1ST210EU2F50E1VG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2100000 2397-BBGA, FCBGA

Quantity 232 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262500Number of Logic Elements/Cells2100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits133169152

Overview of 1ST210EU2F50E1VG – Stratix® 10 TX FPGA, 2,100,000 Logic Elements, 440 I/O, 2397‑BBGA

The 1ST210EU2F50E1VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) offered in a 2397‑BBGA (FCBGA) package with surface-mount mounting. It delivers 2,100,000 logic elements and 440 general‑purpose I/O, targeting high‑bandwidth, compute‑dense system designs.

As part of the Stratix 10 TX family, the device combines high logic density, large internal RAM (133,169,152 total bits), and family-level high‑speed transceiver capabilities to address demanding networking, communications, and compute applications while operating over a 0 °C to 100 °C range with a core supply range of 770 mV to 970 mV.

Key Features

  • Core Architecture  Stratix 10 TX family innovations such as the Intel HyperFlex core architecture and 14 nm tri‑gate (FinFET) process deliver improved core performance at the device family level.
  • Logic Density  2,100,000 logic elements provide capacity for large, complex designs and high levels of on‑chip integration.
  • On‑Chip Memory  133,169,152 total RAM bits for data buffering, state storage, and algorithm acceleration within the FPGA fabric.
  • I/O  440 I/O pins to support a wide range of external interfaces and board‑level connectivity.
  • High‑Speed Transceivers (series‑level)  Stratix 10 TX devices support dual‑mode transceivers capable of both 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for high aggregate bandwidth applications.
  • Hard IP (series‑level)  Family features include hardened PCI Express Gen3 and multi‑rate Ethernet MAC IP (10/25/100 Gbps) to accelerate system integration in networking and compute platforms.
  • Package & Mounting  2397‑BBGA (FCBGA) package, 50×50 supplier device package footprint, surface‑mount mounting for high‑density board designs.
  • Electrical & Environmental  Core voltage supply range 0.770 V to 0.970 V; operating temperature range 0 °C to 100 °C; RoHS compliant; device grade: Extended.

Typical Applications

  • Data Center Networking  High logic density and family‑level multi‑100 Gbps Ethernet MAC support enable packet processing, switch fabric, and accelerator offload functions.
  • Telecom & Carrier Optics  Dual‑mode high‑speed transceivers and large on‑chip memory make the device suitable for line cards, aggregation, and backplane implementations.
  • High‑Performance Compute Acceleration  Substantial logic and RAM capacity allow implementation of custom compute kernels and hardware accelerators for throughput‑critical workloads.
  • Switching & Backplane Systems  High I/O count and package density support complex board routing and multi‑lane backplane connectivity in communication systems.

Unique Advantages

  • Very high logic capacity: 2,100,000 logic elements enable consolidation of multiple system functions into a single FPGA to reduce BOM and board area.
  • Large on‑chip RAM: 133,169,152 total RAM bits provide substantial local buffering and state storage to improve throughput and reduce off‑chip memory traffic.
  • High I/O density: 440 I/O pins support complex multi‑interface designs and flexible board partitioning.
  • Family‑level high bandwidth: Stratix 10 TX transceiver technology supports PAM4 and NRZ modes and is designed to deliver multi‑terabit aggregate bandwidth for demanding link requirements.
  • Advanced packaging: 2397‑BBGA FCBGA packaging supports high‑density routing and thermal management for space‑constrained, high‑performance boards.
  • Design‑grade operating range: Extended grade and 0 °C to 100 °C operating temperature suit a wide range of commercial and communications environments.

Why Choose 1ST210EU2F50E1VG?

The 1ST210EU2F50E1VG is positioned for complex, high‑bandwidth systems that require substantial programmable logic, large embedded memory, and a high pin count in a compact FCBGA package. Its specifications align with demanding networking, telecom, and compute acceleration designs that prioritize integration and throughput.

Choosing this Stratix 10 TX device provides designers with a family of advanced architectural features and series‑level transceiver and hard‑IP capabilities, enabling scalable designs and a clear upgrade path within the Stratix 10 TX family.

Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for 1ST210EU2F50E1VG.

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