1ST210EU3F50I3VG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2100000 2397-BBGA, FCBGA

Quantity 797 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262500Number of Logic Elements/Cells2100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits133169152

Overview of 1ST210EU3F50I3VG – Stratix® 10 TX FPGA, 2,100,000 Logic Elements

The 1ST210EU3F50I3VG is an Intel Stratix® 10 TX field programmable gate array in a 2397-BBGA (FCBGA) package targeted for high-performance, high-bandwidth system designs. It integrates a dense programmable fabric with 2,100,000 logic elements, large on-chip RAM, and a broad 440-pin I/O count to address complex networking, compute acceleration, and high-speed I/O applications.

As part of the Stratix 10 TX family, this device leverages the HyperFlex® core architecture and series-level innovations such as dual-mode transceivers and hardened protocol IP to deliver the performance and integration needed for demanding board- and system-level designs.

Key Features

  • Core Logic 2,100,000 logic elements providing high-density programmable fabric suitable for large FPGA designs and complex RTL implementations.
  • Configurable Logic Array 262,500 Adaptive Logic Modules (ALMs) reported for fine-grained logic mapping and performance optimization.
  • On‑Chip Memory 133,169,152 total RAM bits of internal memory for buffering, packet processing, and lookup tables.
  • High‑Speed I/O 440 I/O pins to support extensive external connectivity and high-pin-count board interfaces.
  • Dual‑Mode Transceivers (Series‑Level) Stratix 10 TX series transceivers support both 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for high-bandwidth chip-to-chip, chip-to-module, and backplane links.
  • Hardened Protocol IP (Series‑Level) Series-level support includes hardened PCI Express Gen3 and 10/25/100 GbE MACs for standard protocol offload and deterministic interface behavior.
  • Packaging and Mounting 2397-BBGA FCBGA (supplier package listed as 2397-FBGA, FC 50×50) in a surface-mount package for system-level board integration.
  • Power and Voltage Core voltage supply range of 770 mV to 970 mV as specified for device operation.
  • Temperature Grade and Compliance Industrial-grade operating range from −40 °C to 100 °C and RoHS-compliant.

Typical Applications

  • High‑Performance Networking Packet processors, switches, and routers that require large logic capacity, extensive RAM, and high-speed transceivers for multi‑Tbps aggregate bandwidth.
  • Data Center Interconnects Backplane and module-level designs leveraging dual-mode transceivers and hardened Ethernet/PCIe IP for high-bandwidth links.
  • Protocol Offload and Acceleration Hardware acceleration for standard interfaces using on‑die memory and hardened IP to offload host processors.
  • System‑Level Integration Complex board-level systems requiring high I/O counts, dense logic, and industrial temperature operation.

Unique Advantages

  • High Logic Density: 2,100,000 logic elements enable large-scale designs and complex system functions within a single FPGA device.
  • Extensive On‑Chip RAM: 133,169,152 RAM bits provide deep buffering and state storage for networking, DSP, and packet-processing tasks.
  • Series‑Level High‑Speed Transceivers: Support for 57.8 Gbps PAM4 and 28.9 Gbps NRZ transceiver modes (Stratix 10 TX series) enables flexible high-bandwidth connectivity options.
  • Hardened Interface IP: Integrated, hardened PCIe Gen3 and multi-rate Ethernet MACs in the Stratix 10 TX family reduce design risk and accelerate time to market.
  • Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in a wide range of environmental conditions.
  • Surface‑Mount BBGA Packaging: 2397-ball FCBGA package provides a compact, board-ready form factor for high-pin-count, high-performance systems.

Why Choose 1ST210EU3F50I3VG?

The 1ST210EU3F50I3VG combines high logic capacity, substantial on-chip RAM, and a large I/O complement in a surface-mount 2397-BBGA package, positioning it for complex networking and high-bandwidth system designs. As a member of the Stratix 10 TX family, it benefits from the HyperFlex® core architecture and series-level transceiver and protocol IP innovations to help meet aggressive bandwidth and integration requirements.

This device is well suited for engineers and system designers building solutions that demand significant programmable logic, extensive memory, and robust I/O while operating across industrial temperature ranges. Its specification set supports scalable designs that leverage Stratix 10 TX family features for long-term platform deployment.

Request a quote or submit an inquiry to receive pricing and availability for the 1ST210EU3F50I3VG and to discuss how it fits your next high-performance design.

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