1ST165EU2F50I2LGAS

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1650000 2397-BBGA, FCBGA

Quantity 891 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs206250Number of Logic Elements/Cells1650000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits119537664

Overview of 1ST165EU2F50I2LGAS – Stratix® 10 TX Field Programmable Gate Array (FPGA) IC, 1,650,000 Logic Elements, 440 I/O, 2397-BBGA

The 1ST165EU2F50I2LGAS is an Intel Stratix® 10 TX FPGA in a 2397-BBGA (FCBGA) package designed for high-density, high-throughput systems. It integrates a large monolithic FPGA fabric with advanced transceiver-capable architecture intended for demanding communications, data center, and infrastructure applications.

This device delivers a mix of logic capacity, embedded memory, and extensive I/O while supporting industrial temperature ranges and low core-voltage operation to address power-sensitive, performance-oriented designs.

Key Features

  • Core Capacity  1,650,000 logic elements provide substantial programmable logic resources for complex designs and high-parallelism implementations.
  • Embedded Memory  119,537,664 total RAM bits supply large on-chip storage for buffering, lookup tables, and state storage directly within the FPGA fabric.
  • High-Density I/O  440 I/O pins support broad interfacing options for high-channel-count systems and diverse peripheral connectivity.
  • Operating Range  Industrial grade operation from −40 °C to 100 °C enables deployment in rugged environments and temperature-varied installations.
  • Low-Voltage Core  820 mV to 880 mV supply voltage supports low-power core operation and power-optimized system designs.
  • Package and Mounting  2397-BBGA, FCBGA package (supplier package: 2397-FBGA, FC 50×50) in a surface-mount form factor for compact board-level integration.
  • Advanced Family Features (Series-Level)  Stratix 10 TX family innovations include Intel HyperFlex core architecture, dual-mode high-speed transceivers, hardened PCIe and Ethernet MAC IP blocks, and heterogeneous 3D SiP transceiver tiles as described in the device overview.

Typical Applications

  • Data Center Networking  High logic density and large on-chip memory accommodate packet processing, switching fabrics, and programmable network functions.
  • Telecommunications & Optical Transport  Extensive I/O and series-level high-speed transceiver capabilities make this device suitable for line-rate protocol handling and transport aggregation.
  • High-Performance Computing Acceleration  Large logic resources and embedded RAM enable implementation of custom accelerators, preprocessors, and data-path engines.
  • Infrastructure & Industrial Systems  Industrial temperature rating and surface-mount packaging support deployment in communications infrastructure and industrial equipment.

Unique Advantages

  • Massive Programmable Logic: 1,650,000 logic elements give designers the headroom to integrate complex algorithms and parallel processing blocks on a single device.
  • Substantial On-Chip Memory: 119,537,664 total RAM bits reduce external memory dependency and improve system latency for buffering and real-time processing.
  • Broad I/O Count: 440 I/O pins enable rich peripheral interfaces and multi-channel front-end connectivity without extensive external multiplexing.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in temperature-variable environments.
  • Power-Efficient Core Voltage: 820 mV to 880 mV supply range supports low-voltage system architectures and power-optimized designs.
  • Compact Surface-Mount Package: 2397-BBGA (2397-FBGA, 50×50 supplier package) offers a high-density footprint for board-level space savings.

Why Choose 1ST165EU2F50I2LGAS?

The 1ST165EU2F50I2LGAS positions itself for designs that require a combination of very large programmable logic, significant on-chip memory, and extensive I/O in an industrial-grade FPGA. Its low-voltage core operation and surface-mount 2397-BBGA package support compact, power-conscious system designs while the family-level Stratix 10 TX innovations provide a platform aligned with high-bandwidth and compute-intensive applications.

This device is well suited for engineering teams building scalable, performance-focused systems in networking, telecom, industrial infrastructure, and compute acceleration where integration density, thermal robustness, and on-chip resources are key selection criteria.

Request a quote or submit a sales inquiry to get pricing, availability, and additional technical support for the 1ST165EU2F50I2LGAS Stratix® 10 TX FPGA.

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