1ST165EU3F50I3VG

The 1ST165EU3F50I3VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 2397-BBGA FCBGA package. It combines a high-density programmable fabric with family-level innovations such as the Intel HyperFlex® core architecture and high-speed dual-mode transceivers for demanding, bandwidth-intensive system designs.

Intended for applications that require large logic capacity, abundant internal memory, and high I/O bandwidth, this industrial-grade device supports a wide operating temperature range and low-voltage core operation for integration into robust embedded and communications systems.

Key Features

• Core Architecture  Intel HyperFlex® core architecture as described for the Stratix 10 TX family, delivering increased core performance compared to previous-generation architectures.
• Logic Capacity  1,650,000 logic elements, providing substantial programmable resources for complex logic, control, and packet-processing functions.
• On‑Chip Memory  119,537,664 total RAM bits to support large buffering, lookup tables, and intermediate data storage required by high-throughput designs.
• High‑Speed I/O  440 I/Os to enable extensive external device interfacing and system-level connectivity.
• Transceiver Capability (Family)  Stratix 10 TX family transceivers support dual-mode operation (57.8 Gbps PAM4 and 28.9 Gbps NRZ) and family descriptions note up to 144 full duplex transceiver channels for high-bandwidth board, module, and backplane links.
• Hardened Interfaces (Family)  Family-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks with Reed-Solomon FEC support for NRZ and PAM4 signals.
• Power and Voltage  Core supply voltage specified from 770 mV to 970 mV to match low-voltage FPGA power domains.
• Package & Mounting  2397-BBGA FCBGA package (supplier device package: 2397-FBGA, FC, 50×50) in a surface-mount form factor suitable for high-density PCB integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• High-Performance Networking  Packet processing, Ethernet MAC offload, and line-rate framing where large logic capacity and high-speed transceivers are required.
• Data Center Interconnects  Backplane and chip-to-chip links that leverage the family’s dual-mode transceivers and large on-chip memory for buffering and traffic aggregation.
• Accelerator and Compute Appliances  Custom hardware acceleration and data-path engines that benefit from extensive logic elements and abundant RAM bits.
• Communications Infrastructure  Systems needing hardened PCI Express and Ethernet IP blocks for modular, high-throughput I/O and control functions.

Unique Advantages

• High Logic Density:  1,650,000 logic elements enable complex, large-scale designs without immediate partitioning across multiple devices.
• Large On‑Chip Memory:  Nearly 120 Mbits of RAM supports deep buffering and local data storage to reduce external memory dependencies.
• Extensive I/O Count:  440 I/Os provide flexibility for interfacing to a wide range of peripherals, PHYs, and board-level signals.
• Industrial Temperature Range:  Operation from −40 °C to 100 °C makes the device suitable for harsh or thermally variable environments.
• Low-Voltage Core Operation:  Core supply range of 770–970 mV aligns with modern low-power FPGA power domains, supporting efficient system power design.
• Family-Level High-Speed Connectivity:  Stratix 10 TX family features dual-mode transceivers and hardened Ethernet/PCIe IP to accelerate development of high-bandwidth systems.

Why Choose 1ST165EU3F50I3VG?

1ST165EU3F50I3VG positions itself as a high-density Stratix 10 TX FPGA option for engineers building bandwidth- and logic-intensive systems. Its combination of 1,650,000 logic elements, substantial on-chip RAM, and 440 I/Os makes it suitable for complex packet-processing, compute-acceleration, and communication infrastructure designs that require robust thermal and voltage margins.

As an industrial-grade device in a high-density FCBGA package, it supports designs that need long-term scalability, significant programmable resources, and family-level transceiver and hardened-IP capabilities to reduce system development time and BOM complexity.

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