1ST250EU1F50E1VG

The 1ST250EU1F50E1VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 2397-BBGA FCBGA package. It integrates a high-capacity programmable fabric with a large I/O count and extended-grade thermal rating for demanding digital designs.

Built on the Stratix 10 TX device family architecture, the device incorporates HyperFlex core architecture and high-speed transceiver technology described in the device overview, making it suitable for high-bandwidth communications, data center and network infrastructure, and advanced compute applications that require dense logic, large on-chip memory, and robust I/O.

Key Features

• Logic Capacity — 2,500,000 logic elements providing large programmable fabric resources for complex logic, datapath, and control implementations.
• Configurable Logic Blocks (CLBs) — 312,500 CLBs for structured placement of logic and routing across the device.
• On‑Chip Memory — 204,472,320 total RAM bits to support large buffering, packet processing, and on-chip datasets.
• I/O — 440 device I/O pins suitable for wide external connectivity and multi-channel interfaces.
• High‑Speed Transceiver Technology (Series Feature) — Stratix 10 TX family devices include dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip-to-chip, chip-to-module, and backplane applications.
• Core Architecture (Series Feature) — Intel HyperFlex core architecture and Intel 14 nm tri-gate (FinFET) technology are part of the Stratix 10 TX series innovations described in the device overview.
• Package & Mounting — Surface-mount 2397-BBGA (FCBGA) package, supplier device package 2397-FBGA, FC (50×50), providing a high-pin-count footprint for complex board designs.
• Voltage Supply — Core voltage range specified at 770 mV to 970 mV for power-supply planning and power-budget calculations.
• Operating Temperature & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for applications that require above-commercial thermal performance.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• Network Infrastructure — High-density logic and large on-chip memory enable packet processing, line-rate switching, and forwarding tasks in telecommunications and data-center networking equipment.
• High‑Speed Communications — Dual-mode transceivers and high I/O count support chip-to-chip, module, and backplane links in systems requiring multi‑channel high-bandwidth connectivity.
• Data Center & Compute Acceleration — Large logic element count and memory capacity are suitable for custom acceleration, offload engines, and programmable datapaths.
• Embedded System Integration — Stratix 10 TX family features such as hardened IP blocks and on-chip resources support integration of complex system functions into a single FPGA device.

Unique Advantages

• High Logic Density: 2,500,000 logic elements deliver the fabric capacity required for large, multi-function FPGA designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: Over 204 million bits of RAM enable deep buffering, lookup tables, and state storage directly on the FPGA fabric to reduce external memory dependence.
• Extensive I/O Count: 440 I/O pins support broad external interfacing and multi-channel connectivity for complex board-level integration.
• Advanced Packaging: 2397-BBGA FCBGA package provides a high-pin-count, compact solution for dense system designs and board real estate optimization.
• Power-Supply Specification: Defined core voltage range (770 mV–970 mV) assists in accurate power delivery design and thermal planning.
• Extended Grade Operation: Rated 0 °C to 100 °C for use in systems that require operation beyond standard commercial temperature limits.

Why Choose 1ST250EU1F50E1VG?

The 1ST250EU1F50E1VG brings together a high-capacity Stratix 10 TX FPGA fabric, substantial on-chip RAM, and a large I/O complement in a 2397-BBGA package for demanding digital and high-bandwidth system designs. Its specification for core voltage, extended operating temperature, and series-level architectural innovations make it appropriate for designers targeting dense, high-performance implementations where integration and I/O scalability matter.

Ideal for system architects and engineers building network infrastructure, communications equipment, data-center accelerators, and advanced embedded platforms, this device delivers the programmable resources and package density needed to consolidate functions and simplify board-level design while aligning with RoHS compliance requirements.

To request pricing, availability, or a formal quote for 1ST250EU1F50E1VG, submit a quote request or inquiry today. Our team will respond with current lead times and ordering information.