1ST165EU2F50I2VG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1650000 2397-BBGA, FCBGA

Quantity 1,249 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs206250Number of Logic Elements/Cells1650000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits119537664

Overview of 1ST165EU2F50I2VG – Stratix® 10 TX FPGA, 1,650,000 logic elements, 440 I/Os, 2397-BBGA (FCBGA)

The 1ST165EU2F50I2VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) packaged in a 2397-BBGA (FCBGA) format. It combines the Stratix 10 TX family’s HyperFlex® core architecture and heterogeneous transceiver technology to address high-bandwidth, compute-intensive system designs.

Designed for industrial applications, this device offers 1,650,000 logic elements, 119,537,664 bits of internal RAM, and 440 user I/Os, delivering a high-density, power-efficient programmable fabric for networking, communications, and advanced processing applications.

Key Features

  • Core Architecture – Built on the Intel Stratix 10 TX family with HyperFlex® core architecture and Intel 14 nm tri-gate (FinFET) process from the device overview, providing the architectural foundation for high-performance logic.
  • Logic Capacity – 1,650,000 logic elements, supporting large-scale logic integration and complex custom hardware implementations.
  • On‑Chip Memory – 119,537,664 total RAM bits of internal memory for buffering, packet processing, and high-throughput data operations.
  • High‑Speed Transceivers (Series Capability) – Stratix 10 TX series dual-mode transceivers support up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation and are engineered for chip-to-chip, module, and backplane links.
  • Hard IP and Interfaces (Series Capability) – Family-level support includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks with Reed‑Solomon FEC, enabling integration of high-speed packet and I/O subsystems.
  • I/O and Package – 440 user I/Os in a 2397-BBGA FCBGA package (supplier device package: 2397-FBGA, FC 50×50) for high-density board designs and robust connectivity.
  • Power Supply – Core voltage supply range of 770 mV to 970 mV for the device core rails.
  • Industrial Temperature Grade – Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
  • Compliance – RoHS compliant.

Typical Applications

  • High‑Performance Networking: Use in line cards, switches, and routers where large logic capacity and high-speed transceivers enable packet processing and line-rate encryption/decryption.
  • Data Center Infrastructure: Accelerating compute and I/O functions such as FPGA-based NICs, smart NICs, and hardware offloads leveraging the device’s logic density and internal memory.
  • Telecommunications and Backplane Systems: Deploy in high-bandwidth backplane and optical module interfaces that require dual-mode transceivers and hardened Ethernet/IP cores.
  • Signal Processing and Acceleration: Implement DSP pipelines, custom accelerators, and large-scale state machines using the extensive logic elements and on-chip RAM.

Unique Advantages

  • High Logic Density: 1,650,000 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board complexity.
  • Large On‑Chip Memory: Nearly 120 Mb of internal RAM supports large buffers and stateful processing without relying solely on external memory.
  • Robust Industrial Temperature Range: −40 °C to 100 °C rating provides suitability for demanding environmental deployments.
  • Advanced Packaging and I/O: 2397-BBGA (50×50) package with 440 I/Os supports high-density routing and board-level integration.
  • Series-Level High-Speed I/O: Stratix 10 TX family transceiver capabilities and hardened PCIe/Ethernet IPs simplify integration of high-bandwidth links and connectivity.
  • Controlled Core Power: Core supply range (770 mV–970 mV) enables designers to align power delivery to system requirements.

Why Choose 1ST165EU2F50I2VG?

The 1ST165EU2F50I2VG brings the Stratix 10 TX family’s high-density programmable fabric and series-level high-speed transceiver and IP capabilities into an industrial-grade FPGA package. Its combination of 1,650,000 logic elements, substantial on-chip RAM, and 440 I/Os provides the capacity and flexibility needed for complex networking, telecom, and acceleration designs.

Engineers targeting scalable, high-throughput systems will find this device suited to consolidate logic, integrate high-speed interfaces, and meet industrial temperature requirements while relying on Intel’s Stratix 10 TX device family ecosystem and documentation for system integration.

Request a quote or contact sales to discuss availability, pricing, and how the 1ST165EU2F50I2VG can fit into your next high-performance design.

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