1ST165EU2F50E1VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 1650000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 1,345 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 206250 | Number of Logic Elements/Cells | 1650000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 119537664 |
Overview of 1ST165EU2F50E1VG – Stratix® 10 TX FPGA, 1,650,000 logic elements, 440 I/O, 2397-BBGA
The 1ST165EU2F50E1VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) IC in a 2397-BBGA FCBGA package. It provides 1,650,000 logic elements, 119,537,664 bits of on-chip RAM and 440 I/O for high-density programmable logic applications.
As part of the Stratix 10 TX family, this device targets high-bandwidth, power-sensitive system designs with advanced core architecture and heterogeneous packaging innovations documented for the series.
Key Features
- High Logic Capacity 1,650,000 logic elements suitable for large, complex FPGA designs and dense custom logic implementations.
- Large On‑Chip Memory 119,537,664 total RAM bits to support large buffers, frame storage, and on-chip data processing.
- Extensive I/O 440 I/O pins for broad external connectivity and flexible interface routing in I/O‑heavy systems.
- Advanced Series Architecture Stratix 10 TX series innovations, including Intel HyperFlex core architecture and high‑speed transceiver technology, are part of the device family documentation.
- High‑Speed Transceiver Capability (Series) Stratix 10 TX devices support dual‑mode transceivers capable of PAM4 (57.8 Gbps) and NRZ (28.9 Gbps) operation as described for the family.
- Package and Mounting 2397‑BBGA (FCBGA) package, surface mount construction, supplier package 2397‑FBGA (50×50).
- Power and Temperature Nominal core voltage range 770 mV to 970 mV; operating temperature range 0 °C to 100 °C; device grade: Extended.
- Scalable Fabric and IP (Series) Series documentation describes hardened PCIe Gen3 and Ethernet MAC IP blocks and other hardened functions available across the Stratix 10 TX family.
Typical Applications
- High‑Bandwidth Networking Implements backplane, chip‑to‑module, and data center networking functions that leverage the series’ high-speed transceiver capabilities and large logic/memory resources.
- Data Center and Telecom Builds packet processing, protocol offload, and linecard functions using the large logic capacity and substantial on‑chip RAM.
- PCIe‑Based Systems Enables FPGA‑accelerated I/O and custom PCI Express Gen3 interface implementations as described for the Stratix 10 TX family.
- High‑Performance Compute Acceleration Supports compute offload and DSP‑heavy workloads when leveraging the family’s advanced core architecture and memory resources.
Unique Advantages
- Large Logic and Memory Footprint: 1,650,000 logic elements and 119,537,664 RAM bits allow consolidation of larger designs onto a single device, reducing board complexity.
- Broad I/O Support: 440 I/O pins provide flexible connectivity for multi‑lane interfaces, multiple memory channels or heterogeneous board-level integration.
- Family‑Level High‑Speed I/O: Stratix 10 TX series transceiver capabilities support both PAM4 and NRZ modes, enabling scalable, high-bandwidth links (series documentation).
- Robust Packaging: 2397‑BBGA FCBGA surface‑mount package supports high pin count and thermal management for dense system designs.
- Designed for Demanding Systems: Extended grade operation (0 °C to 100 °C) and a defined core voltage window support deployment in constrained power and thermal environments.
Why Choose 1ST165EU2F50E1VG?
The 1ST165EU2F50E1VG combines very large programmable logic resources, substantial on-chip RAM, and a high I/O count in a single 2397‑BBGA package. As a member of the Stratix 10 TX family, it aligns with a documented platform that emphasizes high core performance, high‑speed transceivers, and advanced packaging innovations for next‑generation bandwidth and compute demands.
This device is suited to engineers and system designers who need to consolidate complex logic, large buffering, and high-speed interfaces into a single FPGA solution while benefiting from the family’s architectural features and documented IP options.
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