1ST210EU1F50I2LGAS

The 1ST210EU1F50I2LGAS is an Intel Stratix® 10 TX FPGA delivered in a 2397-BBGA FCBGA package. It combines a high-density monolithic FPGA fabric with the Stratix 10 TX series' Hyperflex core architecture and advanced heterogeneous packaging to address high-bandwidth, compute-intensive system designs.

With 2,100,000 logic elements, 133,169,152 bits of on-chip RAM, and dual-mode high-speed transceiver capability described for the Stratix 10 TX family, this device targets applications requiring large logic capacity, significant on-chip memory, and extensive I/O connectivity within an industrial temperature range.

Key Features

• Core Architecture  Intel Stratix 10 TX Hyperflex core architecture is referenced for the family, delivering notable core performance improvements compared to previous generations.
• Logic Capacity  2,100,000 logic elements provide very high programmable logic density for complex FPGA designs.
• On-Chip Memory  133,169,152 total RAM bits enable large buffering, caching, and state storage directly in the FPGA fabric.
• Transceivers & High-Speed I/O  The Stratix 10 TX family includes dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation; this part exposes 440 I/O pins for broad system interfacing.
• Hardened IP and System Interfaces  Family-level features include hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks and Reed-Solomon FEC options for high-throughput protocol support.
• Package & Mounting  Surface-mount 2397-BBGA (supplier package noted as 2397-FBGA, FC 50×50) for high-pin-count system integration.
• Power and Operating Range  Specified core voltage supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C suitable for industrial deployments.
• Security and Configuration  Family documentation references device configuration features and a Secure Device Manager (SDM) for protected configuration and management.
• Compliance  RoHS compliant.

Typical Applications

• High‑performance Networking  Used in line cards, switches, and routers where large logic capacity and high-speed transceivers (PAM4/NRZ modes in the family) are required for multi-terabit aggregate bandwidth.
• Telecom and Datacenter Infrastructure  Suitable for systems requiring hardened PCIe and Ethernet MAC IP blocks, large on-chip RAM for buffering, and industrial operating temperatures.
• Backplane and Chip‑to‑Chip Connectivity  The family-level transceiver data rates and the device's high I/O count support backplane, chip-to-chip, and module interconnect applications.
• High‑density FPGA Compute  Ideal for compute- and logic-intensive acceleration tasks that benefit from the device's large logic element count and substantial embedded memory.

Unique Advantages

• High logic density: 2,100,000 logic elements provide headroom for complex designs and large-scale integration on a single device.
• Significant on-chip memory: 133,169,152 total RAM bits reduce external memory dependence for many buffering and state-storage needs.
• Extensive I/O and high-speed links: 440 I/O pins plus family-level dual-mode transceivers (PAM4/NRZ) enable diverse, high-bandwidth system interfaces.
• Industrial operating range: Specified to operate from −40 °C to 100 °C, supporting deployments in industrial environments.
• Hardened protocol IP (family): Availability of PCIe Gen3 and multi-rate Ethernet MAC IP blocks simplifies integration of common high-speed protocols.
• Advanced package options: High-pin-count 2397-BBGA / 2397-FBGA (50×50) package provides the connectivity needed for dense board-level designs.

Why Choose 1ST210EU1F50I2LGAS?

The 1ST210EU1F50I2LGAS delivers a combination of high logic capacity, substantial embedded RAM, and extensive I/O in a high-pin-count BGA package—making it a fit for systems that require dense programmable logic and on-chip memory within industrial temperature limits. As part of the Intel Stratix 10 TX family, it aligns with the series’ Hyperflex architecture and high-speed transceiver capabilities described in the device overview.

This part is appropriate for engineering teams building high-bandwidth networking, telecom, or compute-accelerator systems that need large, integrated FPGA resources and industrial-grade operating range while leveraging family-level hardened IP and advanced packaging innovations.

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