1ST210EU2F50E2VG

The 1ST210EU2F50E2VG is an Intel Stratix® 10 TX field-programmable gate array supplied in a 2397-BBGA FCBGA package. It combines high logic capacity, large on-chip RAM, and extensive I/O to address high-bandwidth, high‑complexity system designs.

As a Stratix 10 TX device, this FPGA is part of a family that emphasizes advanced core architecture and high-speed transceiver capability. The device delivers a balance of logic resources, memory, and I/O density suitable for demanding communications, networking, and compute-acceleration applications.

Key Features

• Core Capacity — 2,100,000 logic elements provide substantial programmable fabric for complex logic, state machines, and custom accelerators.
• On‑Chip Memory — 133,169,152 total RAM bits for large buffers, FIFOs, and tightly coupled data storage within designs.
• I/O Density — 440 device I/O pins to support wide parallel interfaces, multi-lane transceiver routing, and diverse peripheral connectivity.
• Package and Mounting — 2397-BBGA, FCBGA (supplier package: 2397-FBGA, FC, 50 × 50 mm) in a surface-mount BGA format for high‑density board integration.
• Power Supply — Core supply range of 770 mV to 970 mV to match system power rails and design requirements.
• Operating Range — Specified operating temperature from 0 °C to 100 °C and Extended grade classification.
• Standards and Compliance — RoHS compliant.
• Family-Level Innovations (Stratix 10 TX) — Family features include Intel HyperFlex core architecture, heterogeneous 3D SiP transceiver tiles, hardened IP for PCI Express Gen3 and Ethernet MAC, and high-speed dual-mode transceivers as described in the Stratix 10 TX device overview.

Typical Applications

• High‑Bandwidth Networking — Implement MACs, packet processing, and protocol offloads where high logic capacity and large on-chip RAM support buffering and complex packet workflows.
• Telecom and Backplane Interfaces — Use the device’s I/O density and family transceiver capabilities for multi‑lane backplane and optical module interfaces.
• Compute Acceleration — Deploy custom accelerators and data-path logic that leverage the 2,100,000 logic elements and substantial on-chip RAM for low-latency processing.

Unique Advantages

• High Logic Density: 2.1 million logic elements enable large, integrated designs that reduce external component count and simplify system architecture.
• Significant On‑Chip Memory: 133,169,152 bits of RAM provide room for deep buffering and complex stateful logic without depending on external memory for many use cases.
• Extensive I/O: 440 device I/Os allow broad connectivity to peripherals, multi-lane interfaces, and flexible pin assignments for board-level optimization.
• Advanced Packaging: 2397‑BGA FCBGA in a 50 × 50 mm footprint supports high routing density and thermal management for sophisticated board layouts.
• Family-Level Performance Enhancements: Access to Stratix 10 TX innovations—such as HyperFlex core architecture and hardened high-speed IP—helps accelerate development of high-performance systems.
• Regulatory Compliance: RoHS compliance supports deployment in regions and designs requiring lead‑free components.

Why Choose 1ST210EU2F50E2VG?

The 1ST210EU2F50E2VG positions itself where high logic capacity, substantial on‑chip memory, and wide I/O converge. It is suitable for engineering teams tackling high-bandwidth networking, protocol-heavy communications systems, and compute acceleration tasks that demand integrated programmable logic and memory.

Selecting this Stratix 10 TX device provides a platform aligned with the family’s architectural advancements, enabling scalable designs that can leverage hardened IP and high-speed interfaces described in the Stratix 10 TX device overview while meeting board-level and power-supply constraints common in advanced system designs.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the 1ST210EU2F50E2VG. Our team can provide the next steps to integrate this device into your design cycle.