1ST165EU2F50I2VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1650000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 1,249 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 206250 | Number of Logic Elements/Cells | 1650000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 119537664 |
Overview of 1ST165EU2F50I2VG – Stratix® 10 TX FPGA, 1,650,000 logic elements, 440 I/Os, 2397-BBGA (FCBGA)
The 1ST165EU2F50I2VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) packaged in a 2397-BBGA (FCBGA) format. It combines the Stratix 10 TX family’s HyperFlex® core architecture and heterogeneous transceiver technology to address high-bandwidth, compute-intensive system designs.
Designed for industrial applications, this device offers 1,650,000 logic elements, 119,537,664 bits of internal RAM, and 440 user I/Os, delivering a high-density, power-efficient programmable fabric for networking, communications, and advanced processing applications.
Key Features
- Core Architecture – Built on the Intel Stratix 10 TX family with HyperFlex® core architecture and Intel 14 nm tri-gate (FinFET) process from the device overview, providing the architectural foundation for high-performance logic.
- Logic Capacity – 1,650,000 logic elements, supporting large-scale logic integration and complex custom hardware implementations.
- On‑Chip Memory – 119,537,664 total RAM bits of internal memory for buffering, packet processing, and high-throughput data operations.
- High‑Speed Transceivers (Series Capability) – Stratix 10 TX series dual-mode transceivers support up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation and are engineered for chip-to-chip, module, and backplane links.
- Hard IP and Interfaces (Series Capability) – Family-level support includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks with Reed‑Solomon FEC, enabling integration of high-speed packet and I/O subsystems.
- I/O and Package – 440 user I/Os in a 2397-BBGA FCBGA package (supplier device package: 2397-FBGA, FC 50×50) for high-density board designs and robust connectivity.
- Power Supply – Core voltage supply range of 770 mV to 970 mV for the device core rails.
- Industrial Temperature Grade – Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
- Compliance – RoHS compliant.
Typical Applications
- High‑Performance Networking: Use in line cards, switches, and routers where large logic capacity and high-speed transceivers enable packet processing and line-rate encryption/decryption.
- Data Center Infrastructure: Accelerating compute and I/O functions such as FPGA-based NICs, smart NICs, and hardware offloads leveraging the device’s logic density and internal memory.
- Telecommunications and Backplane Systems: Deploy in high-bandwidth backplane and optical module interfaces that require dual-mode transceivers and hardened Ethernet/IP cores.
- Signal Processing and Acceleration: Implement DSP pipelines, custom accelerators, and large-scale state machines using the extensive logic elements and on-chip RAM.
Unique Advantages
- High Logic Density: 1,650,000 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board complexity.
- Large On‑Chip Memory: Nearly 120 Mb of internal RAM supports large buffers and stateful processing without relying solely on external memory.
- Robust Industrial Temperature Range: −40 °C to 100 °C rating provides suitability for demanding environmental deployments.
- Advanced Packaging and I/O: 2397-BBGA (50×50) package with 440 I/Os supports high-density routing and board-level integration.
- Series-Level High-Speed I/O: Stratix 10 TX family transceiver capabilities and hardened PCIe/Ethernet IPs simplify integration of high-bandwidth links and connectivity.
- Controlled Core Power: Core supply range (770 mV–970 mV) enables designers to align power delivery to system requirements.
Why Choose 1ST165EU2F50I2VG?
The 1ST165EU2F50I2VG brings the Stratix 10 TX family’s high-density programmable fabric and series-level high-speed transceiver and IP capabilities into an industrial-grade FPGA package. Its combination of 1,650,000 logic elements, substantial on-chip RAM, and 440 I/Os provides the capacity and flexibility needed for complex networking, telecom, and acceleration designs.
Engineers targeting scalable, high-throughput systems will find this device suited to consolidate logic, integrate high-speed interfaces, and meet industrial temperature requirements while relying on Intel’s Stratix 10 TX device family ecosystem and documentation for system integration.
Request a quote or contact sales to discuss availability, pricing, and how the 1ST165EU2F50I2VG can fit into your next high-performance design.

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