1ST250EU1F50E2VG

The 1ST250EU1F50E2VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) offered in a 2397-ball FCBGA package. It combines a high-performance HyperFlex® core architecture with a large logic capacity and high-speed transceiver capability for demanding system designs.

This device targets applications that require large programmable logic resources, heavy on-chip memory, and multi-gigabit serial connectivity — for example, next-generation networking, telecom equipment, and compute acceleration where high aggregate bandwidth and integration reduce overall system complexity.

Key Features

• Core Architecture  HyperFlex® core architecture delivering doubled core performance compared to previous-generation high-performance FPGAs as documented for the Stratix 10 TX family.
• Logic Capacity  2,500,000 logic elements, providing a very large fabric for complex designs and extensive custom logic integration.
• On-chip Memory  204,472,320 total RAM bits available on the device, enabling large buffering, packet processing, and data-path storage directly in the FPGA fabric.
• High-Speed Transceivers  Dual-mode transceivers supporting up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation to address chip-to-chip, module, and backplane high-bandwidth links.
• Hard IP and Protocol Support  Family-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC with Reed-Solomon FEC — useful for high-throughput I/O and protocol offload.
• I/O and Package  440 user I/O in a 2397-BBGA (FCBGA) package; supplier package listed as 2397-FBGA, FC (50×50). Surface-mount design suited for high-density board integration.
• Power and Temperature  Core voltage supply range of 770 mV to 970 mV and an operating temperature range of 0 °C to 100 °C. The device is offered in Extended grade.
• Family Innovations  Stratix 10 TX family innovations include Intel 14 nm FinFET technology, heterogeneous 3D SiP transceiver tiles, and advanced packaging technology as described for the device family.
• Compliance  RoHS compliant.

Typical Applications

• High-Speed Networking  Programmable switching and packet-processing functions that leverage the device's large logic capacity and high-speed transceivers for multi-hundred-gigabit links.
• Telecommunications Infrastructure  Line cards, optical modules, and backplane interfaces that require PAM4/NRZ transceiver support and hardened Ethernet MAC/forward-error-correction IP.
• Data Center & Cloud Acceleration  Custom accelerators and protocol offload engines that benefit from extensive on-chip memory and large logic resources.
• High-Performance Compute  Custom datapath and DSP-rich workloads taking advantage of the Stratix 10 TX family architecture and fabric performance.

Unique Advantages

• Very large programmable capacity: 2.5M logic elements enable integration of complex systems and significant on-chip functionality, reducing external silicon.
• High aggregate bandwidth: Dual-mode transceivers up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ support the high-speed serial links required for modern networking and compute fabrics.
• Integrated protocol IP: Hardened PCIe Gen3 and 10/25/100 Gbps Ethernet MAC (with Reed-Solomon FEC at the family level) reduce soft-IP overhead and simplify system design.
• Substantial on-chip RAM: Over 204 million bits of RAM supports large buffers, tables, and streaming data processing directly in fabric.
• Advanced packaging and process: 14 nm FinFET family innovations and heterogeneous SiP transceiver tiles improve performance density and help meet tight power and bandwidth targets.
• Simplified board integration: Surface-mount 2397-BBGA package with 440 I/O and defined supplier package dimensions for high-density PCB layouts.

Why Choose 1ST250EU1F50E2VG?

The 1ST250EU1F50E2VG positions itself as a high-capacity, high-bandwidth Stratix 10 TX FPGA suitable for designs that demand both extensive programmable logic and leading-edge serial connectivity. Its combination of 2.5 million logic elements, large on-chip RAM, and multi-gigabit transceivers supports integration of complex datapath, networking, and acceleration functions into a single device.

This device is appropriate for engineering teams developing scalable networking, telecom, and compute solutions that require significant on-chip resources, hardened protocol IP at the family level, and an extended operating range. The documented family-level innovations and the device’s specified electrical and thermal ranges support long-term system scalability within those design constraints.

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