1ST165EU2F50I2VGAS

The 1ST165EU2F50I2VGAS is an Intel Stratix® 10 TX family FPGA in a 2397-BBGA FCBGA package, designed for high-bandwidth, compute-intensive systems. It combines large programmable logic capacity with advanced Stratix 10 TX architecture elements to address demanding communications, networking and acceleration applications.

As a member of the Stratix 10 TX family, this device leverages the HyperFlex® core architecture, high-speed dual-mode transceivers, and hardened IP blocks to deliver a balance of core performance, transceiver bandwidth, and integration for system designs that require large logic capacity and high aggregate I/O throughput.

Key Features

• Logic Capacity  Features 1,650,000 logic elements, providing substantial programmable fabric for complex designs and large-scale hardware acceleration.
• On-chip Memory  Contains 119,537,664 total RAM bits to support large buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Density  Provides 440 device I/O pins to support broad interfacing to external components, mezzanine modules, and backplanes.
• Advanced Core Architecture  Built on the Intel Stratix 10 TX HyperFlex® core architecture, which the datasheet cites as delivering increased core performance versus previous generations.
• High-speed Transceivers (Family Capability)  Stratix 10 TX devices feature dual‑mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip-to-chip, module, and backplane links (family-level feature).
• Hardened IP Blocks (Family Capability)  Includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks across the Stratix 10 TX family to simplify implementation of high-performance interfaces.
• Power and Voltage  Operates from a core supply range of 770 mV to 970 mV to match system power-rail requirements for the device core.
• Package and Mounting  Delivered in a 2397-BBGA (FCBGA) package, supplier package noted as 2397-FBGA, FC (50×50), for surface-mount PCB assembly.
• Industrial Grade Temperature  Rated for an operating temperature range of −40 °C to 100 °C, suitable for industrial environments.
• Compliance  RoHS compliant, meeting common environmental and materials standards.

Typical Applications

• High-speed Networking  Implements packet processing, MAC/FEC offload and high-bandwidth switching using the device’s abundant logic, on-chip RAM, and family-level hardened Ethernet MAC IP.
• Data Center Acceleration  Supports hardware acceleration workloads and custom offload engines where large logic capacity and wide memory resources are required.
• Telecom Backplane and Module Links  Enables chip-to-chip, module, and backplane connectivity leveraging the Stratix 10 TX dual-mode transceiver capabilities (family-level feature).
• PCI Express Systems  Integrates with host systems using hardened PCI Express Gen3 IP (family-level feature) for high-throughput interfacing.

Unique Advantages

• Highly Scalable Logic Capacity: 1,650,000 logic elements support large designs and multi-function systems without external ASICs for many tasks.
• Substantial On‑Chip Memory: Nearly 120 million RAM bits reduce external memory dependence for buffering and state retention.
• High I/O Count: 440 I/O pins allow flexible partitioning of interfaces across system buses, control signals, and high-speed channels.
• Industrial Temperature Rating: −40 °C to 100 °C operating range aligns with industrial deployment requirements.
• Compact, High-density Package: 2397-BBGA (50×50) FCBGA package delivers high pin-count in a surface-mount form factor for dense system boards.
• Design Ecosystem (Family Features): Stratix 10 TX family-level innovations—HyperFlex core architecture, transceiver technology, hardened PCIe and Ethernet IP—streamline implementation of demanding systems.

Why Choose 1ST165EU2F50I2VGAS?

The 1ST165EU2F50I2VGAS provides a compelling combination of very large programmable logic, extensive on-chip memory, and high I/O density in a single industrial‑grade FCBGA package. It is positioned for customers implementing high-throughput networking, compute acceleration, and telecom applications that require significant fabric capacity and robust thermal and voltage operating ranges.

Choosing this Stratix 10 TX device offers scalability for evolving designs and access to the Stratix 10 TX family features—advanced core architecture and high-speed transceiver capabilities—while maintaining environmental compliance and industrial temperature operation for reliable long-term deployment.

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