1ST165EU3F50E3XG

The 1ST165EU3F50E3XG is an Intel Stratix® 10 TX field programmable gate array packaged in a 2397‑BBGA FCBGA for surface‑mount assembly. This device combines high logic density with a broad on‑chip memory footprint and extensive I/O to address high‑bandwidth and compute‑intensive system designs.

Built on the Stratix 10 TX family architecture, the device supports high‑performance core innovations and advanced transceiver technology described for the series, positioning it for demanding applications such as next‑generation networking, high‑speed chip‑to‑chip interconnects, and data center acceleration where performance and integration matter.

Key Features

• Core Logic — 1,650,000 logic elements provide a very large programmable fabric for complex custom logic and acceleration tasks.
• On‑chip Memory — 119,537,664 total RAM bits to support large buffering, packet processing, and data staging within the FPGA fabric.
• I/O and Packaging — 440 user I/O pins in a 2397‑BBGA (2397‑FBGA, FC 50×50) package; surface‑mount FCBGA package suited to compact, board‑level designs.
• Power Supply — Core voltage supply range 820 mV to 880 mV for the device core domains.
• Operating Range and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
• Stratix 10 TX Series Innovations — Series features include the Intel HyperFlex core architecture, dual‑mode transceivers capable of PAM4 and NRZ operation, hardened I/O and protocol IP, and advanced packaging technologies as described in the Stratix 10 TX device overview.
• Compliance — RoHS compliant for environmental regulatory considerations.

Typical Applications

• High‑speed Networking — Implement packet processing, switching, and custom forwarding logic leveraging the device’s large logic capacity and on‑chip RAM.
• Data Center Acceleration — Use for compute acceleration, custom offload functions, and FPGA‑based NICs where dense logic and significant memory are required.
• Backplane and Chip‑to‑Chip Connectivity — Series transceiver capabilities described for Stratix 10 TX devices make this family suitable for high‑bandwidth backplane links and module interconnects.
• Telecom and Optical Interfaces — Deploy protocol processing and FEC engines in designs that demand large logic and memory resources.

Unique Advantages

• High Logic Density: 1,650,000 logic elements deliver capacity for large, complex designs without partitioning into multiple devices.
• Substantial On‑Chip Memory: Nearly 120 Mbit of RAM enables extensive buffering and stateful processing directly on the FPGA fabric, reducing external memory dependence.
• Robust I/O Count and Packaging: 440 I/Os in a 2397‑BBGA FCBGA package support dense board integration and flexible interface routing.
• Designed for High‑Bandwidth Systems: Series‑level transceiver and IP innovations in Stratix 10 TX devices align this product to bandwidth‑heavy applications such as networking and data center interconnects.
• Extended Operating Grade: The device is specified for 0 °C to 100 °C operation, suitable for many enterprise and telecom environments.
• Environmental Compliance: RoHS compliance supports restrictions on hazardous substances in end products.

Why Choose 1ST165EU3F50E3XG?

The 1ST165EU3F50E3XG combines very high logic capacity, a large on‑chip memory resource, and substantial I/O in a compact FCBGA package, making it a strong candidate for engineering teams designing high‑performance networking, compute acceleration, and connectivity solutions. Its Stratix 10 TX family heritage brings series innovations—such as the HyperFlex core architecture and advanced transceiver technology—that align with systems requiring high aggregate bandwidth and dense programmable logic.

This device is targeted at customers who need scalable logic resources, significant internal memory, and the packaging options to integrate into complex board‑level designs while operating within an extended temperature range. The combination of capacity, memory, and I/O supports long‑lived, high‑throughput designs where integration and on‑chip resources reduce BOM complexity and external dependencies.

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