1ST165EU1F50E1VG

The 1ST165EU1F50E1VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2397‑BBGA FCBGA package designed for high-bandwidth, system-level integration. This device leverages the Stratix 10 TX architecture — including the Intel HyperFlex™ core architecture and high-speed transceiver technology — to address demanding communications and data-center oriented applications.

With 1,650,000 logic elements, 119,537,664 bits of on-chip RAM, and 440 user I/Os, the device targets systems that require large programmable fabric, substantial embedded memory, and extensive I/O connectivity while operating across a 0 °C to 100 °C range and a core voltage supply of 770 mV to 970 mV.

Key Features

• Core Architecture Intel HyperFlex™ core architecture as described for Stratix 10 TX devices, providing the series-level performance and routing innovations documented in the device family overview.
• Logic Density 1,650,000 logic elements (LEs) for complex digital designs and large-scale programmable logic integration.
• On-Chip Memory 119,537,664 total RAM bits, including internal memory block structures such as M20K blocks referenced in the device family documentation.
• High-Speed I/O 440 user I/Os to support broad system interfacing and high-pin-count designs in the 2397‑BBGA package.
• Dual-Mode Transceivers (Series Feature) Stratix 10 TX devices include dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip-to-chip, chip-to-module, and backplane links as described in the product overview.
• Hardened Protocol IP (Series Feature) Series-level support includes hardened PCI Express Gen3 IP and 10/25/100 GbE MAC options with Reed‑Solomon FEC as described in the device family documentation.
• Power and Voltage Core supply operating range specified from 770 mV to 970 mV to match system power-delivery designs.
• Package and Mounting 2397-BBGA (FCBGA) supplier device package 2397-FBGA, FC (50×50), surface-mount package optimized for high-pin-count board designs.
• Operating Conditions Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.

Typical Applications

• High‑Speed Networking Equipment Use in switches, routers, and line cards that require programmable packet processing, large logic capacity, and high‑rate transceiver links.
• Data Center Interconnects Suitable for accelerator front-ends, host interfaces, and fabric aggregation where dense logic, ample on-chip RAM, and multi‑lane high-speed links are required.
• Backplane and Chip-to‑Module Links Built for backplane and chip-to-module connectivity leveraging the Stratix 10 TX dual‑mode transceivers and high I/O count.

Unique Advantages

• Large Programmable Fabric: 1,650,000 logic elements provide the capacity to consolidate multiple system functions into a single FPGA.
• Substantial On‑Chip Memory: 119,537,664 bits of RAM reduce external memory dependency for buffering and on‑device data processing.
• High I/O Count in a Compact Package: 440 I/Os in a 2397‑BBGA surface‑mount package support dense board-level integration and high connectivity.
• High‑Speed Transceiver Capability (Series): Dual‑mode transceivers at PAM4 and NRZ data rates enable next‑generation link architectures as described in the Stratix 10 TX family overview.
• Extended Operating Range: Specified 0 °C to 100 °C operating temperature and RoHS compliance for broad deployment scenarios.
• Power‑Supply Specification: Defined core supply range (770 mV–970 mV) helps align power‑delivery planning with device requirements.

Why Choose 1ST165EU1F50E1VG?

The 1ST165EU1F50E1VG combines high logic density, large embedded RAM, and substantial I/O in a high‑pin‑count FCBGA package to support complex, high‑bandwidth system designs. As part of the Stratix 10 TX family, it benefits from the series' HyperFlex architecture and high‑speed transceiver technology, making it suitable for networking, data center interconnect, and backplane applications that require programmable flexibility and on‑device memory.

This extended‑grade, RoHS‑compliant device is positioned for engineers who need scalable programmable fabric, extensive on‑chip resources, and defined operating and supply constraints for reliable system integration.

Request a quote or contact sales to discuss pricing, availability, and how the 1ST165EU1F50E1VG can fit into your next high‑performance design.