1ST210EU2F50I2VG

The 1ST210EU2F50I2VG is an Intel Stratix® 10 TX field-programmable gate array supplied in a 2397-BBGA (FCBGA) package. It combines a high-capacity programmable fabric with extensive I/O and on-die memory to address demanding, bandwidth‑intensive system designs.

Built for applications that require large logic capacity, substantial internal RAM, and industrial-grade operating range, this device targets high-throughput networking, data processing, and other performance-focused markets where integration and predictable electrical/thermal limits matter.

Key Features

• Core Capacity — 2,100,000 logic elements to implement large-scale programmable logic and complex custom processing pipelines.
• On‑Die Memory — 133,169,152 total RAM bits for buffering, packet processing, and on-chip data storage.
• I/O — 440 user I/O pins suitable for diverse high-density interface requirements.
• High‑Speed Transceiver Architecture (series-level) — Stratix 10 TX family devices feature dual‑mode transceivers supporting PAM4 and NRZ signaling and very high aggregate transceiver bandwidth; refer to family documentation for channel and rate details applicable to your design.
• Voltage Domain — Core supply range 770 mV to 970 mV to match targeted power and performance operating points.
• Package and Mounting — 2397‑BBGA, FCBGA supplier package (2397‑FBGA, FC 50×50) in a surface-mount format for board-level integration.
• Industrial Temperature Grade — Rated for −40°C to 100°C operating temperature for deployment in industrial environments.
• Standards and Compliance — RoHS‑compliant material status for environmental and manufacturing consistency.

Typical Applications

• High‑Performance Networking — Large logic capacity and extensive RAM enable packet processing, switching, and line-rate protocol offload in network equipment.
• Data Center and Acceleration — On-chip memory and programmable fabric support custom data-path acceleration, parsing, and aggregation functions.
• Telecommunications — High I/O count and family transceiver capabilities support backplane and line-card designs that require high aggregate bandwidth.
• Test & Measurement — Logic density and deterministic operating range make the device suitable for instrumentation that requires complex real‑time processing.

Unique Advantages

• Large Programmable Resource Pool: 2.1M logic elements provide headroom for complex system functions and custom accelerators.
• Substantial On‑Chip Memory: 133 Mb of RAM reduces reliance on external memory for many buffering and scratch needs, simplifying system BOM and latency.
• Industrial Readiness: −40°C to 100°C operating range and RoHS compliance support deployment in industrial and stringent manufacturing environments.
• High I/O Density: 440 I/O pins give flexibility for multi-protocol interfacing and board-level partitioning of signals.
• Compact, Surface‑Mount Package: 2397‑BBGA (50×50) FCBGA footprint enables high-density PCB layouts while supporting robust thermal and mechanical assembly.
• Configurable Power Envelope: Core voltage support from 770 mV to 970 mV allows designers to tune power/performance tradeoffs.

Why Choose 1ST210EU2F50I2VG?

The 1ST210EU2F50I2VG pairs large logic density and significant on-chip RAM with an industrial operating range and a compact FCBGA package, making it suitable for high-bandwidth, compute‑heavy applications where integration and environmental robustness are required. Its 440 I/O capability and defined supply/thermal limits enable predictable system integration for design teams focused on throughput and deterministic behavior.

Engineers designing network systems, data-path accelerators, telecommunications equipment, or advanced instrumentation will find this device suited to scaling complex functions on a single FPGA platform while maintaining clear electrical and thermal specifications for production environments.

Request a quote or submit an inquiry to receive availability and pricing for the 1ST210EU2F50I2VG and assistance specifying the device for your next design.