGA package supports high pin-count surface-mount integration suitable for compact, high-performance boards.
• Power-Optimized Core Voltage: 820 mV–880 mV supply range supports low-voltage system designs and power budgeting.
• Extended Temperature Grade: Rated 0 °C to 100 °C to meet deployment requirements in a variety of commercial and network equipment environments.

Why Choose 1ST210EU3F50E3XG?

The 1ST210EU3F50E3XG delivers a high-capacity, I/O-rich FPGA solution within the Intel Stratix 10 TX family, combining millions of logic elements with substantial embedded RAM and extensive I/O. It is suited to designs that require dense programmable logic, large on-chip memory, and flexible interfacing in a compact FCBGA package.

Designed for systems that demand scalability and integration, this part offers the platform-level innovations of the Stratix 10 TX family—such as HyperFlex architecture and high-speed transceiver technology—while providing specific, verifiable device-level specifications for procurement and system design.

Request a quote or submit a product inquiry to get pricing, availability, and ordering information for 1ST210EU3F50E3XG.