1ST165EU2F50I1VG

The 1ST165EU2F50I1VG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) offered in a 2397-BBGA FCBGA package. This industrial-grade device integrates a high-density FPGA fabric with up to 1,650,000 logic elements and 119,537,664 bits of on-chip RAM, making it suitable for demanding, high-performance system designs.

As part of the Stratix 10 TX family, the device leverages the Intel HyperFlex core architecture and family-level innovations such as dual-mode high-speed transceivers and hardened IP for high-bandwidth applications, delivering a balance of performance, integration, and power efficiency for data-center, communications, and advanced processing systems.

Key Features

• Core Capacity  1,650,000 logic elements enabling large, complex digital designs and high-density logic implementation.
• On-Chip Memory  119,537,664 total RAM bits for deep buffering, high-performance lookup tables, and embedded storage.
• I/O  440 I/O pins to support extensive external connectivity and high-pin-count system interfaces.
• Package & Mounting  2397-BBGA (FCBGA) package, supplier package 2397-FBGA, FC (50 × 50), designed for surface-mount assembly.
• Voltage Range  Core voltage supply range from 770 mV to 970 mV to match system power rails and design constraints.
• Operating Range & Grade  Industrial grade with an operating temperature range of −40°C to 100°C for robust performance across challenging environments.
• Standards & Compliance  RoHS compliant to meet environmental and regulatory requirements.
• Stratix 10 TX Family Innovations  Family-level features include the Intel HyperFlex core architecture, 14 nm Tri-Gate technology, heterogeneous 3D SiP transceiver tiles, hardened PCI Express Gen3 and Ethernet MAC IP blocks, and variable precision DSP blocks (family-level capabilities as described in the device overview).

Typical Applications

• High-bandwidth Networking Equipment  Ideal for switches, routers, and line cards that require large programmable logic capacity and extensive I/O for packet processing and interface aggregation.
• Data Center Accelerators  Suited for computational acceleration and offload functions that need significant logic and on-chip memory for buffering and algorithm implementation.
• Backplane and Chip-to-Chip Interfaces  Applicable in systems requiring high-speed links and large logical resources for protocol handling and signal management.
• Advanced Signal Processing  Useful for applications leveraging large DSP and memory resources for real-time processing and complex algorithm deployment.

Unique Advantages

• High Logic Density:  1,650,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Large Embedded RAM:  119,537,664 on-chip RAM bits support deep buffering and complex state machines without relying solely on external memory.
• Broad I/O Count:  440 I/O pins facilitate wide external connectivity and flexible interface options for complex system topologies.
• Industrial Temperature Rating:  −40°C to 100°C operation supports deployment in industrial and demanding thermal environments.
• Compact High-Density Package:  2397-BBGA FCBGA package (50 × 50 supplier footprint) provides a compact solution for high-pin-count implementations.
• Family-Level Performance Innovations:  Stratix 10 TX family features—such as HyperFlex architecture and high-speed transceiver technology—provide a proven platform for high-bandwidth, low-latency system designs.

Why Choose 1ST165EU2F50I1VG?

This Stratix 10 TX device combines very large programmable logic capacity, substantial on-chip memory, and high I/O density in an industrial-grade package, positioning it for complex, performance-driven designs. It is well suited to engineers and system architects building high-bandwidth networking equipment, compute accelerators, and advanced signal-processing platforms that require scalable logic resources and robust thermal operation.

Choosing the 1ST165EU2F50I1VG gives you access to the Stratix 10 TX family capabilities—such as HyperFlex core architecture and family-level transceiver and hardened IP innovations—while relying on verifiable electrical and environmental specifications for system integration and long-term deployment.

Request a quote or submit a pricing and availability inquiry to get product-specific pricing, lead time, and technical support information for the 1ST165EU2F50I1VG.