1ST210EU1F50I1VG

The 1ST210EU1F50I1VG is a Stratix® 10 TX field programmable gate array (FPGA) device featuring Intel's HyperFlex core architecture and high-performance transceiver capabilities. It targets applications that require very large logic and memory resources alongside high-speed serial connectivity.

With 2,100,000 logic elements, 133,169,152 bits of internal RAM, and dual-mode high-speed transceivers, this device is suited for demanding communications, data-center, and signal-processing designs that need integrated hardened IP and a compact BGA package.

Key Features

• Core & architecture – Intel HyperFlex core architecture and 14 nm tri-gate (FinFET) technology delivering increased core performance as documented for Stratix® 10 TX devices.
• Logic capacity – 2,100,000 logic elements to implement large, complex FPGA designs.
• On-chip memory – Total RAM capacity of 133,169,152 bits, supported by internal M20K memory block architecture as described for the series.
• High-speed transceivers – Dual-mode transceivers supporting PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps for chip-to-chip, module, and backplane links.
• Hardened connectivity IP – Series-level support for PCI Express Gen3 hard IP and 10/25/100 Gbps Ethernet MACs with dedicated Reed-Solomon FEC.
• DSP and processing – Variable-precision DSP blocks and hardened floating-point DSP resources noted in the Stratix® 10 TX family; a quad-core 64-bit Arm Cortex‑A53 hard processor system is available in select devices.
• I/O and package – 440 I/O pins in a 2397-BBGA FCBGA package (supplier device package: 2397-FBGA, FC 50×50); surface-mount device.
• Power and thermal – Core voltage supply range of 770 mV to 970 mV and an operating temperature range of −40 °C to 100 °C; device is graded Industrial and RoHS compliant.
• Advanced packaging – Family-level implementation includes heterogeneous 3D SiP transceiver tiles and EMIB-based packaging technologies for high aggregate bandwidth.

Typical Applications

• Telecommunications & networking – Implement high-density line cards, switches, and routers using the device’s high-speed PAM4/NRZ transceivers and hardened Ethernet MACs.
• Data center interconnects & switch fabrics – Support 10/25/100 GbE and PCIe connectivity while leveraging large logic and memory resources for packet processing and buffering.
• High-performance signal processing – Use extensive DSP resources and large internal RAM for modulation, FEC, and real-time processing pipelines.
• Test, measurement & optical modules – Integrate high-speed serial links and complex logic for protocol analysis, bit-error-rate testing, and optical module control.

Unique Advantages

• Highly integrated solution: Monolithic core fabric combined with heterogeneous transceiver tiles reduces external component needs and simplifies system integration.
• Large on-chip resources: 2,100,000 logic elements and 133,169,152 bits of RAM provide headroom for complex algorithms and high-channel-count designs.
• Flexible high-speed I/O: Dual-mode transceivers supporting PAM4 and NRZ data rates enable versatile link implementation across chip-to-chip, module, and backplane applications.
• Hardened protocol IP: Integrated PCIe Gen3 and multi-rate Ethernet MACs with FEC reduce design risk and accelerate time to market for connectivity-focused products.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in a wide range of environmental conditions.
• Power-scalable operation: Core supply range of 770 mV to 970 mV enables designs to tune power/performance trade-offs.

Why Choose 1ST210EU1F50I1VG?

The 1ST210EU1F50I1VG brings together a very large logic footprint, substantial on-chip memory, and high-performance dual-mode transceivers in a single industrial-grade package. It is positioned for system designs that require integrated high-bandwidth connectivity, extensive signal-processing resources, and hardened protocol building blocks.

This device is well suited for engineering teams developing communications infrastructure, data-center switching, and high-performance signal-processing systems that need scalability, robust operating-range specifications, and access to the Stratix® 10 TX family-level capabilities.

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