1ST210EU2F50E2LG

The 1ST210EU2F50E2LG is an Intel Stratix® 10 TX family FPGA offering 2,100,000 logic elements in a 2397-ball FCBGA package. The device implements Intel's Hyperflex® core architecture and targets high-bandwidth, high-density programmable system designs.

Designed for demanding communications, data center, and high-performance compute applications, the Stratix 10 TX series combines a monolithic 14 nm FPGA fabric with heterogeneous transceiver tiles and high aggregate bandwidth to address next-generation system requirements.

Key Features

• Logic Capacity  2,100,000 logic elements providing substantial programmable fabric for complex designs.
• On-chip Memory  133,169,152 total RAM bits to support large buffering, packet processing, and data staging needs.
• I/O Density  440 device I/O pins enabling extensive external connectivity and high-pin-count system integration.
• Core Architecture  Intel Hyperflex® core architecture (Stratix 10 TX family) delivering improved core performance for timing-critical logic.
• High-speed Transceivers (Series Feature)  Stratix 10 TX devices in the family include dual‑mode transceivers capable of PAM4 and NRZ operation for high-bandwidth chip-to-chip, module, and backplane links.
• Package and Mounting  2397-BBGA FCBGA (2397-FBGA, FC 50×50 supplier package) in a surface-mount form factor for dense board-level integration.
• Power and Voltage  Core voltage supply specified from 820 mV to 880 mV for the FPGA core domain.
• Operating Temperature  Rated for 0 °C to 100 °C operating range and designated as Extended grade.
• Compliance  RoHS-compliant status for regulatory environmental requirements.
• Family-level Hardened IP  Stratix 10 TX family documentation highlights hardened PCI Express Gen3 and multi-rate Ethernet MAC/Forward Error Correction IP blocks available across the series.

Typical Applications

• High-speed Networking: System-level switching, packet processing, and line-card designs that require high logic density and large on-chip memory for buffering and flow control.
• Data Center Accelerators: FPGA-based acceleration and custom processing where large logic capacity and substantial RAM bits enable complex algorithms and large datasets.
• Telecommunications Infrastructure: Backplane and module interconnects leveraging the family’s high-speed transceiver capability for NRZ and PAM4 links.
• High-performance Compute: Custom compute and signal-processing pipelines that benefit from the Stratix 10 TX core architecture and high I/O count for system connectivity.

Unique Advantages

• High Logic and Memory Density: 2,100,000 logic elements and 133,169,152 RAM bits provide headroom for complex, large-scale designs without immediate need for external resources.
• Extensive I/O Connectivity: 440 I/O pins support rich external interfacing options for multi-lane and multi-protocol designs.
• Advanced Core Architecture: Hyperflex® core architecture (Stratix 10 TX family) improves timing performance for critical datapaths and complex logic.
• Robust Packaging: 2397-ball FCBGA package and surface-mount mounting enable compact board layouts and reliable system integration.
• Low-voltage Core Operation: 820 mV – 880 mV core supply range supports modern low-voltage power domains and efficient power delivery design.
• Extended Temperature Grade: Rated 0 °C to 100 °C to meet a broad range of commercial and extended-environment deployment scenarios.

Why Choose 1ST210EU2F50E2LG?

The 1ST210EU2F50E2LG combines substantial logic resources, large on-chip memory, and a high I/O count in a single 2397-BBGA package, making it suitable for designers building high-throughput, logic- and memory-intensive systems. As part of the Stratix 10 TX family, it benefits from Intel's Hyperflex core architecture and the family's focus on high aggregate transceiver bandwidth and hardened system IP.

This device is well suited to engineering teams that require scalable FPGA fabric, dense connectivity, and the ability to implement advanced networking, compute acceleration, or telecom functions while maintaining compact board-level packaging and extended operating temperature support.

Request a quote or submit a pricing inquiry to evaluate 1ST210EU2F50E2LG for your next high-performance FPGA design project.