1ST165EU2F50I2LGAS
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1650000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 891 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 206250 | Number of Logic Elements/Cells | 1650000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 119537664 |
Overview of 1ST165EU2F50I2LGAS – Stratix® 10 TX Field Programmable Gate Array (FPGA) IC, 1,650,000 Logic Elements, 440 I/O, 2397-BBGA
The 1ST165EU2F50I2LGAS is an Intel Stratix® 10 TX FPGA in a 2397-BBGA (FCBGA) package designed for high-density, high-throughput systems. It integrates a large monolithic FPGA fabric with advanced transceiver-capable architecture intended for demanding communications, data center, and infrastructure applications.
This device delivers a mix of logic capacity, embedded memory, and extensive I/O while supporting industrial temperature ranges and low core-voltage operation to address power-sensitive, performance-oriented designs.
Key Features
- Core Capacity 1,650,000 logic elements provide substantial programmable logic resources for complex designs and high-parallelism implementations.
- Embedded Memory 119,537,664 total RAM bits supply large on-chip storage for buffering, lookup tables, and state storage directly within the FPGA fabric.
- High-Density I/O 440 I/O pins support broad interfacing options for high-channel-count systems and diverse peripheral connectivity.
- Operating Range Industrial grade operation from −40 °C to 100 °C enables deployment in rugged environments and temperature-varied installations.
- Low-Voltage Core 820 mV to 880 mV supply voltage supports low-power core operation and power-optimized system designs.
- Package and Mounting 2397-BBGA, FCBGA package (supplier package: 2397-FBGA, FC 50×50) in a surface-mount form factor for compact board-level integration.
- Advanced Family Features (Series-Level) Stratix 10 TX family innovations include Intel HyperFlex core architecture, dual-mode high-speed transceivers, hardened PCIe and Ethernet MAC IP blocks, and heterogeneous 3D SiP transceiver tiles as described in the device overview.
Typical Applications
- Data Center Networking High logic density and large on-chip memory accommodate packet processing, switching fabrics, and programmable network functions.
- Telecommunications & Optical Transport Extensive I/O and series-level high-speed transceiver capabilities make this device suitable for line-rate protocol handling and transport aggregation.
- High-Performance Computing Acceleration Large logic resources and embedded RAM enable implementation of custom accelerators, preprocessors, and data-path engines.
- Infrastructure & Industrial Systems Industrial temperature rating and surface-mount packaging support deployment in communications infrastructure and industrial equipment.
Unique Advantages
- Massive Programmable Logic: 1,650,000 logic elements give designers the headroom to integrate complex algorithms and parallel processing blocks on a single device.
- Substantial On-Chip Memory: 119,537,664 total RAM bits reduce external memory dependency and improve system latency for buffering and real-time processing.
- Broad I/O Count: 440 I/O pins enable rich peripheral interfaces and multi-channel front-end connectivity without extensive external multiplexing.
- Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in temperature-variable environments.
- Power-Efficient Core Voltage: 820 mV to 880 mV supply range supports low-voltage system architectures and power-optimized designs.
- Compact Surface-Mount Package: 2397-BBGA (2397-FBGA, 50×50 supplier package) offers a high-density footprint for board-level space savings.
Why Choose 1ST165EU2F50I2LGAS?
The 1ST165EU2F50I2LGAS positions itself for designs that require a combination of very large programmable logic, significant on-chip memory, and extensive I/O in an industrial-grade FPGA. Its low-voltage core operation and surface-mount 2397-BBGA package support compact, power-conscious system designs while the family-level Stratix 10 TX innovations provide a platform aligned with high-bandwidth and compute-intensive applications.
This device is well suited for engineering teams building scalable, performance-focused systems in networking, telecom, industrial infrastructure, and compute acceleration where integration density, thermal robustness, and on-chip resources are key selection criteria.
Request a quote or submit a sales inquiry to get pricing, availability, and additional technical support for the 1ST165EU2F50I2LGAS Stratix® 10 TX FPGA.

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