1ST210EU1F50E2LG

The 1ST210EU1F50E2LG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC designed for high-bandwidth, compute-intensive system designs. As a member of the Intel Stratix 10 TX family, it incorporates the family’s HyperFlex core architecture and high-speed transceiver technology to address demanding networking, communications, and advanced compute applications.

This device combines a large programmable fabric with substantial on-chip RAM and high I/O density in a 2397-BBGA FCBGA package, providing a compact, surface-mount solution for systems that require significant logic capacity, memory, and transceiver capability.

Key Features

• Core Architecture HyperFlex™-based Stratix 10 TX family architecture delivering elevated core performance as described in the device family overview.
• Logic Capacity 2,100,000 logic elements, providing large-scale programmable fabric for complex logic and compute functions.
• On‑Chip Memory 133,169,152 total RAM bits to support buffering, packet processing, and large state machines.
• High-Speed Transceivers (family feature) Family-level dual‑mode transceivers support PAM4 and NRZ operation with data rates up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for high-bandwidth chip-to-chip, chip-to-module, and backplane applications.
• I/O Density 440 user I/Os for extensive peripheral connectivity and multi-channel interfacing.
• Interfaces and Hard IP (family feature) Family-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MACs with Reed‑Solomon FEC options, enabling common high-speed system protocols.
• Package & Mounting 2397‑BBGA, FCBGA (2397‑FBGA, FC 50×50) package in a surface-mount form factor for compact board-level integration.
• Power and Operating Range Core supply range 820 mV to 880 mV; operating temperature rated 0 °C to 100 °C; Grade: Extended.
• Standards and Compliance RoHS compliant.

Typical Applications

• High‑Performance Networking 10/25/100 Gbps Ethernet MACs and high‑speed transceivers support packet processing, switching, and line-card designs.
• Telecommunications and Backplane Systems Dual‑mode transceiver capability and high aggregate bandwidth suit backplane and chip‑to‑module interconnects.
• Compute Acceleration and Packet Processing Large logic capacity and substantial on‑chip RAM enable complex hardware acceleration and real‑time data path functions.
• Multi‑Lane Serial Interfaces High I/O count and family transceiver features support multi‑channel SERDES and cross‑module connectivity.

Unique Advantages

• High logic density: 2,100,000 logic elements provide the capacity needed for large, complex designs.
• Substantial on‑chip memory: 133,169,152 RAM bits reduce dependence on external memory for buffering and state storage.
• Extensive I/O: 440 I/O pins enable broad peripheral and multi‑lane serial interface connectivity.
• Advanced packaging: 2397‑BBGA FCBGA package offers a compact surface‑mount footprint for high‑density boards.
• Low‑voltage core operation: 0.82–0.88 V supply range supports modern low‑power core requirements.
• Extended temperature grade: Rated 0 °C to 100 °C for applications requiring extended commercial operating range.

Why Choose 1ST210EU1F50E2LG?

The 1ST210EU1F50E2LG combines large programmable fabric, high on‑chip memory, and a high I/O count in a compact FCBGA package, making it suitable for systems that require significant logic resources and bandwidth. As part of the Intel Stratix 10 TX family, it benefits from the family’s advanced core architecture and high‑speed transceiver capabilities described in the device overview.

This device is well suited for engineers building high‑bandwidth networking, telecommunications, and compute acceleration platforms who need scalable logic capacity, abundant RAM, and extensive connectivity in a surface‑mount FPGA solution.

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