1ST110ES3F50E3XG

The 1ST110ES3F50E3XG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) in a 2397-BBGA FCBGA package. It combines a large programmable-logic capacity with substantial on-chip RAM and a high I/O count for dense, configurable system designs.

Key attributes provided by the device include 1,325,000 logic elements, 112,197,632 total RAM bits, and 440 I/O pins, along with surface-mount packaging and an extended-grade operating range.

Key Features

• Core Logic  1,325,000 logic elements (cells) for large-scale programmable logic implementations.
• On-Chip Memory  112,197,632 total RAM bits to support memory-intensive functions and buffering on the FPGA fabric.
• I/O Resources  440 I/O pins to support extensive board-level interfacing and parallel connectivity requirements.
• Power  Specified core supply voltage range of 870 mV to 970 mV for device operation.
• Package and Mounting  2397-BBGA, FCBGA package (supplier device package 2397-FBGA, FC 50×50) with surface-mount mounting for high-density PCB integration.
• Grade and Temperature  Extended grade with an operating temperature range of 0°C to 100°C for applications within that thermal window.
• Environmental Compliance  RoHS compliant to meet common lead-free requirements.

Typical Applications

• High-density logic designs  Systems that require vast programmable logic capacity can leverage the device’s 1,325,000 logic elements to implement complex logic and state machines.
• Memory-intensive processing  Designs needing significant on-chip storage can use the 112,197,632 RAM bits for buffering, lookup tables, or temporary data storage.
• High-pin-count interfacing  Boards requiring extensive external connectivity can utilize the 440 I/O pins for parallel interfaces, multi-channel I/O, and diverse signaling.
• Compact, board-mounted FPGA solutions  The 2397-BBGA FCBGA surface-mount package supports dense PCB layouts where a high-pin-count, compact package is required.

Unique Advantages

• Extensive programmable capacity: 1,325,000 logic elements provide room for large, complex designs without immediate device scaling.
• Large on-chip RAM: 112,197,632 total RAM bits reduce dependence on external memory for many buffering and data-path needs.
• Broad I/O complement: 440 I/O pins enable extensive external connectivity and support for multi-channel interfaces.
• Compact high-pin-count package: 2397-BBGA, FCBGA (2397-FBGA, FC 50×50) delivers high density in a surface-mount form factor suitable for space-constrained boards.
• Defined power envelope: Core voltage range of 870 mV to 970 mV allows designers to plan power delivery and sequencing around specified supply requirements.
• Extended-grade and RoHS compliant: Rated for 0°C to 100°C operation and RoHS compliant to meet environmental and extended operating-range needs.

Why Choose 1ST110ES3F50E3XG?

The 1ST110ES3F50E3XG positions itself as a large-capacity Stratix® 10 TX FPGA option for designs that require a combination of extensive logic resources, significant on-chip memory, and a high I/O count in a compact surface-mount package. Its extended-grade rating and clear supply and temperature specifications help engineering teams design to known constraints.

This device is suited for customers who need scalability within a single FPGA footprint and who prioritize on-chip RAM and I/O density. Its package and mounting characteristics support integration into dense PCB layouts, while RoHS compliance addresses common environmental requirements.

Request a quote or submit an inquiry to obtain pricing, lead-time, and availability for the 1ST110ES3F50E3XG. Our team can assist with ordering and technical details to support your design needs.