1ST165EU1F50E2VG

The 1ST165EU1F50E2VG is an Intel Stratix® 10 TX field programmable gate array supplied in a 2397-BBGA (FCBGA) package. It combines a high-density programmable fabric with advanced transceiver and system-level features to address bandwidth- and compute-intensive designs.

Designed for applications requiring large logic capacity, substantial on-chip RAM, and high I/O count, this device offers extensive integration for networking, communications, and high-performance signal processing systems while operating from a 0 °C to 100 °C temperature window.

Key Features

• Core Fabric  1,650,000 logic elements provide large programmable capacity for complex logic and control functions.
• On‑Chip Memory  119,537,664 total RAM bits enable deep buffering and local data storage for high-throughput designs.
• High-Speed I/O  440 I/O pins support extensive external connectivity for multi-channel interfaces and board-level integration.
• Transceiver Technology (Series Capability)  Stratix 10 TX devices include dual‑mode transceivers capable of PAM4 and NRZ operation for high bandwidth links (series-level feature described in the device overview).
• DSP and Hard IP (Series Capability)  Hardened DSP blocks and hardened PCI Express and Ethernet MAC IP are included in the Stratix 10 TX family for efficient signal processing and accelerated protocol handling (series-level features).
• Power and Voltage  Core supply range specified at 770 mV to 970 mV to match the device power architecture.
• Package and Mounting  2397-BBGA (FCBGA) flip-chip BGA package; surface mount mounting type suitable for dense system assemblies.
• Operating Range  Rated for 0 °C to 100 °C operation with RoHS compliance.
• Security and Configuration (Series Capability)  Features in the Stratix 10 TX overview include secure device management and configuration options, as well as support for partial and dynamic reconfiguration (series-level features).

Typical Applications

• Telecommunications and Networking  High logic density, large on-chip RAM, and family transceiver capabilities suit packet processing, switch/router line cards, and backplane interface applications.
• Data Center and High‑Performance Compute  Large fabric capacity and hardened IP options enable acceleration, protocol offload, and aggregation tasks in rack and module designs.
• Test & Measurement  Extensive I/O and deep local memory support complex real‑time data capture, processing, and instrument control.
• Advanced Signal Processing  On‑die RAM and DSP resources in the Stratix 10 TX family support demanding digital signal processing and multi-channel data pipelines.

Unique Advantages

• Large Programmable Capacity:  1,650,000 logic elements provide the headroom to implement complex control, pipeline, and compute architectures on a single device.
• High Local Memory:  119,537,664 bits of on-chip RAM reduce dependency on external memory and improve throughput for buffering and streaming workloads.
• Broad I/O Count:  440 I/O pins allow dense external connectivity, simplifying board-level integration for multi-channel systems.
• Advanced Packaging:  2397-BBGA FCBGA flip-chip package supports tight routing and high-density system integration in space-constrained designs.
• Series-Level High-Speed Features:  Stratix 10 TX family transceiver and hardened IP capabilities provide a path to integrate high-bandwidth links and protocol offload into system designs.
• Controlled Power Envelope:  Specified core voltage range (770 mV–970 mV) aligns with high-performance FPGA power architectures for predictable supply design.

Why Choose 1ST165EU1F50E2VG?

The 1ST165EU1F50E2VG delivers substantial programmable resources, large on‑chip RAM, and a high I/O count in a 2397-BBGA package, making it well suited to demanding communications, data center, and signal processing applications. Its placement within the Stratix 10 TX family means it benefits from the series’ advanced transceiver, DSP, and hardened IP capabilities documented in the device overview.

For designers targeting scalable, high-throughput systems, this device provides a combination of integration and capacity that helps reduce board-level complexity and supports rigorous system-level requirements while operating in a 0 °C to 100 °C environment.

Request a quote or submit a sourcing inquiry for pricing and availability of the 1ST165EU1F50E2VG. Our team can provide lead-time information and support for your design evaluation needs.