1ST210EU1F50I1VGAS
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2100000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 1,749 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262500 | Number of Logic Elements/Cells | 2100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 133169152 |
Overview of 1ST210EU1F50I1VGAS – Stratix® 10 TX Field Programmable Gate Array (FPGA), 2,100,000 logic elements, 2397-BBGA
The 1ST210EU1F50I1VGAS is a Stratix® 10 TX FPGA in a 2397-BBGA (FCBGA) package designed for high-bandwidth, high-density programmable systems. Built on the Stratix 10 TX device family and HyperFlex® core architecture, the device targets demanding applications that require large logic capacity, extensive on-chip memory, and advanced high‑speed transceiver capabilities.
Typical use cases include backplane, chip-to-chip and chip-to-module interconnects, high-performance networking and compute acceleration where aggregate transceiver bandwidth, logic density and industrial-grade operation are required.
Key Features
- Logic Capacity 2,100,000 logic elements providing large programmable fabric for complex algorithms and accelerators.
- Core Architecture Intel HyperFlex® core architecture for increased core performance as described in the Stratix 10 TX family overview.
- On-chip Memory 133,169,152 total RAM bits for buffering, packet processing and algorithmic state; family also documents embedded eSRAM and M20K memory blocks in select devices.
- High-speed Transceivers Stratix 10 TX devices support dual-mode transceivers with PAM4 and NRZ operation up to the data rates published for the family, enabling high aggregate bandwidth for backplane and chip/module links.
- Hard IP Interfaces Family-level support includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks with dedicated Reed-Solomon FEC options for NRZ and PAM4 signals.
- I/O and Package 440 I/Os in a surface-mount 2397-BBGA (2397-FBGA, FC 50×50) package optimized for dense board integration.
- Power Core voltage supply range: 770 mV to 970 mV, enabling power configurations within the specified family operating range.
- Industrial Temperature Grade Operating temperature range −40 °C to 100 °C; Grade listed as Industrial.
- Compliance RoHS compliant.
Typical Applications
- High-speed networking and switches Use the device’s high logic capacity, extensive RAM and Stratix 10 TX transceiver capability to implement packet processing, MAC offload and FEC for 10/25/100 Gbps Ethernet links.
- Data center interconnect and backplane systems Dual-mode transceivers and large I/O count support high-bandwidth chip-to-chip and board-to-board links in dense systems.
- Compute acceleration and DSP Large logic fabric and on-chip memory make the device suitable for custom acceleration, signal processing and algorithmic implementations.
- Telecommunications equipment Hardened interface IP and high aggregate bandwidth address requirements for packet processing, transceiver-rich line cards and modular network equipment.
Unique Advantages
- High logic density: 2,100,000 logic elements enable large-scale designs and multiple concurrent hardware functions on a single device.
- Extensive on-chip memory: 133,169,152 total RAM bits support deep buffering, state storage and high-throughput data manipulation without immediate external memory dependency.
- Advanced transceiver capability: Stratix 10 TX family dual-mode transceivers provide PAM4 and NRZ operation for high aggregate bandwidth and flexible link implementations.
- Industrial-grade operation: −40 °C to 100 °C operating range and RoHS compliance make the device suitable for demanding industrial deployments.
- Dense I/O and package: 440 I/Os in a 2397-BBGA (50×50) FCBGA package support complex board-level connectivity and high pin-count designs.
- Family-level hardened interfaces: Available hardened PCIe Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks reduce integration effort for common high-speed interfaces.
Why Choose 1ST210EU1F50I1VGAS?
The 1ST210EU1F50I1VGAS brings high logic capacity, substantial on-chip RAM and the Stratix 10 TX family’s transceiver and hardened IP capabilities into a single industrial-grade, surface-mount FCBGA package. It is positioned for engineers implementing high-bandwidth networking, compute acceleration and advanced signal-processing systems that require sizable programmable fabric and robust I/O.
Choosing this Stratix 10 TX device provides a scalable platform for designs that demand large logic resources, extensive memory and high-speed serial links, while meeting industrial temperature and RoHS requirements documented for the device.
Request a quote or submit an inquiry to receive pricing and availability for the 1ST210EU1F50I1VGAS and to discuss how this Stratix 10 TX FPGA can fit your next high-performance design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018