1ST210EU2F50I1VG

The 1ST210EU2F50I1VG is an Intel Stratix® 10 TX FPGA in a 2397-ball BGA package, optimized for high-density programmable logic and high-speed I/O. It delivers 2,100,000 logic elements, a large embedded RAM footprint and extensive I/O to address demanding industrial and communications applications.

Stratix 10 TX devices incorporate Intel HyperFlex core architecture and advanced transceiver technology described in the Stratix 10 TX family overview, enabling high aggregate bandwidth and integration for next-generation network, compute and specialized processing systems.

Key Features

• Logic Capacity  2,100,000 logic elements enabling complex, large-scale logic implementation and system integration.
• Embedded Memory  133,169,152 total RAM bits for on-chip buffering, packet processing and algorithm state storage.
• I/O Density  440 user I/Os to support wide parallel interfaces, multiple high-speed links and large external-device connectivity.
• High-speed Transceiver Architecture (series)  Stratix 10 TX family transceivers support dual-mode operation (PAM4 and NRZ) and high aggregate bandwidth, as described in the device overview for the TX series.
• Power and Voltage  Core supply range from 770 mV to 970 mV to match system power domains and regulator designs.
• Package and Mounting  2397-ball FCBGA (50 × 50 mm footprint) in a surface-mount package for dense board-level integration.
• Operating Range and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C and RoHS compliant for environmental requirements.

Typical Applications

• High-performance networking and switching  Large logic capacity and series transceiver technology support complex packet processing and high-bandwidth link aggregation.
• Data center accelerators  On-chip RAM and high I/O density allow implementation of custom compute pipelines and memory-intensive accelerator functions.
• Telecom and backplane systems  Industrial temperature range and robust package options make the device suitable for board-level deployment in telecom equipment.

Unique Advantages

• High logic density: 2,100,000 logic elements provide headroom for complex algorithms, large state machines and multi-function systems on a single FPGA.
• Substantial on-chip RAM: 133,169,152 total RAM bits reduce dependence on external memory for buffering and accelerate data-path implementations.
• Wide I/O support: 440 I/Os enable simultaneous support of many peripherals, parallel buses and external interfaces without major board-level multiplexing.
• Industrial-grade thermal range: −40 °C to 100 °C operation helps ensure reliability across harsher operating environments.
• Compact, high-density package: 2397-BBGA (FCBGA) surface-mount package balances thermal, routing and board-space considerations for high-end designs.
• Regulated core supply range: 770 mV to 970 mV core voltage compatibility eases integration with common point-of-load regulators.

Why Choose 1ST210EU2F50I1VG?

The 1ST210EU2F50I1VG positions itself as a high-capacity, industrial-grade Stratix 10 TX FPGA option for engineers who need extensive logic resources, substantial on-chip RAM and abundant I/O in a compact FCBGA footprint. It is suitable for systems requiring high integration density and reliable operation across a wide temperature range.

Designed for complex networking, compute acceleration and telecom applications, this device brings series-level innovations from the Stratix 10 TX family into a specific package and configuration, offering scalable performance while meeting industrial environmental and RoHS compliance expectations.

Request a quote or submit an inquiry to receive pricing and availability for 1ST210EU2F50I1VG. Our team can provide lead-time details and support for your procurement and design planning.