1ST165EU1F50E2LG

The 1ST165EU1F50E2LG is a Stratix 10 TX FPGA offering 1,650,000 logic elements and 119,537,664 bits of internal RAM in a high-density 2397-BBGA FCBGA package. It provides 440 general-purpose I/O in a surface-mount package, is graded Extended (0 °C to 100 °C), and is RoHS compliant.

As part of the Intel Stratix 10 TX device family, this FPGA leverages the HyperFlex® core architecture and heterogeneous 3D SiP packaging innovations to address high-bandwidth, low-latency system designs. The Stratix 10 TX family features dual‑mode transceivers and hardened I/O IP blocks to meet demanding transceiver bandwidth and integration requirements.

Key Features

• Core Architecture  HyperFlex® core architecture (Stratix 10 TX family) designed to increase core performance compared to previous-generation architectures.
• Logic Capacity  1,650,000 logic elements for complex programmable logic and custom acceleration.
• On‑Chip Memory  119,537,664 total RAM bits to support large buffering, state machines, and on‑chip data storage.
• I/O Count  440 I/O pins to support wide external interfacing and multi‑lane connectivity.
• High‑Speed Transceivers (Family)  Stratix 10 TX devices include dual‑mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip‑to‑chip, chip‑to‑module, and backplane links.
• Hardened IP (Family)  Family-level hardened IP includes PCI Express Gen3 and high‑speed Ethernet MACs with FEC options for common protocol offload.
• Package & Mounting  2397-BBGA, FCBGA package; supplier device package listed as 2397-FBGA, FC (50x50). Surface-mount mounting type.
• Power & Voltage  Core voltage supply range: 820 mV to 880 mV to support the device’s power architecture.
• Temperature & Grade  Extended grade operation from 0 °C to 100 °C for deployment across a wide set of environments.
• Regulatory  RoHS compliant.

Typical Applications

• High‑Bandwidth Networking  Backplane and line-card designs where high transceiver bandwidth and large programmable logic resources are required.
• Data Center Switches & Routers  Protocol acceleration and packet processing using large logic capacity and on‑chip memory.
• Interconnect & SerDes Applications  Chip‑to‑chip, chip‑to‑module, and backplane SerDes links leveraging the family’s dual‑mode transceivers.
• Compute Acceleration  Custom accelerators and FPGA-based offload engines that require high logic density and substantial on‑chip RAM.

Unique Advantages

• High logic and memory density: 1,650,000 logic elements and 119,537,664 bits of RAM enable integration of large, complex designs with reduced external component requirements.
• Built for high-speed connectivity: Family-level dual‑mode transceivers and hardened Ethernet/PCIe IP simplify high‑bandwidth interface implementation.
• Compact, high‑I/O package: 2397-BBGA (supplier: 2397-FBGA, FC (50x50)) surface‑mount package supports 440 I/O while minimizing board space.
• Power‑oriented core supply: Narrow core voltage range (820 mV–880 mV) aligning with modern low‑power FPGA architectures.
• Extended operational range and compliance: Extended grade operation (0 °C–100 °C) and RoHS compliance support deployment across varied environments.

Why Choose 1ST165EU1F50E2LG?

The 1ST165EU1F50E2LG combines high logic capacity, substantial on‑chip memory, and a large I/O count in a compact BGA package, making it suitable for designers building bandwidth‑intensive, logic‑heavy systems. As a member of the Intel Stratix 10 TX family, it benefits from family-level innovations such as the HyperFlex® core architecture and high‑speed transceiver capability, enabling integration of complex protocol processing and high‑throughput data paths.

This device is appropriate for engineering teams targeting scalable FPGA solutions for networking, data center, interconnect, and acceleration applications that require a balance of logic density, high‑speed I/O, and platform-level documentation.

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