1ST210EU2F50I1VGAS

The 1ST210EU2F50I1VGAS is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 2397-ball FCBGA package. This industrial-grade device combines Intel HyperFlex® core architecture and high-density programmable fabric with a broad set of I/O and memory resources to address high-bandwidth, compute‑intensive system designs.

Designed for applications that demand large logic capacity, extensive on-chip RAM, and high-speed transceivers, this device offers a balance of performance and integration for next-generation networking, telecom, and data‑centric systems.

Key Features

• Logic Capacity  2,100,000 logic elements (LEs) providing a high-density programmable fabric for complex logic integration and system consolidation.
• On-chip Memory  133,169,152 total RAM bits to support large buffering, packet processing, and dataflow-centric designs.
• I/O Resources  440 user I/O pins delivered through a 2397-BBGA (2397-FBGA, 50×50) package to support broad interfacing requirements.
• Transceiver Technology  Series-level Stratix 10 TX dual‑mode transceivers capable of PAM4 (57.8 Gbps) and NRZ (28.9 Gbps) operation for chip‑to‑chip, chip‑to‑module, and backplane links.
• Core Architecture  Intel HyperFlex® core architecture (series feature) for improved core performance in high‑throughput designs.
• Embedded Processing (Series Feature)  Select Stratix 10 TX devices include an embedded quad‑core 64‑bit Arm Cortex‑A53 hard processor system (HPS) for application‑class processing integration.
• High-performance IP  Series-level hardened IP including PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC with Reed‑Solomon FEC support to streamline high-speed protocol implementations.
• Power and Supply  Operates from a supply range of 770 mV to 970 mV to support optimized core power delivery schemes.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C for use in industrial environments.
• Package and Mounting  2397-ball FCBGA (surface-mount) package in a 50×50 mm footprint to support dense board-level integration.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• High‑Performance Networking  Implements large-scale packet processing, line cards, and switch/router functions using extensive logic, on-chip RAM, and high-speed Ethernet/serial interfaces.
• Telecommunications Backplanes and Modules  Supports chip‑to‑chip, chip‑to‑module, and backplane links with dual‑mode transceivers for PAM4 and NRZ signaling.
• Data Center Infrastructure  Enables aggregation, protocol bridging, and accelerator control where high aggregate bandwidth and flexible logic are required.
• Custom Compute and DSP  Accommodates large custom datapaths and buffering requirements with extensive LEs and on‑chip RAM for signal processing workloads.

Unique Advantages

• High Logic Density:  2.1M logic elements allow integration of complex system functions and consolidation of multiple discrete components.
• Large On‑Chip Memory:  133 Mbit of RAM supports deep buffering and state storage for high‑throughput data paths.
• Advanced Transceiver Capability:  Dual‑mode transceivers (PAM4/NRZ) enable flexible deployment across chip, module, and backplane interconnects.
• Industrial Temperature Rating:  Operation from −40°C to 100°C broadens deployment to industrial environments requiring extended thermal range.
• Integrated High-Speed Interfaces:  Series-level hardened PCIe Gen3 and multi‑rate Ethernet MAC IP reduce development time for protocol implementations.
• Compact, High‑Pin Package:  2397-BBGA package delivers 440 I/O in a 50×50 mm footprint to maximize board-level connectivity density.

Why Choose 1ST210EU2F50I1VGAS?

This Stratix® 10 TX FPGA combines substantial logic capacity, extensive on‑chip RAM, and high‑speed transceiver capabilities in an industrial‑rated, high‑pin‑count FCBGA package. It is positioned for designs that require large programmable resources alongside multi‑Gbps serial connectivity and industry‑grade operating range.

Engineers targeting high‑bandwidth networking, telecom modules, and data‑center infrastructure will find the 1ST210EU2F50I1VGAS suitable for consolidating functionality, accelerating time‑to‑market, and supporting scalable system architectures backed by Intel's Stratix 10 TX device family features.

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