1ST210EU1F50I1VGAS

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2100000 2397-BBGA, FCBGA

Quantity 1,749 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262500Number of Logic Elements/Cells2100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits133169152

Overview of 1ST210EU1F50I1VGAS – Stratix® 10 TX Field Programmable Gate Array (FPGA), 2,100,000 logic elements, 2397-BBGA

The 1ST210EU1F50I1VGAS is a Stratix® 10 TX FPGA in a 2397-BBGA (FCBGA) package designed for high-bandwidth, high-density programmable systems. Built on the Stratix 10 TX device family and HyperFlex® core architecture, the device targets demanding applications that require large logic capacity, extensive on-chip memory, and advanced high‑speed transceiver capabilities.

Typical use cases include backplane, chip-to-chip and chip-to-module interconnects, high-performance networking and compute acceleration where aggregate transceiver bandwidth, logic density and industrial-grade operation are required.

Key Features

  • Logic Capacity  2,100,000 logic elements providing large programmable fabric for complex algorithms and accelerators.
  • Core Architecture  Intel HyperFlex® core architecture for increased core performance as described in the Stratix 10 TX family overview.
  • On-chip Memory  133,169,152 total RAM bits for buffering, packet processing and algorithmic state; family also documents embedded eSRAM and M20K memory blocks in select devices.
  • High-speed Transceivers  Stratix 10 TX devices support dual-mode transceivers with PAM4 and NRZ operation up to the data rates published for the family, enabling high aggregate bandwidth for backplane and chip/module links.
  • Hard IP Interfaces  Family-level support includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks with dedicated Reed-Solomon FEC options for NRZ and PAM4 signals.
  • I/O and Package  440 I/Os in a surface-mount 2397-BBGA (2397-FBGA, FC 50×50) package optimized for dense board integration.
  • Power  Core voltage supply range: 770 mV to 970 mV, enabling power configurations within the specified family operating range.
  • Industrial Temperature Grade  Operating temperature range −40 °C to 100 °C; Grade listed as Industrial.
  • Compliance  RoHS compliant.

Typical Applications

  • High-speed networking and switches  Use the device’s high logic capacity, extensive RAM and Stratix 10 TX transceiver capability to implement packet processing, MAC offload and FEC for 10/25/100 Gbps Ethernet links.
  • Data center interconnect and backplane systems  Dual-mode transceivers and large I/O count support high-bandwidth chip-to-chip and board-to-board links in dense systems.
  • Compute acceleration and DSP  Large logic fabric and on-chip memory make the device suitable for custom acceleration, signal processing and algorithmic implementations.
  • Telecommunications equipment  Hardened interface IP and high aggregate bandwidth address requirements for packet processing, transceiver-rich line cards and modular network equipment.

Unique Advantages

  • High logic density:  2,100,000 logic elements enable large-scale designs and multiple concurrent hardware functions on a single device.
  • Extensive on-chip memory:  133,169,152 total RAM bits support deep buffering, state storage and high-throughput data manipulation without immediate external memory dependency.
  • Advanced transceiver capability:  Stratix 10 TX family dual-mode transceivers provide PAM4 and NRZ operation for high aggregate bandwidth and flexible link implementations.
  • Industrial-grade operation:  −40 °C to 100 °C operating range and RoHS compliance make the device suitable for demanding industrial deployments.
  • Dense I/O and package:  440 I/Os in a 2397-BBGA (50×50) FCBGA package support complex board-level connectivity and high pin-count designs.
  • Family-level hardened interfaces:  Available hardened PCIe Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks reduce integration effort for common high-speed interfaces.

Why Choose 1ST210EU1F50I1VGAS?

The 1ST210EU1F50I1VGAS brings high logic capacity, substantial on-chip RAM and the Stratix 10 TX family’s transceiver and hardened IP capabilities into a single industrial-grade, surface-mount FCBGA package. It is positioned for engineers implementing high-bandwidth networking, compute acceleration and advanced signal-processing systems that require sizable programmable fabric and robust I/O.

Choosing this Stratix 10 TX device provides a scalable platform for designs that demand large logic resources, extensive memory and high-speed serial links, while meeting industrial temperature and RoHS requirements documented for the device.

Request a quote or submit an inquiry to receive pricing and availability for the 1ST210EU1F50I1VGAS and to discuss how this Stratix 10 TX FPGA can fit your next high-performance design.

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