1ST210EU1F50I2LG

The 1ST210EU1F50I2LG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC designed for high-bandwidth, high-performance system designs. It combines a monolithic 14 nm FPGA fabric with advanced transceiver tiles and system-level integration techniques to address demanding networking, compute acceleration, and backplane/interface applications.

Built around the Intel HyperFlex core architecture and heterogeneous 3D SiP transceiver tiles, this device delivers a large logic capacity and dense memory while providing hardened protocol IP and industry-grade thermal and supply specifications for robust embedded system deployment.

Key Features

• Core & logic capacity  Monolithic FPGA fabric featuring 2,100,000 logic elements to support large, complex designs and high-density logic implementations.
• Memory resources  133,169,152 total RAM bits of on-chip memory to support buffering, packet processing, and large state machines.
• High-speed transceivers  Dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation; the Stratix 10 TX family supports high aggregate transceiver bandwidth for chip-to-chip, chip-to-module, and backplane links.
• Hardened protocol IP  Includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP options and related FEC functionality, enabling efficient implementation of common high-speed interfaces.
• DSP and compute  Variable-precision DSP blocks and architecture innovations (HyperFlex core) for improved core performance in signal processing and acceleration tasks.
• Package and I/O  Surface-mount 2397-BBGA FCBGA package (supplier package: 2397-FBGA, FC 50×50) with 440 I/O pins for dense board integration and broad peripheral connectivity.
• Power and thermal  Core supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C suitable for industrial environments.
• System integration  Advanced packaging using heterogeneous 3D SiP and Embedded Multi-die Interconnect Bridge (EMIB) technologies to integrate transceiver tiles and monolithic fabric efficiently.
• Device management and security  Includes configuration and secure device management features documented for the Stratix 10 TX device family.
• Compliance  RoHS compliant.

Typical Applications

• High-speed networking and switching  Implements 10/25/100 Gbps Ethernet MACs and high-rate transceivers for packet processing, routing, and switch fabric functions.
• Data center acceleration  Large logic capacity and on-chip memory support hardware acceleration, custom packet processing, and compute offload in server and appliance platforms.
• Backplane and optical module interfaces  Dual-mode transceivers and high aggregate bandwidth enable chip-to-chip, chip-to-module, and backplane interconnects in communications systems.
• High-performance signal processing  Variable-precision DSP blocks and extensive RAM resources support demanding DSP tasks in test equipment, telecom, and RF subsystems.

Unique Advantages

• High logic and memory density:  2,100,000 logic elements and 133,169,152 RAM bits provide the capacity to implement large, integrated systems on a single device.
• Dual-mode high-speed I/O:  Transceivers supporting 57.8 Gbps PAM4 and 28.9 Gbps NRZ provide flexibility for next-generation link architectures and legacy NRZ links.
• Hardened protocol IP:  Integrated PCIe Gen3 and high-speed Ethernet MAC IP reduce design effort and accelerate time to deployment for networking and server applications.
• Advanced packaging and integration:  Heterogeneous 3D SiP and EMIB packaging allow efficient integration of transceiver tiles with the monolithic core fabric, minimizing board-level complexity.
• Industrial operating range:  Rated for −40 °C to 100 °C operation to meet industrial environment requirements.
• Low-voltage core operation:  820 mV to 880 mV supply range supports low-voltage system design practices and power domain planning.

Why Choose 1ST210EU1F50I2LG?

The 1ST210EU1F50I2LG delivers a combination of high logic capacity, substantial on-chip memory, and advanced transceiver technology suitable for demanding networking, compute acceleration, and high-speed interface applications. Its industrial operating range and packaged integration options make it appropriate for robust system designs that require both bandwidth and large FPGA fabric resources.

Designed around the Stratix 10 TX architecture, this device is appropriate for engineering teams building high-performance, scalable platforms where hardened protocol IP, flexible transceiver modes, and large FPGA resources reduce development complexity and support long-term product deployment.

Request a quote or submit an RFQ to receive pricing and availability for the 1ST210EU1F50I2LG.