1ST210EU2F50I2LG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2100000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 1,459 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262500 | Number of Logic Elements/Cells | 2100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 133169152 |
Overview of 1ST210EU2F50I2LG – Stratix® 10 TX FPGA, 2,100,000 logic elements, 440 I/O
The 1ST210EU2F50I2LG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) in a 2397-BBGA/FCBGA package, designed for high-bandwidth, high-performance system designs. It integrates a monolithic 14 nm FPGA fabric with advanced HyperFlex® core architecture and heterogeneous transceiver tiles to address demanding applications in networking, telecom, and compute acceleration.
This device provides 2,100,000 logic elements, 133,169,152 bits of internal RAM, and 440 I/O pins, while supporting a supply voltage range of 820 mV to 880 mV and operation across an industrial temperature range of −40 °C to 100 °C.
Key Features
- Core Architecture HyperFlex® core architecture derived from the Stratix 10 TX family, delivering significant core performance improvements over prior-generation architectures.
- Logic Capacity 2,100,000 logic elements (LEs) suitable for large-scale logic integration and complex design implementations.
- Embedded Memory 133,169,152 total RAM bits for on-chip buffering, state storage, and memory-intensive processing.
- High-Speed I/O and Transceivers 440 general-purpose I/O pins and heterogeneous transceiver tiles described in the Stratix 10 TX family for high-bandwidth chip-to-chip, chip-to-module, and backplane connectivity.
- Packaging and Mounting 2397-BBGA, FCBGA package (supplier device package listed as 2397-FBGA, FC 50×50); surface-mount mounting type for board-level integration.
- Power and Operating Range Supply voltage range of 820 mV to 880 mV and an industrial operating temperature range of −40 °C to 100 °C.
- System Integration Family-level features include hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks and an embedded quad-core 64-bit Arm Cortex‑A53 Hard Processor System (HPS) available in select devices.
- Standards and Compliance RoHS compliant.
Typical Applications
- High-Speed Networking and Switching Use for packet processing, line cards, and switch fabrics where large logic capacity and high aggregate transceiver bandwidth are required.
- Telecommunications Infrastructure Suitable for backplane and module-level transceiver applications leveraging the family’s PAM4 and NRZ transceiver capabilities and hardened Ethernet MAC IP.
- Compute and Acceleration FPGA-based hardware acceleration and custom datapath implementations that benefit from extensive logic elements and large on-chip RAM.
- Embedded Processing Systems Designs that combine programmable fabric with optional embedded quad-core Cortex‑A53 HPS for application-class processing and control.
Unique Advantages
- Large Programmable Fabric: 2,100,000 logic elements enable integration of complex custom logic, protocol stacks, and datapaths on a single device.
- Significant On-Chip Memory: 133,169,152 bits of RAM reduce dependence on external memory for buffering and stateful functions.
- Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in demanding environments.
- Advanced Packaging: 2397-BBGA/FCBGA packaging with surface-mount mounting supports high-density board integration and signal routing for high-pin-count designs.
- Integrated System IP (Family-Level): Availability of hardened PCIe Gen3 and high-speed Ethernet MACs in the Stratix 10 TX family supports common high-bandwidth interfaces directly in silicon.
- RoHS Compliant: Conforms to RoHS requirements for lead-free designs.
Why Choose 1ST210EU2F50I2LG?
The 1ST210EU2F50I2LG positions itself as a high-capacity, industrial-grade FPGA option within the Stratix 10 TX family, combining 2.1 million logic elements, substantial on-chip RAM, and 440 I/O to address complex, high-throughput system designs. Its operational voltage window and industrial temperature rating make it suitable for robust deployments where environmental range and electrical characteristics are defined design constraints.
This device is appropriate for engineering teams building high-performance networking, telecom, compute acceleration, or embedded processing solutions that require a monolithic FPGA fabric, advanced core architecture, and family-level support for hardened interface IP.
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