1ST210EU1F50I2VGAS

The 1ST210EU1F50I2VGAS is an Intel Stratix® 10 TX series FPGA in a 2397-BBGA (FCBGA) package, offering 2,100,000 logic elements and 440 I/O pins in a surface-mount form factor. It targets high-density, high-bandwidth system designs that require large fabric capacity, substantial embedded RAM, and broad I/O capability.

As part of the Stratix 10 TX family, the device benefits from the series’ HyperFlex core architecture and high-performance transceiver technology, delivering integration and performance appropriate for industrial-grade applications over an operating range of −40 °C to 100 °C.

Key Features

• Core Logic  2,100,000 logic elements (LEs) provide substantial programmable fabric for complex digital logic and system integration.
• Embedded Memory  133,169,152 total RAM bits enable large on-chip buffering, state storage, and memory-intensive implementations.
• I/O Density  440 I/O pins support wide parallel interfaces and multiple high-speed links for connectivity to peripherals and memory subsystems.
• High-Speed Transceiver Technology (series feature)  Stratix 10 TX devices include dual-mode transceivers capable of PAM4 and NRZ operation (up to series-stated rates), enabling chip-to-chip, chip-to-module, and backplane links in high-bandwidth applications.
• Hard IP and System Integration (series feature)  The Stratix 10 TX family provides hardened PCI Express Gen3 and multi-rate Ethernet MAC IP blocks and advanced memory controller options to simplify system-level integration.
• Package & Mounting  2397-BBGA (FCBGA) package in a 50×50 supplier device package, designed for surface-mount assembly.
• Power Supply Range  Core supply operation between 770 mV and 970 mV, enabling targeted power delivery design.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for industrial deployment scenarios.
• Regulatory  RoHS compliant.

Typical Applications

• High‑speed networking and switching  Use the device’s high I/O count and Stratix 10 TX transceiver capabilities for backplane, switch fabric, and packet-processing designs requiring substantial bandwidth.
• Chip‑to‑chip and module interfaces  Dual‑mode transceiver support in the Stratix 10 TX family makes the part suitable for chip‑to‑chip and chip‑to‑module links in multi‑board systems.
• Signal processing and acceleration  Large logic capacity and extensive on‑chip RAM support DSP‑intensive workloads and hardware acceleration functions.
• Industrial systems  Industrial temperature range and surface‑mount BBGA packaging enable deployment in robust, long‑lifecycle equipment.

Unique Advantages

• High logic density: 2,100,000 logic elements deliver the capacity to implement complex SoC-level designs within a single FPGA package.
• Substantial on‑chip memory: 133,169,152 bits of RAM reduce external memory dependence and improve data locality for performance-critical tasks.
• Broad I/O and connectivity: 440 I/Os and Stratix 10 TX series transceiver capabilities simplify connections to high-speed peripherals, memory, and backplanes.
• Industrial readiness: Rated for −40 °C to 100 °C operation and supplied in a surface-mount BBGA package suitable for industrial environments.
• Integration with hardened system IP (series benefit): Access to hardened PCIe and Ethernet MAC IP in the Stratix 10 TX family reduces development time for common system interfaces.
• RoHS compliant: Meets lead‑free and environmental requirements for modern electronic products.

Why Choose 1ST210EU1F50I2VGAS?

The 1ST210EU1F50I2VGAS combines large programmable fabric, extensive on‑chip memory, and high I/O density in a single industrial‑grade package, making it well suited for designers who need significant logic capacity and robust connectivity in demanding systems. As a member of the Stratix 10 TX family, it benefits from advanced architecture and transceiver technology that support high-bandwidth system implementations.

This part is intended for teams building complex data paths, acceleration engines, or high‑throughput networking equipment that require scalable FPGA capacity, integrated system IP options, and long-term industrial operation.

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