1ST210EU1F50E2VG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2100000 2397-BBGA, FCBGA

Quantity 891 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262500Number of Logic Elements/Cells2100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits133169152

Overview of 1ST210EU1F50E2VG – Stratix® 10 TX FPGA, 440 I/Os, 2,100,000 logic elements, 2397‑BBGA

The 1ST210EU1F50E2VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 2397‑BBGA FCBGA package with surface‑mount mounting. It combines a high‑density monolithic FPGA fabric with family‑level innovations such as the Intel Hyperflex core architecture and advanced 14 nm tri‑gate (FinFET) process.

Designed for next‑generation high‑bandwidth designs, the device delivers large logic capacity, extensive on‑chip memory, and integrated high‑speed transceiver and hardened IP capabilities to address demanding datacenter, networking, and high‑performance compute connectivity requirements.

Key Features

  • Core & architecture  Intel Hyperflex core architecture implemented in 14 nm tri‑gate (FinFET) technology, delivering the family‑level performance improvements documented for Stratix 10 TX devices.
  • Logic capacity  2,100,000 logic elements for high‑density logic implementations; family devices can scale to higher logic counts where required.
  • On‑chip memory  Total RAM capacity of 133,169,152 bits, with internal M20K blocks and select devices offering embedded eSRAM as described in the device family overview.
  • High‑speed transceivers & interfaces  Family‑level dual‑mode transceivers supporting 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation; hardened IP blocks for PCI Express Gen3 and 10/25/100 Gbps Ethernet are included at the family level.
  • DSP & embedded processing  Hardened floating‑point DSP blocks are part of the Stratix 10 TX feature set; select devices in the family include an embedded quad‑core 64‑bit Arm Cortex‑A53 hard processor system (HPS).
  • I/O & packaging  440 user I/Os in a 2397‑BBGA FCBGA package (supplier package 2397‑FBGA FC, 50×50 mm), surface‑mount mounting.
  • Power & operating range  Core voltage supply range 770 mV to 970 mV; operating temperature 0 °C to 100 °C; device grade: Extended.
  • Standards & compliance  RoHS compliant.

Typical Applications

  • High‑bandwidth networking  Use the device where multi‑lane 10/25/100 Gbps Ethernet and high‑speed PAM4/NRZ transceiver capability are required for switch, router, or line card designs.
  • Data center and acceleration  Implement custom acceleration and offload functions using the large logic array, abundant on‑chip RAM, and hardened PCIe Gen3 IP blocks (family‑level feature).
  • Backplane and chip‑to‑chip connectivity  Leverage dual‑mode transceivers for backplane, board‑to‑board, and chip‑to‑chip links at high aggregate bandwidth.
  • DSP and signal processing  Deploy the device for high‑precision signal processing using the hardened floating‑point DSP resources and extensive logic fabric.

Unique Advantages

  • High logic density: 2,100,000 logic elements enable complex, large‑scale designs without partitioning across multiple FPGAs.
  • Integrated high‑speed I/O: Dual‑mode transceivers and family‑level hardened Ethernet and PCIe IP simplify high‑bandwidth interface design and reduce external component count.
  • Substantial on‑chip memory: 133,169,152 bits of RAM support large buffering, packet processing, and stateful algorithms on‑chip.
  • Robust packaging: 2397‑BBGA FCBGA with 440 I/Os and surface‑mount mounting provides a compact, high‑pin‑count solution for dense board layouts.
  • Operational range and compliance: Extended grade with 0 °C to 100 °C operating range, RoHS compliance, and defined core voltage range for predictable system design.

Why Choose 1ST210EU1F50E2VG?

The 1ST210EU1F50E2VG places large logic capacity, comprehensive memory resources, and Stratix 10 TX family innovations into a single, high‑pin‑count package. It is positioned for engineers building high‑bandwidth, compute‑intensive systems that require integrated transceiver performance and hardened interface IP described in the Stratix 10 TX device overview.

For designs that need scalability in logic and I/O, combined with family‑level architectural advantages such as the Hyperflex core and FinFET process, this device offers a consolidated platform that reduces external components while delivering the documented capabilities of the Stratix 10 TX family.

Request a quote or submit an inquiry to get pricing and availability for the 1ST210EU1F50E2VG. Our team can provide lead‑time and supply details to support your project planning.

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