1ST165EU3F50I3XG

The 1ST165EU3F50I3XG is an Intel Stratix® 10 TX field-programmable gate array in a 2397-BBGA FCBGA package, rated for industrial operation. This device integrates 1,650,000 logic elements, 119,537,664 bits of on-chip RAM and 440 user I/O in a surface-mount 2397-FBGA (50×50) footprint.

As part of the Stratix 10 TX family, the device leverages the Intel Hyperflex® core architecture and Intel 14 nm tri-gate (FinFET) process, and is designed for high-bandwidth, low-voltage operation (820 mV to 880 mV). Family-level innovations include dual-mode high-speed transceivers, hardened PCI Express and Ethernet MAC IP blocks, heterogeneous 3D SiP packaging, and options for embedded processing in select devices.

Key Features

• Core and Fabric  Hyperflex® core architecture on Intel 14 nm tri-gate (FinFET) technology; the device provides 1,650,000 logic elements for large-scale programmable logic implementations.
• On-Chip Memory  119,537,664 total RAM bits of internal memory to support data buffering, large lookup tables, and state storage.
• High-Speed Transceivers (family feature)  Stratix 10 TX devices support dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation, addressing chip-to-chip, module and backplane interfaces.
• Hardened Interfaces (family feature)  Hardened PCI Express Gen3 IP and 10/25/100 Gbps Ethernet MAC blocks with Reed-Solomon FEC are available in the device family for reliable host and network connectivity.
• DSP and Compute  Hardened floating-point DSP blocks and variable-precision DSP architecture described in the family overview support signal processing and compute-accelerated workloads.
• Package and I/O  2397-BBGA FCBGA package (supplier package: 2397-FBGA, FC 50×50), 440 user I/O, and surface-mount assembly for high-density board integration.
• Power and Thermal  Core supply operation between 820 mV and 880 mV; industrial operating temperature range from −40 °C to 100 °C to support demanding environments.
• Configuration and Reliability (family feature)  Device-level support for Secure Device Manager (SDM), partial and dynamic reconfiguration, and single event upset (SEU) detection and correction mechanisms are included in the Stratix 10 TX device family.
• Compliance  RoHS compliant.

Typical Applications

• High‑performance networking  Use the device to implement switching, routing and packet-processing functions that require large logic capacity and high-speed transceiver interfaces.
• Data center acceleration  Leverage the large logic and memory resources for hardware acceleration tasks such as compression, encryption, or custom compute engines.
• Telecommunications and transport  Deploy in optical and backplane systems where dual-mode transceivers and hardened Ethernet/PCIe IP support high-bandwidth links and error-corrected transport.
• Advanced signal processing  Implement variable-precision DSP pipelines and floating-point operations for radar, test equipment, and real-time processing applications.

Unique Advantages

• Large programmable fabric: 1,650,000 logic elements enable complex custom logic, high-degree parallelism and integration of multiple subsystems on a single device.
• Substantial on-chip memory: 119,537,664 bits of internal RAM reduce external memory dependence and improve system-level performance for buffering and stateful processing.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in industrial and harsh environments without derating core functionality.
• High-density I/O and package: 440 I/O in a 2397-BBGA FCBGA package (50×50) facilitates dense board-level integration for compact systems.
• Family-level high-speed connectivity: Dual-mode transceivers and hardened interface IP in the Stratix 10 TX family simplify design of multi‑Gbps links and reduce integration overhead.
• Low-voltage core operation: 820 mV–880 mV supply range supports efficient power delivery and helps align system power budgets.

Why Choose 1ST165EU3F50I3XG?

The 1ST165EU3F50I3XG combines a large programmable fabric, extensive on-chip memory and high-density I/O in an industrial-grade FCBGA package, making it suitable for demanding networking, compute acceleration and signal-processing designs. Built on the Stratix 10 TX family architecture, it benefits from Hyperflex core innovations, advanced packaging and family-level support for hardened transceivers and interface IP.

This device is targeted at designers who require high logic capacity and memory for integrated systems, need robust industrial temperature performance, and want access to a device family that provides advanced connectivity and configuration features. The combination of resources helps reduce external component count and supports scalable system evolution.

If you would like pricing, availability or to request a formal quote for 1ST165EU3F50I3XG, submit a request to our sales team and our specialists will respond with a tailored quotation and lead-time information.