1ST210EU1F50E1VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2100000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 415 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262500 | Number of Logic Elements/Cells | 2100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 133169152 |
Overview of 1ST210EU1F50E1VG – Stratix® 10 TX FPGA, 2,100,000 logic elements, 440 I/O, 2397-BBGA (FCBGA)
The 1ST210EU1F50E1VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) IC featuring Intel Hyperflex core architecture and high‑speed, dual‑mode transceivers. It provides a large programmable fabric and extensive I/O in a 2397‑BBGA FCBGA package for designs that demand substantial logic capacity and high aggregate transceiver bandwidth.
This device is targeted at systems and designs that require large logic and memory resources along with support for high‑rate serial links and hardened protocol IP available in the Stratix® 10 TX family. Key value propositions include high logic capacity, significant on‑chip RAM, scalable transceiver capability, and platform features described for the Stratix® 10 TX device family.
Key Features
- Core Capacity — 2,100,000 logic elements, implemented on Intel Hyperflex core architecture as part of the Stratix® 10 TX family.
- On‑chip Memory — 133,169,152 total RAM bits to support large buffering, state storage, and complex data paths.
- High‑Speed Transceivers — Family‑level transceiver support includes dual‑mode operation up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip‑to‑chip, chip‑to‑module, and backplane links.
- Ethernet and PCI Express Support — Stratix® 10 TX devices include hardened 10/25/100 Gbps Ethernet MACs and PCI Express Gen3 hard IP as documented for the device family.
- I/O and Package — 440 I/O pins in a surface‑mount 2397‑BBGA (FCBGA) package; supplier device package noted as 2397‑FBGA, FC (50×50).
- Power and Voltage — Core voltage supply range specified at 770 mV to 970 mV.
- Operating Range and Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
- Family Innovations — Family features include Intel 14 nm tri‑gate (FinFET) technology, heterogeneous 3D SiP transceiver tiles, hardened DSP and memory controllers, and options for an embedded quad‑core 64‑bit Arm Cortex‑A53 HPS in select devices.
- Security and Configuration — Device configuration and Secure Device Manager (SDM) features are included in the Stratix® 10 TX device overview.
- Standards — RoHS compliant.
Typical Applications
- High‑rate serial interconnects — Chip‑to‑chip, chip‑to‑module, and backplane links that require PAM4 or NRZ operation at multi‑tens of Gbps.
- Networking and switching subsystems — Designs that leverage hardened Ethernet MACs and large programmable fabric for packet processing and aggregation.
- High‑performance protocol offload — Systems using PCI Express Gen3 and other hardened IP blocks for I/O acceleration and protocol handling.
Unique Advantages
- Large programmable fabric: 2,100,000 logic elements provide the capacity to implement complex algorithms, wide datapaths, and extensive control logic in a single device.
- Substantial on‑chip memory: 133,169,152 RAM bits enable large buffers, deep FIFOs, and state storage without external memory for many functions.
- High‑speed serial capability: Dual‑mode transceivers supporting up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ allow flexible deployment across chip‑to‑chip, module, and backplane topologies.
- Hardened protocol IP: Family‑level inclusion of PCI Express Gen3 and 10/25/100 Gbps Ethernet MACs simplifies integration of common high‑speed interfaces.
- Compact, high‑pin package: 2397‑BBGA FCBGA package with 440 I/O supports dense routing and high I/O count in space‑constrained designs.
- Extended operating range: Grade and temperature range of 0 °C to 100 °C accommodate a broad set of system environments.
Why Choose 1ST210EU1F50E1VG?
The 1ST210EU1F50E1VG brings a large Stratix® 10 TX FPGA fabric together with significant on‑chip memory and high‑rate transceiver capability in a single FCBGA package. It is well suited for designs that require substantial logic and memory resources while also needing scalable, high‑bandwidth serial links and hardened protocol IP provided by the Stratix® 10 TX family.
Selecting this device gives designers access to family innovations such as Intel Hyperflex core architecture, 14 nm tri‑gate technology, and heterogeneous SiP transceiver tiles, enabling scalable implementations and integration of complex system functions within a single programmable device.
Request a quote or submit an inquiry to receive pricing and availability information for 1ST210EU1F50E1VG and to discuss how this Stratix® 10 TX device can meet your project requirements.

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